Micron Technology Inc. MT29F2G08ABAEAWP:E
- Part Number:
- MT29F2G08ABAEAWP:E
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 3720256-MT29F2G08ABAEAWP:E
- Description:
- IC FLASH 2GBIT 48TSOP
- Datasheet:
- MT29F2G08ABAEAWP:E
Micron Technology Inc. MT29F2G08ABAEAWP:E technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT29F2G08ABAEAWP:E.
- Factory Lead Time6 Weeks
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case48-TFSOP (0.724, 18.40mm Width)
- Number of Pins48
- Operating Temperature0°C~70°C TA
- PackagingBulk
- Published2010
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations48
- ECCN Code3A991.B.1.A
- HTS Code8542.32.00.51
- TechnologyFLASH - NAND
- Voltage - Supply2.7V~3.6V
- Terminal PositionDUAL
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch0.5mm
- Base Part NumberMT29F2G08
- Operating Supply Voltage3.3V
- Voltage3.3V
- Memory Size2Gb 256M x 8
- Nominal Supply Current35mA
- Memory TypeNon-Volatile
- Memory FormatFLASH
- Memory InterfaceParallel
- Organization256MX8
- Memory Width8
- Address Bus Width29b
- Density2 Gb
- Standby Current-Max0.0001A
- Access Time (Max)25 ns
- Sync/AsyncAsynchronous
- Word Size8b
- Data PollingNO
- Toggle BitNO
- Command User InterfaceYES
- Number of Sectors/Size2K
- Sector Size128K
- Page Size2kB
- Ready/BusyYES
- Ambient Temperature Range High70°C
- Height1.2mm
- Length18.4mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
MT29F2G08ABAEAWP:E Overview
The 48-TFSOP (0.724, 18.40mm Width) package is a popular choice in the electronics industry due to its compact size and versatility. With a total of 48 pins, this package offers a wide range of applications and is commonly used in bulk packaging. It has a moisture sensitivity level (MSL) of 3, meaning it can withstand up to 168 hours of exposure to moisture. This particular package utilizes FLASH technology, specifically NAND, and has a memory size of 2Gb 256M x 8. The memory format is FLASH, with a word size of 8b, making it ideal for storing and retrieving data quickly and efficiently. The command user interface and ready/busy feature add convenience and ease of use to this package, making it a top choice for many electronic devices.
MT29F2G08ABAEAWP:E Features
Package / Case: 48-TFSOP (0.724, 18.40mm Width)
48 Pins
Operating Supply Voltage:3.3V
MT29F2G08ABAEAWP:E Applications
There are a lot of Micron Technology Inc. MT29F2G08ABAEAWP:E Memory applications.
eDRAM
mainframes
data buffer
main computer memory
workstations,
cell phones
multimedia computers
Cache memory
supercomputers
telecommunications
The 48-TFSOP (0.724, 18.40mm Width) package is a popular choice in the electronics industry due to its compact size and versatility. With a total of 48 pins, this package offers a wide range of applications and is commonly used in bulk packaging. It has a moisture sensitivity level (MSL) of 3, meaning it can withstand up to 168 hours of exposure to moisture. This particular package utilizes FLASH technology, specifically NAND, and has a memory size of 2Gb 256M x 8. The memory format is FLASH, with a word size of 8b, making it ideal for storing and retrieving data quickly and efficiently. The command user interface and ready/busy feature add convenience and ease of use to this package, making it a top choice for many electronic devices.
MT29F2G08ABAEAWP:E Features
Package / Case: 48-TFSOP (0.724, 18.40mm Width)
48 Pins
Operating Supply Voltage:3.3V
MT29F2G08ABAEAWP:E Applications
There are a lot of Micron Technology Inc. MT29F2G08ABAEAWP:E Memory applications.
eDRAM
mainframes
data buffer
main computer memory
workstations,
cell phones
multimedia computers
Cache memory
supercomputers
telecommunications
MT29F2G08ABAEAWP:E More Descriptions
SLC NAND Flash Parallel 3.3V 2Gbit 256M x 8bit 48-Pin TSOP-I Tray
FLASH MEMORY, 2GBIT, 0 TO 70DEG C; Flash; FLASH MEMORY, 2GBIT, 0 TO 70DEG C; Flash Memory Type: SLC NAND; Memory Size: 2Gbit; Flash Memory Configuration: 256M x 8bit; IC Interface Type: Parallel; Memory Case Style: TSOP-I; No
FLASH MEMORY, 2GBIT, 0 TO 70DEG C; Flash Memory Type:SLC NAND; Memory Configuration:256M x 8bit; Interfaces:Parallel; IC Case / Package:TSOP-I; No. of Pins:48Pins; Clock Frequency Max:50MHz; Access Time:16ns; Supply Voltage Min:2.7V RoHS Compliant: Yes
FLASH MEMORY, 2GBIT, 0 TO 70DEG C; Flash; FLASH MEMORY, 2GBIT, 0 TO 70DEG C; Flash Memory Type: SLC NAND; Memory Size: 2Gbit; Flash Memory Configuration: 256M x 8bit; IC Interface Type: Parallel; Memory Case Style: TSOP-I; No
FLASH MEMORY, 2GBIT, 0 TO 70DEG C; Flash Memory Type:SLC NAND; Memory Configuration:256M x 8bit; Interfaces:Parallel; IC Case / Package:TSOP-I; No. of Pins:48Pins; Clock Frequency Max:50MHz; Access Time:16ns; Supply Voltage Min:2.7V RoHS Compliant: Yes
The three parts on the right have similar specifications to MT29F2G08ABAEAWP:E.
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ImagePart NumberManufacturerFactory Lead TimeMountMounting TypePackage / CaseNumber of PinsOperating TemperaturePackagingPublishedPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeHTS CodeTechnologyVoltage - SupplyTerminal PositionNumber of FunctionsSupply VoltageTerminal PitchBase Part NumberOperating Supply VoltageVoltageMemory SizeNominal Supply CurrentMemory TypeMemory FormatMemory InterfaceOrganizationMemory WidthAddress Bus WidthDensityStandby Current-MaxAccess Time (Max)Sync/AsyncWord SizeData PollingToggle BitCommand User InterfaceNumber of Sectors/SizeSector SizePage SizeReady/BusyAmbient Temperature Range HighHeightLengthRadiation HardeningRoHS StatusLead FreeSeriesClock FrequencySurface MountAdditional FeaturePeak Reflow Temperature (Cel)Reach Compliance CodeTime@Peak Reflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Operating ModeMemory DensityHeight Seated (Max)WidthView Compare
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MT29F2G08ABAEAWP:E6 WeeksSurface MountSurface Mount48-TFSOP (0.724, 18.40mm Width)480°C~70°C TABulk2010Active3 (168 Hours)483A991.B.1.A8542.32.00.51FLASH - NAND2.7V~3.6VDUAL13.3V0.5mmMT29F2G083.3V3.3V2Gb 256M x 835mANon-VolatileFLASHParallel256MX8829b2 Gb0.0001A25 nsAsynchronous8bNONOYES2K128K2kBYES70°C1.2mm18.4mmNoROHS3 CompliantLead Free---------------
-
--Surface Mount162-VFBGA--40°C~105°C TATape & Reel (TR)-Last Time Buy3 (168 Hours)---FLASH - NAND, Mobile LPDRAM1.7V~1.9V-------4Gb 512M x 8 N 8Gb 512M x 16 LPDDR2-Non-VolatileFLASH, RAMParallel-------------------ROHS3 Compliant-Automotive, AEC-Q100533MHz------------
-
16 Weeks-Surface Mount130-VFBGA--40°C~85°C TATray-Active-130--FLASH - NAND, Mobile LPDRAM1.7V~1.95VBOTTOM11.8V0.65mm---1Gb 128M x 8 N 512M 16M x 32 LPDRAM-Non-VolatileFLASH, RAMParallel128MX88---------------9mm-RoHS Compliant--200MHzYESLPDRAM IS ORGANISED AS 32M X 16NOT SPECIFIEDcompliantNOT SPECIFIEDR-PBGA-B1301.95V1.7VSYNCHRONOUS1073741824 bit1mm8mm
-
--Surface Mount162-VFBGA--40°C~85°C TATray-Last Time Buy3 (168 Hours)---FLASH - NAND, Mobile LPDRAM1.7V~1.9V-------4Gb 512M x 8 N 2Gb 128M x 16 LPDDR2-Non-VolatileFLASH, RAMParallel----------------------533MHz------------
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