MPC860PCZQ66D4

NXP USA Inc. MPC860PCZQ66D4

Part Number:
MPC860PCZQ66D4
Manufacturer:
NXP USA Inc.
Ventron No:
3160257-MPC860PCZQ66D4
Description:
IC MPU MPC8XX 66MHZ 357BGA
ECAD Model:
Datasheet:
MPC860PCZQ66D4

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Specifications
NXP USA Inc. MPC860PCZQ66D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860PCZQ66D4.
  • Factory Lead Time
    12 Weeks
  • Package / Case
    357-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~95°C TA
  • Packaging
    Tray
  • Published
    1995
  • Series
    MPC8xx
  • JESD-609 Code
    e0
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    357
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Lead (Sn/Pb)
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC860
  • JESD-30 Code
    S-PBGA-B357
  • Supply Voltage-Max (Vsup)
    3.465V
  • Power Supplies
    3.3V
  • Supply Voltage-Min (Vsup)
    3.135V
  • Speed
    66MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Clock Frequency
    50MHz
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10Mbps (4), 10/100Mbps (1)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • Additional Interfaces
    HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
  • Co-Processors/DSP
    Communications; CPM
  • Height Seated (Max)
    2.52mm
  • Length
    25mm
  • RoHS Status
    Non-RoHS Compliant
Description
MPC860PCZQ66D4 Description
NXP USA Inc. is the brand of this part. It is an Embedded - Microprocessors chip, belonging to the Embedded - Microprocessors category. The Surface Mount is YES, and the Technology used is CMOS. The Peak Reflow Temperature (Cel) is 245, and the Supply Voltage-Min (Vsup) is 3.135V. This part falls under the uPs/uCs/Peripheral ICs Type of MICROPROCESSOR and is a RISC with a Bit Size of 32. The External Data Bus Width is 32 and the Format is FIXED POINT. The RAM Controllers used are DRAM and the Height Seated (Max) is 2.52mm.

MPC860PCZQ66D4 Features
4Kb Instruction Cache; MPC860P - 16Kb Instruction Cache 4Kb Data Cache; MPC860P - 8Kb Data Cache 8Kb Dual Port RAM Instruction and Data MMUs Up to 32-Bit Data Bus (Dynamic Bus Sizing for 8,16, and 32 Bits) 32 Address Lines Complete Static Design (040 MHz Operation) Memory Controller (Eight Banks)

MPC860PCZQ66D4 Applications
Automotive  Infotainment & cluster  Communications equipment  Wireless infrastructure  Industrial  Motor drives
MPC860PCZQ66D4 More Descriptions
MPU PowerQUICC MPC8xx Processor RISC 32-Bit 0.32um 66MHz 357-Pin BGA Tray
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)
FIXED POINT MICROPROCESSOR RISC 1Core 32-Bit BALL IC Microprocessor -40C~95C TA 25mm 3.135V 50MHz
MPU, 32BIT, 66MHZ, BGA-357; Series:PowerQUICC I; Core Size:32bit; Program Memory Size:-; Supply Voltage Min:3.135V; Supply Voltage Max:3.465V; Digital IC Case Style:BGA; No. of Pins:357; CPU Speed:66MHz; Embedded Interface Type:I2C, SPI; Operating Temperature Min:-40°C; Operating Temperature Max:95°C; MSL:MSL 3 - 168 hours; SVHC:No SVHC (20-Jun-2013)
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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