Micron Technology Inc. MTFC4GMUEA-WT
- Part Number:
- MTFC4GMUEA-WT
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 3244816-MTFC4GMUEA-WT
- Description:
- IC FLASH 32GBIT 153WFBGA
- Datasheet:
- MTFC4GMUEA-WT
Micron Technology Inc. MTFC4GMUEA-WT technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MTFC4GMUEA-WT.
- Mounting TypeSurface Mount
- Package / Case153-WFBGA
- Number of Pins153
- Supplier Device Package153-WFBGA (11.5x13)
- Operating Temperature-25°C~85°C TA
- PackagingTray
- Published2013
- Seriese•MMC™
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Max Operating Temperature85°C
- Min Operating Temperature-25°C
- TechnologyFLASH - NAND
- Voltage - Supply2.7V~3.6V
- InterfaceMMC
- Memory Size32Gb 4G x 8
- Memory TypeNon-Volatile
- Memory FormatFLASH
- Memory InterfaceMMC
- RoHS StatusROHS3 Compliant
MTFC4GMUEA-WT Overview
The mounting type for this electronic component is surface mount, meaning it is designed to be attached directly onto a circuit board. The package or case of this component is a 153-WFBGA, which stands for 153-ball wafer-level chip scale package. This package has 153 pins, allowing for multiple connections and functions. The supplier device package is also a 153-WFBGA, specifically measuring 11.5x13 millimeters. This component belongs to the e•MMC™ series, a type of embedded multimedia card used for storage and data transfer. However, it is important to note that this particular component is now obsolete, meaning it is no longer being produced. It has a moisture sensitivity level of 3, indicating that it can withstand 168 hours of exposure to moisture. The technology used in this component is FLASH - NAND, a type of non-volatile memory. It is designed to interface with MMC, or multimedia cards, making it suitable for use in a variety of devices.
MTFC4GMUEA-WT Features
Package / Case: 153-WFBGA
153 Pins
MTFC4GMUEA-WT Applications
There are a lot of Micron Technology Inc.
MTFC4GMUEA-WT Memory applications.
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
The mounting type for this electronic component is surface mount, meaning it is designed to be attached directly onto a circuit board. The package or case of this component is a 153-WFBGA, which stands for 153-ball wafer-level chip scale package. This package has 153 pins, allowing for multiple connections and functions. The supplier device package is also a 153-WFBGA, specifically measuring 11.5x13 millimeters. This component belongs to the e•MMC™ series, a type of embedded multimedia card used for storage and data transfer. However, it is important to note that this particular component is now obsolete, meaning it is no longer being produced. It has a moisture sensitivity level of 3, indicating that it can withstand 168 hours of exposure to moisture. The technology used in this component is FLASH - NAND, a type of non-volatile memory. It is designed to interface with MMC, or multimedia cards, making it suitable for use in a variety of devices.
MTFC4GMUEA-WT Features
Package / Case: 153-WFBGA
153 Pins
MTFC4GMUEA-WT Applications
There are a lot of Micron Technology Inc.
MTFC4GMUEA-WT Memory applications.
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
MTFC4GMUEA-WT More Descriptions
IC Flash 32G Mmc 153WFBGA Emmc
J54K 4GX8 MCP PLASTIC WIRELESS TEMP PBF WFBGA 3.3V
IC EEPROM 64KBIT 400KHZ 8TSSOP
J54K 4GX8 MCP PLASTIC WIRELESS TEMP PBF WFBGA 3.3V
IC EEPROM 64KBIT 400KHZ 8TSSOP
The three parts on the right have similar specifications to MTFC4GMUEA-WT.
-
ImagePart NumberManufacturerMounting TypePackage / CaseNumber of PinsSupplier Device PackageOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Max Operating TemperatureMin Operating TemperatureTechnologyVoltage - SupplyInterfaceMemory SizeMemory TypeMemory FormatMemory InterfaceRoHS StatusSurface MountJESD-609 CodeNumber of TerminationsTerminal FinishAdditional FeatureHTS CodeTerminal PositionPeak Reflow Temperature (Cel)Terminal PitchTime@Peak Reflow Temperature-Max (s)JESD-30 CodeExternal Data Bus WidthHost Data Transfer Rate-MaxLengthHeight Seated (Max)WidthFactory Lead TimeView Compare
-
MTFC4GMUEA-WTSurface Mount153-WFBGA153153-WFBGA (11.5x13)-25°C~85°C TATray2013e•MMC™Obsolete3 (168 Hours)85°C-25°CFLASH - NAND2.7V~3.6VMMC32Gb 4G x 8Non-VolatileFLASHMMCROHS3 Compliant------------------
-
Surface Mount153-VFBGA---25°C~85°C TATray-e•MMC™Not For New Designs3 (168 Hours)--FLASH - NAND1.7V~1.9V-128Gb 16G x 8Non-VolatileFLASHMMCROHS3 CompliantYESe1153TIN SILVER COPPERIT ALSO OPERATES AT 2.7V TO 3.6 V8542.31.00.01BOTTOM2600.5mm30R-PBGA-B1538250 MBps13mm1mm11.5mm-
-
-----Tape & Reel (TR)--Active---------------------------6 Weeks
-
-----25°C~85°C TATape & Reel (TR)-e•MMC™Obsolete1 (Unlimited)--FLASH - NAND--256Gb 32G x 8Non-VolatileFLASHMMC------------------
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