MPC860TCZQ66D4

NXP USA Inc. MPC860TCZQ66D4

Part Number:
MPC860TCZQ66D4
Manufacturer:
NXP USA Inc.
Ventron No:
3161504-MPC860TCZQ66D4
Description:
IC MPU MPC8XX 66MHZ 357BGA
ECAD Model:
Datasheet:
MPC860TCZQ66D4

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Specifications
NXP USA Inc. MPC860TCZQ66D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860TCZQ66D4.
  • Factory Lead Time
    12 Weeks
  • Package / Case
    357-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~95°C TA
  • Packaging
    Tray
  • Published
    1995
  • Series
    MPC8xx
  • JESD-609 Code
    e0
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    357
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC860
  • JESD-30 Code
    S-PBGA-B357
  • Supply Voltage-Max (Vsup)
    3.465V
  • Power Supplies
    3.3V
  • Supply Voltage-Min (Vsup)
    3.135V
  • Speed
    66MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Clock Frequency
    50MHz
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10Mbps (4), 10/100Mbps (1)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • Additional Interfaces
    HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
  • Co-Processors/DSP
    Communications; CPM
  • Height Seated (Max)
    2.52mm
  • Length
    25mm
  • RoHS Status
    Non-RoHS Compliant
Description
MPC860TCZQ66D4 Description
The operating temperature for this particular device is -40°C to 95°C, as published in 1995. It has a total of 357 terminations and a terminal form of BALL. The maximum supply voltage (Vsup) for this device is 3.465V. It also has boundary scan capabilities, indicated by the "YES" designation. The number of cores and bus width is 1 core with a 32-bit width, while the RAM controllers are DRAM. The maximum height when seated is 2.52mm. It is important to note that this device is not RoHS compliant, meaning it does not meet the standards for restricting hazardous substances. Overall, this device has specific operating parameters and features that make it suitable for certain applications.

MPC860TCZQ66D4 Features
4Kb Instruction Cache; MPC860P - 16Kb Instruction Cache 4Kb Data Cache; MPC860P - 8Kb Data Cache 8Kb Dual Port RAM Instruction and Data MMUs Up to 32-Bit Data Bus (Dynamic Bus Sizing for 8,16, and 32 Bits) 32 Address Lines Complete Static Design (040 MHz Operation) Memory Controller (Eight Banks) General-Purpose Timers

MPC860TCZQ66D4 Applications
Industrial  Industrial transport (non-car & non-light truck)  Enterprise systems  Enterprise projectors  Personal electronics  Tablets
MPC860TCZQ66D4 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.32um 66MHz 357-Pin BGA Tray
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)
PowerQUICC, 32 Bit Power Architecture, 66MHz, Communications Processor, -40 to 95C
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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