M2GL025-1FCSG325

Microsemi Corporation M2GL025-1FCSG325

Part Number:
M2GL025-1FCSG325
Manufacturer:
Microsemi Corporation
Ventron No:
3126827-M2GL025-1FCSG325
Description:
IC FPGA 180 I/O 325FCBGA
ECAD Model:
Datasheet:
M2GL025-1FCSG325

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Specifications
Microsemi Corporation M2GL025-1FCSG325 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2GL025-1FCSG325.
  • Factory Lead Time
    9 Weeks
  • Lifecycle Status
    IN PRODUCTION (Last Updated: 1 month ago)
  • Mounting Type
    Surface Mount
  • Package / Case
    324-LFBGA, CSPBGA
  • Surface Mount
    YES
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2015
  • Series
    IGLOO2
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    325
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    1.14V~2.625V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    1.2V
  • Reflow Temperature-Max (s)
    30
  • JESD-30 Code
    S-PBGA-B325
  • Number of Outputs
    180
  • Qualification Status
    Not Qualified
  • Power Supplies
    1.2V
  • Number of I/O
    180
  • Number of Inputs
    180
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    27696
  • Total RAM Bits
    1130496
  • RoHS Status
    RoHS Compliant
Description
M2GL025-1FCSG325 Overview
In 2015, a new technology was introduced in the market known as CMOS, which stands for Complementary Metal-Oxide-Semiconductor. This technology has gained popularity due to its low power consumption and high speed performance. One of the key features of this technology is its Moisture Sensitivity Level (MSL) of 3, which means that it can withstand exposure to moisture for 168 hours without any damage. The terminal position of this technology is at the bottom, making it easier to connect to other components. It has a peak reflow temperature of 260 degrees Celsius and a maximum reflow time of 30 seconds. This technology follows the JESD-30 Code of S-PBGA-B325 and has 180 outputs. It requires a power supply of 1.2V and has a total of 27696 logic elements or cells. With these impressive specifications, it is no wonder that CMOS technology has become a popular choice in the electronics industry.

M2GL025-1FCSG325 Features
180 I/Os
Up to 1130496 RAM bits

M2GL025-1FCSG325 Applications
There are a lot of Microsemi Corporation M2GL025-1FCSG325 FPGAs applications.

Space Applications
Solar Energy
Data center hardware accelerators
Digital signal processing
Server Applications
Broadcast
High Performance Computing
Artificial intelligence (AI)
Industrial Ethernet
Military DSP
M2GL025-1FCSG325 More Descriptions
M2Gl025-1Fcsg325 325 Tfbga 11X11X1.01Mm Tray Rohs Compliant: Yes |Microchip M2GL025-1FCSG325
IGLOO2 Low Density FPGA, 27.6KLEs
IC FPGA 180 I/O 324CSBGA
IC FPGA 180 I/O 325FCBGA
IC FPGA 180 I/O 325BGA
Product Comparison
The three parts on the right have similar specifications to M2GL025-1FCSG325.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Lifecycle Status
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    Series
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    HTS Code
    Subcategory
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Reflow Temperature-Max (s)
    JESD-30 Code
    Number of Outputs
    Qualification Status
    Power Supplies
    Number of I/O
    Number of Inputs
    Programmable Logic Type
    Number of Logic Elements/Cells
    Total RAM Bits
    RoHS Status
    Terminal Pitch
    Time@Peak Reflow Temperature-Max (s)
    Length
    Height Seated (Max)
    Width
    View Compare
  • M2GL025-1FCSG325
    M2GL025-1FCSG325
    9 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    Surface Mount
    324-LFBGA, CSPBGA
    YES
    0°C~85°C TJ
    Tray
    2015
    IGLOO2
    Active
    3 (168 Hours)
    325
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    1.14V~2.625V
    BOTTOM
    BALL
    260
    1.2V
    30
    S-PBGA-B325
    180
    Not Qualified
    1.2V
    180
    180
    FIELD PROGRAMMABLE GATE ARRAY
    27696
    1130496
    RoHS Compliant
    -
    -
    -
    -
    -
    -
  • M2GL050TS-FG484
    12 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    Surface Mount
    484-BGA
    YES
    0°C~85°C TJ
    Tray
    2015
    IGLOO2
    Active
    3 (168 Hours)
    484
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    1.14V~2.625V
    BOTTOM
    BALL
    240
    1.2V
    -
    S-PBGA-B484
    267
    Not Qualified
    1.2V
    267
    267
    FIELD PROGRAMMABLE GATE ARRAY
    56340
    1869824
    Non-RoHS Compliant
    1mm
    20
    23mm
    2.44mm
    23mm
  • M2GL025-1VF256
    9 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    Surface Mount
    256-LFBGA
    YES
    0°C~85°C TJ
    Tray
    2015
    IGLOO2
    Active
    3 (168 Hours)
    256
    8542.39.00.01
    -
    -
    1.14V~2.625V
    BOTTOM
    BALL
    240
    1.2V
    -
    S-PBGA-B256
    -
    -
    -
    138
    -
    FIELD PROGRAMMABLE GATE ARRAY
    27696
    1130496
    Non-RoHS Compliant
    0.8mm
    20
    14mm
    1.56mm
    14mm
  • M2GL025T-1FCSG325I
    12 Weeks
    IN PRODUCTION (Last Updated: 1 month ago)
    Surface Mount
    324-LFBGA, CSPBGA
    YES
    -40°C~100°C TJ
    Tray
    2015
    IGLOO2
    Active
    3 (168 Hours)
    325
    8542.39.00.01
    Field Programmable Gate Arrays
    CMOS
    1.14V~2.625V
    BOTTOM
    BALL
    260
    1.2V
    30
    S-PBGA-B325
    180
    Not Qualified
    1.2V
    180
    180
    FIELD PROGRAMMABLE GATE ARRAY
    27696
    1130496
    RoHS Compliant
    -
    -
    -
    -
    -
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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