MC10EL15DR2G
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ON Semiconductor MC10EL15DR2G

Part Number:
MC10EL15DR2G
Manufacturer:
ON Semiconductor
Ventron No:
2974879-MC10EL15DR2G
Description:
IC CLK BUFFER 2:4 1.25GHZ 16SOIC
ECAD Model:
Datasheet:
MC10EL15DR2G
Payment:
Payment
Delivery:
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Part Overview
Description
The MC10EL/100EL15 is a low skew 1:4 clock distribution chip designed explicitly for low skew clock distribution applications. The VBB pin, an internally generated voltage supply, is available to this device only. For singleended input conditions, the unused differential input is connected to Vag as a switching reference voltage. Vag may also rebias AC coupled inputs. When used, decouple VBB and Vcc via a 0.01 μF capacitor and limit current sourcing or sinking to 0.5 mA. When not used, VBB should be left open.
The EL15 features a multiplexed clock input to allow for the distribution of a lower speed scan or test clock along with the highspeed system clock. When LOW (or left open and pulled LOW by the input pulldown resistor) the SEL pin will select the differential clock input.
The common enable (EN) is synchronous so that the outputs will only be enabled/disabled when they are already in the LOW state. This avoids any chance of generating a runt clock pulse when the device is enabled/disabled as can happen with an asynchronous control. The internal flip flop is clocked on the falling edge of the input clock, therefore all associated specification limits are referenced to the negative edge of the clock input.
The 100 series contains temperature compensation.

Features
50 ps OutputtoOutput Skew
Synchronous Enable/Disable
Multiplexed Clock Input
PECL Mode Operating Range:
Vcc 4.2 V to 5.7 V with VEE = 0 V
NECL Mode Operating Range:
Vcc 0 V with VEE = 4.2 V to 5.7 V
Internal Input Pulldown Resistors on CLKS, SCLK, SEL, and EN
PbFree, Halogen Free, and RoHS Compliant

Applications
Clock distribution in highspeed systems
Scan and test clock distribution
Multiplexing of multiple clock sources
Specifications
ON Semiconductor MC10EL15DR2G technical specifications, attributes, parameters and parts with similar specifications to ON Semiconductor MC10EL15DR2G.
  • Factory Lead Time
    18 Weeks
  • Lifecycle Status
    ACTIVE (Last Updated: 3 days ago)
  • Mount
    Surface Mount
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    16-SOIC (0.154, 3.90mm Width)
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    16
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C
  • Packaging
    Tape & Reel (TR)
  • Published
    2005
  • Series

    Series, in the context of electronic components, refers to the arrangement of components in a circuit. When components are connected in series, they form a single path for current to flow through. The total resistance of a series circuit is the sum of the individual resistances of each component. Series connections are often used to control the flow of current in a circuit, as the total resistance can be adjusted by changing the number or type of components in the series.

    10EL
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    16
  • Terminal Finish
    Tin (Sn)
  • Subcategory
    Clock Drivers
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    ECL
  • Voltage - Supply
    4.2V~5.7V
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    5V
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    MC10EL15
  • Output
    ECL, PECL
  • Pin Count
    16
  • Number of Outputs

    Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

    4
  • Supply Voltage-Max (Vsup)
    5.7V
  • Power Supplies
    -5.2V
  • Number of Circuits

    Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.

    1
  • Propagation Delay
    750 ps
  • Frequency (Max)
    1.25GHz
  • Halogen Free
    Halogen Free
  • Input
    ECL, PECL
  • Ratio - Input:Output
    2:4
  • Differential - Input:Output
    Yes/Yes
  • Same Edge Skew-Max (tskwd)
    0.05 ns
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    9.9mm
  • Width
    3.9mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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