NXP USA Inc. MPC8323CVRADDCA
- Part Number:
- MPC8323CVRADDCA
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3667216-MPC8323CVRADDCA
- Description:
- IC MPU MPC83XX 266MHZ 516BGA
- ECAD Model:
-
- Datasheet:
- MPC8323CVRADDCA
NXP USA Inc. MPC8323CVRADDCA technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC8323CVRADDCA.
- Factory Lead Time12 Weeks
- Package / Case516-BBGA
- Surface MountYES
- Operating Temperature-40°C~105°C TA
- PackagingTray
- Published2002
- SeriesMPC83xx
- JESD-609 Codee2
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations516
- ECCN Code3A991.A.2
- Terminal FinishTIN COPPER/TIN SILVER
- HTS Code8542.31.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage1V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)40
- JESD-30 CodeS-PBGA-B516
- Supply Voltage-Max (Vsup)1.05V
- Supply Voltage-Min (Vsup)0.95V
- Speed266MHz
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR, RISC
- Core ProcessorPowerPC e300c2
- Clock Frequency66.67MHz
- Bit Size32
- Boundary ScanYES
- Low Power ModeYES
- FormatFLOATING POINT
- Integrated CacheYES
- Voltage - I/O1.8V 2.5V 3.3V
- Ethernet10/100Mbps (3)
- Number of Cores/Bus Width1 Core 32-Bit
- Graphics AccelerationNo
- RAM ControllersDDR, DDR2
- USBUSB 2.0 (1)
- Additional InterfacesDUART, I2C, PCI, SPI, TDM, UART
- Co-Processors/DSPCommunications; QUICC Engine
- Height Seated (Max)2.55mm
- Length27mm
- RoHS StatusROHS3 Compliant
MPC8323CVRADDCA Overview
The packaging for this particular product is a tray, and its part status is currently active. It can withstand a peak reflow temperature of 260 degrees Celsius. In terms of its function, this is a microprocessor with a RISC architecture. Its clock frequency is 66.67MHz, and it is capable of handling Ethernet connections at speeds of 10/100Mbps. It has a single core with a 32-bit bus width, and it also includes a co-processor or DSP specifically designed for communication tasks, known as the QUICC Engine. When seated, its maximum height is 2.55mm. Additionally, this product is compliant with the latest RoHS regulations (ROHS3).
MPC8323CVRADDCA Features
PowerPC e300c2 Core
32-Bit Structure
MPC8323CVRADDCA Applications
There are a lot of NXP USA Inc. MPC8323CVRADDCA Microprocessor applications.
Measurement and control field
Aerospace navigation systems
Guidance-GPS
Light sensing & controlling devices
Dialysis machines (performs function of liver)
Computer/laptop
Pacemakers (used to control abnormal heart rhythm)
Auto-breaking system
Automatic staplers
Process control devices
The packaging for this particular product is a tray, and its part status is currently active. It can withstand a peak reflow temperature of 260 degrees Celsius. In terms of its function, this is a microprocessor with a RISC architecture. Its clock frequency is 66.67MHz, and it is capable of handling Ethernet connections at speeds of 10/100Mbps. It has a single core with a 32-bit bus width, and it also includes a co-processor or DSP specifically designed for communication tasks, known as the QUICC Engine. When seated, its maximum height is 2.55mm. Additionally, this product is compliant with the latest RoHS regulations (ROHS3).
MPC8323CVRADDCA Features
PowerPC e300c2 Core
32-Bit Structure
MPC8323CVRADDCA Applications
There are a lot of NXP USA Inc. MPC8323CVRADDCA Microprocessor applications.
Measurement and control field
Aerospace navigation systems
Guidance-GPS
Light sensing & controlling devices
Dialysis machines (performs function of liver)
Computer/laptop
Pacemakers (used to control abnormal heart rhythm)
Auto-breaking system
Automatic staplers
Process control devices
MPC8323CVRADDCA More Descriptions
MPU PowerQUICC II Pro MPC83xx Processor RISC 32bit 90nm 266MHz 1.8V/2.5V/3.3V 516-Pin TEBGA Tray
Microprocessors - MPU MPC8323CVRADDCA/BGA516///TRAY MULTIPLE DP BAKEABLE
PowerQUICC, 32 Bit Power Architecture SoC, 266MHz e300, QE, PCI, USB2.0, DDR, UTOPIA, -40-105C
Microprocessors - MPU MPC8323CVRADDCA/BGA516///TRAY MULTIPLE DP BAKEABLE
PowerQUICC, 32 Bit Power Architecture SoC, 266MHz e300, QE, PCI, USB2.0, DDR, UTOPIA, -40-105C
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
13 December 2023
74HC00 Pin Configuration, Replacements, Applications and Other Details
Ⅰ. Overview of 74HC00Ⅱ. Pin configuration and functions of 74HC00Ⅲ. What are the features of 74HC00?Ⅳ. Technical parameters of 74HC00Ⅴ. Working principle of 74HC00Ⅵ. Absolute maximum ratings of... -
13 December 2023
2N2222A NPN Transistor Features, Technical Parameters, Working Principle, Applications and Usage
Ⅰ. Overview of 2N2222A transistorⅡ. Symbol, footprint and pin configuration of 2N2222A transistorⅢ. What are the features of 2N2222A transistor?Ⅳ. Technical parameters of 2N2222A transistorⅤ. How does the... -
14 December 2023
AT24C256 EEPROM Features, Functions, Working Principle, Applications and AT24C256 vs 24LC256
Ⅰ. What is programmable read-only memory?Ⅱ. Overview of AT24C256 EEPROMⅢ. Pin configuration of AT24C256 EEPROMⅣ. What are the features of AT24C256 EEPROM?Ⅴ. Functions of AT24C256 EEPROMⅥ. Working principle... -
14 December 2023
An Introduction to the A3144 Magnetic Hall Effect Sensor
Ⅰ. What is a Hall sensor?Ⅱ. Overview of A3144 Hall effect sensorⅢ. Manufacturer of A3144 Hall effect sensorⅣ. What are the features of A3144 Hall effect sensor?Ⅴ. Pin...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.