Micron Technology Inc. MT29F256G08CMCBBH2-10IT:B TR

MT29F256G08CMCBBH2-10IT:B TR Overview
The package or case for this particular device is a 100-TBGA, which stands for "Thin Ball Grid Array" and refers to the type of packaging used for the integrated circuit. The supplier device package is also a 100-TBGA, but with the added dimensions of 12x18. This device is designed to operate in a wide range of temperatures, from -40°C to 85°C, making it suitable for use in various environments. The packaging used for this device is Tape & Reel (TR), which is a common method for shipping and storing electronic components. The technology used in this device is FLASH - NAND, which is a type of non-volatile memory that can retain data even when the power is turned off. The voltage supply for this device ranges from 2.7V to 3.6V, and the memory type is FLASH, which is a type of non-volatile memory that can be electrically erased and reprogrammed. The memory format is also FLASH, and the memory interface is parallel, meaning that data is transferred in parallel using multiple data lines. This device is also RoHS3 compliant, meaning that it meets the requirements of the Restriction of Hazardous Substances directive.

MT29F256G08CMCBBH2-10IT:B TR Features
Package / Case: 100-TBGA


MT29F256G08CMCBBH2-10IT:B TR Applications
There are a lot of Micron Technology Inc.
MT29F256G08CMCBBH2-10IT:B TR Memory applications.


networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders