MPC860DPVR50D4

NXP USA Inc. MPC860DPVR50D4

Part Number:
MPC860DPVR50D4
Manufacturer:
NXP USA Inc.
Ventron No:
3160712-MPC860DPVR50D4
Description:
IC MPU MPC8XX 50MHZ 357BGA
ECAD Model:
Datasheet:
MPC860DPVR50D4

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
Specifications
NXP USA Inc. MPC860DPVR50D4 technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC860DPVR50D4.
  • Package / Case
    357-BBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~95°C TA
  • Packaging
    Tray
  • Published
    2004
  • Series
    MPC8xx
  • JESD-609 Code
    e1
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    357
  • ECCN Code
    5A991
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    MPC860
  • JESD-30 Code
    S-PBGA-B357
  • Supply Voltage-Max (Vsup)
    3.465V
  • Supply Voltage-Min (Vsup)
    3.135V
  • Speed
    50MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Clock Frequency
    50MHz
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    32
  • Format
    FIXED POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10Mbps (2), 10/100Mbps (1)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM
  • Additional Interfaces
    HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
  • Co-Processors/DSP
    Communications; CPM
  • Height Seated (Max)
    2.52mm
  • Length
    25mm
  • RoHS Status
    ROHS3 Compliant
Description
MPC860DPVR50D4 Overview
In 2004, a new standard was published known as Moisture Sensitivity Level (MSL), with a rating of 3 (168 Hours). This standard was accompanied by an ECCN Code of 5A991, indicating its classification as a technology with potential military applications. The Terminal Form for this technology is BALL, and its recommended Peak Reflow Temperature is 245 degrees Celsius. The technology also has a maximum Reflow Temperature of 30 seconds. With a Bit Size of 32 and a Format of FIXED POINT, this technology is equipped with various interfaces such as Ethernet for 10Mbps (2) and 10/100Mbps (1), as well as additional interfaces including HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, and UART/USART. This comprehensive list of interfaces makes this technology versatile and adaptable for a variety of applications.

MPC860DPVR50D4 Features
32-Bit Structure

MPC860DPVR50D4 Applications
There are a lot of NXP USA Inc. MPC860DPVR50D4 Microprocessor applications.

Answering machines
Smartphones-calling, video calling, texting, email
Security systems
Industrial control field
Smartphone
Smart highways (navigation, traffic control, information monitoring and car service)
Measurement and control field
Computers and laptops-video calling, email, blogging
Ipad
Set-top boxes
MPC860DPVR50D4 More Descriptions
MPU MPC8xx RISC 32-Bit 0.32um 50MHz 357-Pin BGA Tray
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 50MHz 357-PBGA (25x25)
32-bit Communication Processors POWER QUICC-NO LEAD
LDO Voltage Regulators 300MA LDO REGULATOR
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News

  • 25 September 2023

    Get to Know the IRFB7545PBF Power MOSFET

    Ⅰ. What is IRFB7545PBF?Ⅱ. Symbol and Footprint of IRFB7545PBFⅢ. Technical parametersⅣ. Features of IRFB7545PBFⅤ. Pinout and package of IRFB7545PBFⅥ. Application of IRFB7545PBFⅦ. How to use IRFB7545PBF?Ⅷ. How to...
  • 25 September 2023

    A Comparison of 2N7000 and BS170 N-Channel Mosfet Transistors

    Ⅰ. What is a MOS field effect transistor?Ⅱ. Overview of 2N7000Ⅲ. Overview of BS170Ⅳ. 2N7000 vs BS170: PCB footprintsⅤ. 2N7000 vs BS170: Technical parametersⅥ. 2N7000 vs BS170: FeaturesⅦ....
  • 26 September 2023

    W25Q128JVSIQ Footprint, Features and Package

    Ⅰ. W25Q128JVSIQ descriptionⅡ. W25Q128JVSIQ symbol and footprintⅢ. Technical parametersⅣ. Features of W25Q128JVSIQⅤ. Pin configuration of W25Q128JVSIQⅥ. Package of W25Q128JVSIQⅦ. What are the characteristics of the SPI interface of...
  • 26 September 2023

    TDA7560 Audio Power Amplifier: Symbol, Features and Application

    Ⅰ. Overview of TDA7560Ⅱ. Pin connection, symbol and footprint of TDA7560Ⅲ. Technical parametersⅣ. Features of TDA7560Ⅴ. Application of TDA7560Ⅵ. Are TDA7560 and TDA7851 interchangeable?Ⅶ. TDA7560 car power amplifier...
  • cost

    Help you to save your cost and time.

  • package

    Reliable package for your goods.

  • fast

    Fast Reliable Delivery to save time.

  • service

    Quality premium after-sale service.