Micron Technology Inc. MT29F256G08CMCABH2-10RZ:A

MT29F256G08CMCABH2-10RZ:A Overview
The package or case for this particular device is a 100-TBGA, which stands for Thin Ball Grid Array. This type of package is commonly used for integrated circuits and is known for its compact size and high performance. The supplier device package is also a 100-TBGA, but with a slightly different dimension of 12x18. This device is designed to operate within a temperature range of 0°C to 70°C, making it suitable for a wide range of applications. It is packaged in a tray, which is a common method of packaging for electronic devices. The technology used in this device is FLASH-NAND, which stands for Flash Non-Volatile Memory. It requires a supply voltage of 2.7V to 3.6V and has a base part number of MT29F256G08. The interface for this device is parallel, and it has a memory size of 256Gb, which is equivalent to 32G x 8. This device is a non-volatile memory, meaning it retains its data even when power is turned off.

MT29F256G08CMCABH2-10RZ:A Features
Package / Case: 100-TBGA
100 Pins


MT29F256G08CMCABH2-10RZ:A Applications
There are a lot of Micron Technology Inc.
MT29F256G08CMCABH2-10RZ:A Memory applications.


networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
data buffer
nonvolatile BIOS memory
Camcorders