NXP USA Inc. MSC8152SVT1000B
- Part Number:
- MSC8152SVT1000B
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3631880-MSC8152SVT1000B
- Description:
- IC PROCESSOR DUAL DGTL 783FCBGA
- Datasheet:
- MSC8152
NXP USA Inc. MSC8152SVT1000B technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MSC8152SVT1000B.
- Mounting TypeSurface Mount
- Package / Case783-BBGA, FCBGA
- Supplier Device Package783-FCPBGA (29x29)
- Operating Temperature0°C~105°C TJ
- PackagingTray
- Published2008
- SeriesStarCore
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Base Part NumberMSC8152
- InterfaceEthernet, I2C, PCI, RGMII, Serial RapidIO, SGMII, SPI, UART/USART
- Voltage - I/O2.50V
- Non-Volatile MemoryROM (96kB)
- Voltage - Core1.00V
- On Chip Data RAM576kB
- Clock Rate1GHz
- RoHS StatusROHS3 Compliant
MSC8152SVT1000B Overview
NXP USA Inc. is a well-known brand in the technology industry, particularly in the field of Embedded - DSP (Digital Signal Processors). This specific part, which falls under the category of Embedded - DSP (Digital Signal Processors), is a highly advanced chip that is designed to process digital signals with extreme precision and efficiency. It is a crucial component in various electronic devices, such as smartphones, gaming consoles, and audio equipment, as it enables these devices to perform complex tasks and deliver high-quality performance. One of the notable features of this chip is its package/case, which is 783-BBGA, FCBGA. This indicates that the chip is enclosed in a 783-ball grid array package, providing a compact and durable design. Furthermore, the supplier device package is 783-FCPBGA (29x29), which specifies the dimensions of the chip at 29x29 mm. This information is crucial for manufacturers and engineers who need to ensure that the chip can fit into their devices seamlessly. In terms of operating temperature, this chip has a wide range of 0°C~105°C TJ, making it suitable for use in various environments. This means that the chip can withstand extreme temperatures, ensuring its reliability and durability. Additionally, the chip was published in 2008, showcasing its longevity and relevance in the industry. Another important parameter to consider is the moisture sensitivity level (MSL), which is rated at 3 (168 Hours). This indicates that the chip can withstand exposure to moisture for up to 168 hours without any adverse effects. This is crucial in ensuring the chip's functionality and longevity, especially in humid environments. When it comes to voltage, this chip has a voltage - I/O of 2.50V and a voltage - core of 1.00V. These parameters are essential in determining the chip's power requirements and compatibility with other components in the device. Additionally, the chip has a non-volatile memory of ROM (96kB) and an on-chip data RAM of 576kB. These memory capacities play a crucial role in the chip's performance and its ability to store and process data efficiently. Lastly, the clock rate of this chip is an impressive 1GHz, making it a high-speed processor capable of handling complex tasks and large amounts of data. This parameter is crucial in determining the chip's overall performance and its ability to keep up with the demands of modern technology. In conclusion, the NXP USA Inc. Embedded - DSP (Digital Signal Processors) chip is a highly advanced and versatile component that offers various features and parameters to meet the demands of today's technology. Its compact design, wide operating temperature range, and high clock rate make it a top choice for manufacturers and engineers in the industry. With its impressive specifications and reputation as a reliable brand, this chip is undoubtedly a valuable asset in the world of technology.
MSC8152SVT1000B Features
Supplied in the 783-BBGA, FCBGA package
MSC8152SVT1000B Applications
There are a lot of NXP USA Inc. MSC8152SVT1000B DSP applications.
3D tomography and imaging processing
Spectral density estimation
Boats
Airplanes
Control systems
Compression of videos
Seismology
Monitoring equipment
Infrared
Fourier transform
NXP USA Inc. is a well-known brand in the technology industry, particularly in the field of Embedded - DSP (Digital Signal Processors). This specific part, which falls under the category of Embedded - DSP (Digital Signal Processors), is a highly advanced chip that is designed to process digital signals with extreme precision and efficiency. It is a crucial component in various electronic devices, such as smartphones, gaming consoles, and audio equipment, as it enables these devices to perform complex tasks and deliver high-quality performance. One of the notable features of this chip is its package/case, which is 783-BBGA, FCBGA. This indicates that the chip is enclosed in a 783-ball grid array package, providing a compact and durable design. Furthermore, the supplier device package is 783-FCPBGA (29x29), which specifies the dimensions of the chip at 29x29 mm. This information is crucial for manufacturers and engineers who need to ensure that the chip can fit into their devices seamlessly. In terms of operating temperature, this chip has a wide range of 0°C~105°C TJ, making it suitable for use in various environments. This means that the chip can withstand extreme temperatures, ensuring its reliability and durability. Additionally, the chip was published in 2008, showcasing its longevity and relevance in the industry. Another important parameter to consider is the moisture sensitivity level (MSL), which is rated at 3 (168 Hours). This indicates that the chip can withstand exposure to moisture for up to 168 hours without any adverse effects. This is crucial in ensuring the chip's functionality and longevity, especially in humid environments. When it comes to voltage, this chip has a voltage - I/O of 2.50V and a voltage - core of 1.00V. These parameters are essential in determining the chip's power requirements and compatibility with other components in the device. Additionally, the chip has a non-volatile memory of ROM (96kB) and an on-chip data RAM of 576kB. These memory capacities play a crucial role in the chip's performance and its ability to store and process data efficiently. Lastly, the clock rate of this chip is an impressive 1GHz, making it a high-speed processor capable of handling complex tasks and large amounts of data. This parameter is crucial in determining the chip's overall performance and its ability to keep up with the demands of modern technology. In conclusion, the NXP USA Inc. Embedded - DSP (Digital Signal Processors) chip is a highly advanced and versatile component that offers various features and parameters to meet the demands of today's technology. Its compact design, wide operating temperature range, and high clock rate make it a top choice for manufacturers and engineers in the industry. With its impressive specifications and reputation as a reliable brand, this chip is undoubtedly a valuable asset in the world of technology.
MSC8152SVT1000B Features
Supplied in the 783-BBGA, FCBGA package
MSC8152SVT1000B Applications
There are a lot of NXP USA Inc. MSC8152SVT1000B DSP applications.
3D tomography and imaging processing
Spectral density estimation
Boats
Airplanes
Control systems
Compression of videos
Seismology
Monitoring equipment
Infrared
Fourier transform
MSC8152SVT1000B More Descriptions
DSP 64-Bit 1GHz 1000MIPS 783-Pin FCBGA Tray
IC PROCESSOR DUAL DGTL 783FCPBGA
IC LED DRIVER CTRLR 400MA 24UQFN
IC PROCESSOR DUAL DGTL 783FCPBGA
IC LED DRIVER CTRLR 400MA 24UQFN
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