NXP USA Inc. MPC860PCZQ66D4
- Part Number:
- MPC860PCZQ66D4
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3160257-MPC860PCZQ66D4
- Description:
- IC MPU MPC8XX 66MHZ 357BGA
- Datasheet:
- MPC860PCZQ66D4
NXP USA Inc. MPC860PCZQ66D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860PCZQ66D4.
- Factory Lead Time12 Weeks
- Package / Case357-BBGA
- Surface MountYES
- Operating Temperature-40°C~95°C TA
- PackagingTray
- Published1995
- SeriesMPC8xx
- JESD-609 Codee0
- Part StatusNot For New Designs
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations357
- ECCN Code3A991.A.2
- Terminal FinishTin/Lead (Sn/Pb)
- HTS Code8542.31.00.01
- SubcategoryMicroprocessors
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)245
- Supply Voltage3.3V
- Terminal Pitch1.27mm
- Reflow Temperature-Max (s)30
- Base Part NumberMPC860
- JESD-30 CodeS-PBGA-B357
- Supply Voltage-Max (Vsup)3.465V
- Power Supplies3.3V
- Supply Voltage-Min (Vsup)3.135V
- Speed66MHz
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR, RISC
- Clock Frequency50MHz
- Bit Size32
- Address Bus Width32
- Boundary ScanYES
- Low Power ModeYES
- External Data Bus Width32
- FormatFIXED POINT
- Integrated CacheYES
- Voltage - I/O3.3V
- Ethernet10Mbps (4), 10/100Mbps (1)
- Number of Cores/Bus Width1 Core 32-Bit
- Graphics AccelerationNo
- RAM ControllersDRAM
- Additional InterfacesHDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
- Co-Processors/DSPCommunications; CPM
- Height Seated (Max)2.52mm
- Length25mm
- RoHS StatusNon-RoHS Compliant
MPC860PCZQ66D4 Description
NXP USA Inc. is the brand of this part. It is an Embedded - Microprocessors chip, belonging to the Embedded - Microprocessors category. The Surface Mount is YES, and the Technology used is CMOS. The Peak Reflow Temperature (Cel) is 245, and the Supply Voltage-Min (Vsup) is 3.135V. This part falls under the uPs/uCs/Peripheral ICs Type of MICROPROCESSOR and is a RISC with a Bit Size of 32. The External Data Bus Width is 32 and the Format is FIXED POINT. The RAM Controllers used are DRAM and the Height Seated (Max) is 2.52mm.
MPC860PCZQ66D4 Features
4Kb Instruction Cache; MPC860P - 16Kb Instruction Cache 4Kb Data Cache; MPC860P - 8Kb Data Cache 8Kb Dual Port RAM Instruction and Data MMUs Up to 32-Bit Data Bus (Dynamic Bus Sizing for 8,16, and 32 Bits) 32 Address Lines Complete Static Design (040 MHz Operation) Memory Controller (Eight Banks)
MPC860PCZQ66D4 Applications
Automotive Infotainment & cluster Communications equipment Wireless infrastructure Industrial Motor drives
NXP USA Inc. is the brand of this part. It is an Embedded - Microprocessors chip, belonging to the Embedded - Microprocessors category. The Surface Mount is YES, and the Technology used is CMOS. The Peak Reflow Temperature (Cel) is 245, and the Supply Voltage-Min (Vsup) is 3.135V. This part falls under the uPs/uCs/Peripheral ICs Type of MICROPROCESSOR and is a RISC with a Bit Size of 32. The External Data Bus Width is 32 and the Format is FIXED POINT. The RAM Controllers used are DRAM and the Height Seated (Max) is 2.52mm.
MPC860PCZQ66D4 Features
4Kb Instruction Cache; MPC860P - 16Kb Instruction Cache 4Kb Data Cache; MPC860P - 8Kb Data Cache 8Kb Dual Port RAM Instruction and Data MMUs Up to 32-Bit Data Bus (Dynamic Bus Sizing for 8,16, and 32 Bits) 32 Address Lines Complete Static Design (040 MHz Operation) Memory Controller (Eight Banks)
MPC860PCZQ66D4 Applications
Automotive Infotainment & cluster Communications equipment Wireless infrastructure Industrial Motor drives
MPC860PCZQ66D4 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.32um 66MHz 357-Pin BGA Tray
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)
FIXED POINT MICROPROCESSOR RISC 1Core 32-Bit BALL IC Microprocessor -40C~95C TA 25mm 3.135V 50MHz
MPU, 32BIT, 66MHZ, BGA-357; Series:PowerQUICC I; Core Size:32bit; Program Memory Size:-; Supply Voltage Min:3.135V; Supply Voltage Max:3.465V; Digital IC Case Style:BGA; No. of Pins:357; CPU Speed:66MHz; Embedded Interface Type:I2C, SPI; Operating Temperature Min:-40°C; Operating Temperature Max:95°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2013)
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)
FIXED POINT MICROPROCESSOR RISC 1Core 32-Bit BALL IC Microprocessor -40C~95C TA 25mm 3.135V 50MHz
MPU, 32BIT, 66MHZ, BGA-357; Series:PowerQUICC I; Core Size:32bit; Program Memory Size:-; Supply Voltage Min:3.135V; Supply Voltage Max:3.465V; Digital IC Case Style:BGA; No. of Pins:357; CPU Speed:66MHz; Embedded Interface Type:I2C, SPI; Operating Temperature Min:-40°C; Operating Temperature Max:95°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2013)
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