Microsemi Corporation M2GL025-1FCSG325
- Part Number:
- M2GL025-1FCSG325
- Manufacturer:
- Microsemi Corporation
- Ventron No:
- 3126827-M2GL025-1FCSG325
- Description:
- IC FPGA 180 I/O 325FCBGA
- Datasheet:
- M2GL025-1FCSG325
Microsemi Corporation M2GL025-1FCSG325 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation M2GL025-1FCSG325.
- Factory Lead Time9 Weeks
- Lifecycle StatusIN PRODUCTION (Last Updated: 1 month ago)
- Mounting TypeSurface Mount
- Package / Case324-LFBGA, CSPBGA
- Surface MountYES
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2015
- SeriesIGLOO2
- Part StatusActive
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations325
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.14V~2.625V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage1.2V
- Reflow Temperature-Max (s)30
- JESD-30 CodeS-PBGA-B325
- Number of Outputs180
- Qualification StatusNot Qualified
- Power Supplies1.2V
- Number of I/O180
- Number of Inputs180
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells27696
- Total RAM Bits1130496
- RoHS StatusRoHS Compliant
M2GL025-1FCSG325 Overview
In 2015, a new technology was introduced in the market known as CMOS, which stands for Complementary Metal-Oxide-Semiconductor. This technology has gained popularity due to its low power consumption and high speed performance. One of the key features of this technology is its Moisture Sensitivity Level (MSL) of 3, which means that it can withstand exposure to moisture for 168 hours without any damage. The terminal position of this technology is at the bottom, making it easier to connect to other components. It has a peak reflow temperature of 260 degrees Celsius and a maximum reflow time of 30 seconds. This technology follows the JESD-30 Code of S-PBGA-B325 and has 180 outputs. It requires a power supply of 1.2V and has a total of 27696 logic elements or cells. With these impressive specifications, it is no wonder that CMOS technology has become a popular choice in the electronics industry.
M2GL025-1FCSG325 Features
180 I/Os
Up to 1130496 RAM bits
M2GL025-1FCSG325 Applications
There are a lot of Microsemi Corporation M2GL025-1FCSG325 FPGAs applications.
Space Applications
Solar Energy
Data center hardware accelerators
Digital signal processing
Server Applications
Broadcast
High Performance Computing
Artificial intelligence (AI)
Industrial Ethernet
Military DSP
In 2015, a new technology was introduced in the market known as CMOS, which stands for Complementary Metal-Oxide-Semiconductor. This technology has gained popularity due to its low power consumption and high speed performance. One of the key features of this technology is its Moisture Sensitivity Level (MSL) of 3, which means that it can withstand exposure to moisture for 168 hours without any damage. The terminal position of this technology is at the bottom, making it easier to connect to other components. It has a peak reflow temperature of 260 degrees Celsius and a maximum reflow time of 30 seconds. This technology follows the JESD-30 Code of S-PBGA-B325 and has 180 outputs. It requires a power supply of 1.2V and has a total of 27696 logic elements or cells. With these impressive specifications, it is no wonder that CMOS technology has become a popular choice in the electronics industry.
M2GL025-1FCSG325 Features
180 I/Os
Up to 1130496 RAM bits
M2GL025-1FCSG325 Applications
There are a lot of Microsemi Corporation M2GL025-1FCSG325 FPGAs applications.
Space Applications
Solar Energy
Data center hardware accelerators
Digital signal processing
Server Applications
Broadcast
High Performance Computing
Artificial intelligence (AI)
Industrial Ethernet
Military DSP
M2GL025-1FCSG325 More Descriptions
M2Gl025-1Fcsg325 325 Tfbga 11X11X1.01Mm Tray Rohs Compliant: Yes |Microchip M2GL025-1FCSG325
IGLOO2 Low Density FPGA, 27.6KLEs
IC FPGA 180 I/O 324CSBGA
IC FPGA 180 I/O 325FCBGA
IC FPGA 180 I/O 325BGA
IGLOO2 Low Density FPGA, 27.6KLEs
IC FPGA 180 I/O 324CSBGA
IC FPGA 180 I/O 325FCBGA
IC FPGA 180 I/O 325BGA
The three parts on the right have similar specifications to M2GL025-1FCSG325.
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ImagePart NumberManufacturerFactory Lead TimeLifecycle StatusMounting TypePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesPart StatusMoisture Sensitivity Level (MSL)Number of TerminationsHTS CodeSubcategoryTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageReflow Temperature-Max (s)JESD-30 CodeNumber of OutputsQualification StatusPower SuppliesNumber of I/ONumber of InputsProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsRoHS StatusTerminal PitchTime@Peak Reflow Temperature-Max (s)LengthHeight Seated (Max)WidthView Compare
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M2GL025-1FCSG3259 WeeksIN PRODUCTION (Last Updated: 1 month ago)Surface Mount324-LFBGA, CSPBGAYES0°C~85°C TJTray2015IGLOO2Active3 (168 Hours)3258542.39.00.01Field Programmable Gate ArraysCMOS1.14V~2.625VBOTTOMBALL2601.2V30S-PBGA-B325180Not Qualified1.2V180180FIELD PROGRAMMABLE GATE ARRAY276961130496RoHS Compliant------
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12 WeeksIN PRODUCTION (Last Updated: 1 month ago)Surface Mount484-BGAYES0°C~85°C TJTray2015IGLOO2Active3 (168 Hours)4848542.39.00.01Field Programmable Gate ArraysCMOS1.14V~2.625VBOTTOMBALL2401.2V-S-PBGA-B484267Not Qualified1.2V267267FIELD PROGRAMMABLE GATE ARRAY563401869824Non-RoHS Compliant1mm2023mm2.44mm23mm
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9 WeeksIN PRODUCTION (Last Updated: 1 month ago)Surface Mount256-LFBGAYES0°C~85°C TJTray2015IGLOO2Active3 (168 Hours)2568542.39.00.01--1.14V~2.625VBOTTOMBALL2401.2V-S-PBGA-B256---138-FIELD PROGRAMMABLE GATE ARRAY276961130496Non-RoHS Compliant0.8mm2014mm1.56mm14mm
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12 WeeksIN PRODUCTION (Last Updated: 1 month ago)Surface Mount324-LFBGA, CSPBGAYES-40°C~100°C TJTray2015IGLOO2Active3 (168 Hours)3258542.39.00.01Field Programmable Gate ArraysCMOS1.14V~2.625VBOTTOMBALL2601.2V30S-PBGA-B325180Not Qualified1.2V180180FIELD PROGRAMMABLE GATE ARRAY276961130496RoHS Compliant-----
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