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MPC8309VMADDCA

NXP USA Inc. MPC8309VMADDCA

Part Number:
MPC8309VMADDCA
Manufacturer:
NXP USA Inc.
Ventron No:
3160853-MPC8309VMADDCA
Description:
IC MPU MPC83XX 266MHZ 489BGA
ECAD Model:
Datasheet:
MPC8309VMADDCA

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Specifications
NXP USA Inc. MPC8309VMADDCA technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC8309VMADDCA.
  • Factory Lead Time
    10 Weeks
  • Package / Case
    489-LFBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~105°C TA
  • Packaging
    Tray
  • Published
    2002
  • Series
    MPC83xx
  • JESD-609 Code
    e2
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    489
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    TIN COPPER/TIN SILVER
  • HTS Code
    8542.31.00.01
  • Subcategory
    Microprocessors
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1V
  • Terminal Pitch
    0.8mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    MPC8309
  • JESD-30 Code
    S-PBGA-B489
  • Supply Voltage-Max (Vsup)
    1.05V
  • Power Supplies
    1V
  • Supply Voltage-Min (Vsup)
    0.95V
  • Speed
    266MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Core Processor
    PowerPC e300c3
  • Clock Frequency
    66.67MHz
  • Bit Size
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • Format
    FLOATING POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    1.8V 3.3V
  • Ethernet
    10/100Mbps (3)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DDR2
  • USB
    USB 2.0 (1)
  • Additional Interfaces
    CAN, DUART, I2C, MMC/SD, PCI, SPI, TDM
  • Co-Processors/DSP
    Communications; QUICC Engine
  • Height Seated (Max)
    1.61mm
  • Length
    19mm
  • RoHS Status
    ROHS3 Compliant
Description
MPC8309VMADDCA Overview
Our product features a tray packaging for easy handling and storage. The terminal finish is TIN COPPER/TIN SILVER, ensuring high-quality and reliable connections. The technology utilized is CMOS, known for its low power consumption and high performance. With a peak reflow temperature of 260 degrees Celsius and a maximum reflow time of 40 seconds, our product is designed to withstand extreme conditions. The supply voltage-minimum is 0.95V, providing a wide range of compatibility. The core processor is a PowerPC e300c3, offering efficient processing capabilities. Our product also boasts a low power mode and a voltage range of 1.8V to 3.3V for I/O operations. Please note that this product does not include graphics acceleration.

MPC8309VMADDCA Features
PowerPC e300c3 Core
32-Bit Structure

MPC8309VMADDCA Applications
There are a lot of NXP USA Inc. MPC8309VMADDCA Microprocessor applications.

Air fryers
Automobile
Leakage current tester
Electronic jamming systems
Refrigerators
Tape drives
Day to day life field
Smoke alarms
Traditional industrial transformation
Hearing aids
MPC8309VMADDCA More Descriptions
MPU MPC83xx RISC 32-Bit 0.09um 266MHz 1.8V/3.3V 489-Pin MAPBGA Tray
PowerQUICC, Power Arch SoC, 266MHz, DDR2 w/ECC, PCI, HDLC, TDM, Enet, USB, CAN, 0 to 105C, Rev 1.1
Microprocessors - MPU E300 MP 266
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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