MPC8260ACVVMHBB

NXP USA Inc. MPC8260ACVVMHBB

Part Number:
MPC8260ACVVMHBB
Manufacturer:
NXP USA Inc.
Ventron No:
3666346-MPC8260ACVVMHBB
Description:
IC MPU MPC82XX 266MHZ 408TBGA
ECAD Model:
Datasheet:
MPC8260A Series

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Specifications
NXP USA Inc. MPC8260ACVVMHBB technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. MPC8260ACVVMHBB.
  • Package / Case
    480-LBGA Exposed Pad
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~105°C TA
  • Packaging
    Tray
  • Published
    1994
  • Series
    MPC82xx
  • JESD-609 Code
    e1
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    480
  • ECCN Code
    3A991.A.2
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    2.5V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    PC8260
  • JESD-30 Code
    S-PBGA-B480
  • Supply Voltage-Max (Vsup)
    2.7V
  • Supply Voltage-Min (Vsup)
    2.4V
  • Speed
    266MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Core Processor
    PowerPC G2
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    YES
  • External Data Bus Width
    64
  • Format
    FLOATING POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10/100Mbps (3)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM, SDRAM
  • Additional Interfaces
    I2C, SCC, SMC, SPI, UART, USART
  • Co-Processors/DSP
    Communications; RISC CPM
  • Height Seated (Max)
    1.65mm
  • Length
    37.5mm
  • RoHS Status
    ROHS3 Compliant
Description
MPC8260ACVVMHBB Overview
The Moisture Sensitivity Level (MSL) of this product is 3, which means it can withstand exposure to moisture for up to 168 hours. The Terminal Finish is Tin/Silver/Copper (Sn/Ag/Cu), providing a reliable and durable coating for the terminals. The technology used in this product is CMOS, ensuring efficient and low-power operation. The Terminal Form is BALL, allowing for easy and secure connections. The Peak Reflow Temperature (Cel) is 260, ensuring that the product can withstand high-temperature reflow processes without any damage. This product falls under the uPs/uCs/Peripheral ICs Type category, specifically as a MICROPROCESSOR, RISC. The Core Processor used in this product is the PowerPC G2, providing high-performance processing capabilities. It also features Boundary Scan technology, allowing for efficient testing and debugging. Although it does not have Graphics Acceleration capabilities, it still offers reliable and efficient performance. Lastly, the length of this product is 37.5mm, making it compact and suitable for various applications.

MPC8260ACVVMHBB Features
PowerPC G2 Core

MPC8260ACVVMHBB Applications
There are a lot of NXP USA Inc. MPC8260ACVVMHBB Microprocessor applications.

Computed Tomography (CT scan)
DDC control
Blood pressure monitors
Television
Temperature sensing and controlling devices
Monitoring-temperature level, oil level, speed, distance, acceleration
Entertainment-radios, CD players, televisions
Digital TVs
Set-top boxes
3D printers
MPC8260ACVVMHBB More Descriptions
MPU PowerQUICC II MPC82xx Processor RISC 32-Bit 0.25um 266MHz 3.3V 480-Pin TBGA Tray
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 266MHz 408-TBGA (37.5x37.5)
FLOATING POINT MICROPROCESSOR RISC 1Core 32-Bit BALL IC Microprocessor -40C~105C TA 37.5mm 2.4V 266MHz
Embedded Networking Processor; Series:MPC82; No. of Bits:32; Frequency Typ:266MHz; Cache Memory On Chip L1/L2:32KB; No. of I/O Pins:120; Supply Voltage Min:3.135V; Supply Voltage Max:3.465V; Termination Type:SMD; Package/Case:BGA ;RoHS Compliant: Yes
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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