MPC860SRZQ50D4

NXP USA Inc. MPC860SRZQ50D4

Part Number:
MPC860SRZQ50D4
Manufacturer:
NXP USA Inc.
Ventron No:
3161498-MPC860SRZQ50D4
Description:
IC MPU MPC8XX 50MHZ 357BGA
ECAD Model:
Datasheet:
MPC860SRZQ50D4

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Specifications
NXP USA Inc. MPC860SRZQ50D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860SRZQ50D4.
  • Voltage - I/O:
    3.3V
  • USB:
    -
  • Supplier Device Package:
    357-PBGA (25x25)
  • Speed:
    50MHz
  • Series:
    MPC8xx
  • Security Features:
    -
  • SATA:
    -
  • RAM Controllers:
    DRAM
  • Packaging:
    Tray
  • Package / Case:
    357-BBGA
  • Operating Temperature:
    0°C ~ 95°C (TA)
  • Number of Cores/Bus Width:
    1 Core, 32-Bit
  • Graphics Acceleration:
    No
  • Ethernet:
    10 Mbps (4)
  • Display & Interface Controllers:
    -
  • Core Processor:
    MPC8xx
  • Co-Processors/DSP:
    Communications; CPM
  • Additional Interfaces:
    HDLC/SDLC, I²C, IrDA, PCMCIA, SPI, TDM, UART/USART
Description
Images are for reference only.See Product Specifications for product details.If you are interested to buy MPC860SRZQ50D4.
MPC860SRZQ50D4 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32bit 0.32um 50MHz 357-Pin BGA Tray
Automotive Qualification Standard:-; Msl:msl 3 - 168 Hours; Product Range:powerquicc I Series; Cpu Speed:50Mhz; Embedded Interface Type:ethernet, I2C, Spi, Uart; Filter Terminals:smd; Frequency Typ:50Mhz; Mpu Case Style:bga Rohs Compliant: No
MPU, 32BIT, 50MHZ, BGA-357; Series:PowerQUICC I; Core Size:32bit; Program Memory Size:-; Supply Voltage Min:3.135V; Supply Voltage Max:3.465V; Digital IC Case Style:BGA; No. of Pins:357; CPU Speed:50MHz; Embedded Interface Type:I2C, SPI; Operating Temperature Min:0°C; Operating Temperature Max:95°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2013)
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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