NXP USA Inc. MPC8271CZQMIBA

MPC8271CZQMIBA Overview
NXP USA Inc. is a well-known brand in the technology industry, particularly in the field of Embedded - Microprocessors. This specific part is a chip that falls under the category of Embedded - Microprocessors, showcasing its advanced and innovative capabilities. The package or case of this chip is 516-BBGA, indicating its compact and efficient design. It is also packaged in a tray, making it convenient for handling and storage. As part of the MPC82xx series, this chip boasts high performance and reliability. It has a Moisture Sensitivity Level (MSL) of 3, which means it can withstand 168 hours of exposure to moisture without any damage. This demonstrates the durability and resilience of the chip, making it suitable for various applications. The core processor of this chip is the PowerPC G2_LE, which is known for its efficient and powerful processing capabilities. It does not have graphics acceleration, but it has RAM controllers for DRAM and SDRAM, allowing for efficient data management and storage. In terms of additional interfaces, this chip offers a wide range of options such as I2C, SCC, SMC, SPI, UART, and USART, making it versatile and adaptable for different systems. It also has co-processors or DSP for communications and RISC CPM, making it suitable for complex and demanding tasks. It is important to note that this chip is currently Non-RoHS Compliant, but it is still a reliable and high-quality option for various industries. With all these parameters, it is evident that the NXP USA Inc. chip is a top-notch choice for those in need of a high-performance Embedded - Microprocessor.

MPC8271CZQMIBA Features
PowerPC G2_LE Core

MPC8271CZQMIBA Applications
There are a lot of NXP USA Inc. MPC8271CZQMIBA Microprocessor applications.

Computers and laptops-video calling, email, blogging
Computed Tomography (CT scan)
Automobile
Calculator
Ipad
Electronic jamming systems
Wastewater treatment
Projector
Projectors
Entertainment-radios, CD players, televisions