Micron Technology Inc. MT29F256G08EFEBBWP:B
- Part Number:
- MT29F256G08EFEBBWP:B
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 4547055-MT29F256G08EFEBBWP:B
- Description:
- IC FLASH 256GBIT 48TSOP
- Datasheet:
- MT29F256G08EFEBBWP:B
Micron Technology Inc. MT29F256G08EFEBBWP:B technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. MT29F256G08EFEBBWP:B.
- Factory Lead Time4 Weeks
- Mounting TypeSurface Mount
- Package / Case48-TFSOP (0.724, 18.40mm Width)
- Supplier Device Package48-TSOP I
- Operating Temperature0°C~70°C TA
- PackagingTray
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- TechnologyFLASH - NAND
- Voltage - Supply2.7V~3.6V
- Operating Supply Voltage3.3V
- Memory Size256Gb 32G x 8
- Memory TypeNon-Volatile
- Memory FormatFLASH
- Memory InterfaceParallel
- RoHS StatusROHS3 Compliant
MT29F256G08EFEBBWP:B Overview
The package or case for this particular device is a 48-TFSOP with a width of 0.724 inches or 18.40mm. The supplier device package is a 48-TSOP I and the packaging method used is a tray. However, it is important to note that the part status for this device is now considered obsolete. This means that it is no longer being manufactured or sold. Additionally, the moisture sensitivity level (MSL) for this device is 3, which indicates that it can withstand up to 168 hours of exposure to moisture. The technology used for this device is FLASH-NAND, and it has a memory size of 256Gb 32G x 8. The memory type is non-volatile, meaning it retains its data even when power is turned off. The memory format is FLASH, and this device is also compliant with ROHS3 standards.
MT29F256G08EFEBBWP:B Features
Package / Case: 48-TFSOP (0.724, 18.40mm Width)
Operating Supply Voltage:3.3V
MT29F256G08EFEBBWP:B Applications
There are a lot of Micron Technology Inc.
MT29F256G08EFEBBWP:B Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
The package or case for this particular device is a 48-TFSOP with a width of 0.724 inches or 18.40mm. The supplier device package is a 48-TSOP I and the packaging method used is a tray. However, it is important to note that the part status for this device is now considered obsolete. This means that it is no longer being manufactured or sold. Additionally, the moisture sensitivity level (MSL) for this device is 3, which indicates that it can withstand up to 168 hours of exposure to moisture. The technology used for this device is FLASH-NAND, and it has a memory size of 256Gb 32G x 8. The memory type is non-volatile, meaning it retains its data even when power is turned off. The memory format is FLASH, and this device is also compliant with ROHS3 standards.
MT29F256G08EFEBBWP:B Features
Package / Case: 48-TFSOP (0.724, 18.40mm Width)
Operating Supply Voltage:3.3V
MT29F256G08EFEBBWP:B Applications
There are a lot of Micron Technology Inc.
MT29F256G08EFEBBWP:B Memory applications.
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders
embedded logic
eDRAM
graphics card
MT29F256G08EFEBBWP:B More Descriptions
NAND Flash, TLC NAND Flash, 256Gb, 3.3V, 48-pin TSOP, RoHSMicron SCT
IC FLASH 256G PARALLEL 48TSOP
IC FLASH 256GBIT PAR 48TSOP I
IC DRAM 32G 1866MHZ FBGA
TLC 256G 32GX8 TSOP DDP
IC FLASH 256G PARALLEL 48TSOP
IC FLASH 256GBIT PAR 48TSOP I
IC DRAM 32G 1866MHZ FBGA
TLC 256G 32GX8 TSOP DDP
The three parts on the right have similar specifications to MT29F256G08EFEBBWP:B.
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ImagePart NumberManufacturerFactory Lead TimeMounting TypePackage / CaseSupplier Device PackageOperating TemperaturePackagingPart StatusMoisture Sensitivity Level (MSL)TechnologyVoltage - SupplyOperating Supply VoltageMemory SizeMemory TypeMemory FormatMemory InterfaceRoHS StatusSeriesClock FrequencySurface MountNumber of TerminationsAdditional FeatureTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchReach Compliance CodeTime@Peak Reflow Temperature-Max (s)JESD-30 CodeSupply Voltage-Max (Vsup)Supply Voltage-Min (Vsup)Operating ModeOrganizationMemory WidthMemory DensityHeight Seated (Max)LengthWidthView Compare
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MT29F256G08EFEBBWP:B4 WeeksSurface Mount48-TFSOP (0.724, 18.40mm Width)48-TSOP I0°C~70°C TATrayObsolete3 (168 Hours)FLASH - NAND2.7V~3.6V3.3V256Gb 32G x 8Non-VolatileFLASHParallelROHS3 Compliant-----------------------
-
-Surface Mount162-VFBGA--40°C~105°C TATape & Reel (TR)Last Time Buy3 (168 Hours)FLASH - NAND, Mobile LPDRAM1.7V~1.9V-4Gb 512M x 8 N 8Gb 512M x 16 LPDDR2Non-VolatileFLASH, RAMParallelROHS3 CompliantAutomotive, AEC-Q100533MHz--------------------
-
16 WeeksSurface Mount130-VFBGA--40°C~85°C TATrayActive-FLASH - NAND, Mobile LPDRAM1.7V~1.95V-1Gb 128M x 8 N 512M 16M x 32 LPDRAMNon-VolatileFLASH, RAMParallelRoHS Compliant-200MHzYES130LPDRAM IS ORGANISED AS 32M X 16BOTTOMNOT SPECIFIED11.8V0.65mmcompliantNOT SPECIFIEDR-PBGA-B1301.95V1.7VSYNCHRONOUS128MX881073741824 bit1mm9mm8mm
-
-Surface Mount162-VFBGA--40°C~85°C TATrayLast Time Buy3 (168 Hours)FLASH - NAND, Mobile LPDRAM1.7V~1.9V-4Gb 512M x 8 N 2Gb 128M x 16 LPDDR2Non-VolatileFLASH, RAMParallel--533MHz--------------------
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