Micron Technology Inc. M29W640FB70ZA6E
- Part Number:
- M29W640FB70ZA6E
- Manufacturer:
- Micron Technology Inc.
- Ventron No:
- 3245802-M29W640FB70ZA6E
- Description:
- IC FLASH 64MBIT 70NS 48TFBGA
- Datasheet:
- M29W640FB70ZA6E
Micron Technology Inc. M29W640FB70ZA6E technical specifications, attributes, parameters and parts with similar specifications to Micron Technology Inc. M29W640FB70ZA6E.
- Contact PlatingCopper, Silver, Tin
- Mounting TypeSurface Mount
- Package / Case48-TFBGA
- Surface MountYES
- Number of Pins48
- Operating Temperature-40°C~85°C TA
- PackagingTray
- Published2008
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations48
- ECCN Code3A991.B.1.A
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- Additional FeatureBOTTOM BOOT BLOCK
- HTS Code8542.32.00.51
- TechnologyFLASH - NOR
- Voltage - Supply2.7V~3.6V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)260
- Number of Functions1
- Supply Voltage3V
- Terminal Pitch0.8mm
- Time@Peak Reflow Temperature-Max (s)30
- Base Part NumberM29W640
- Pin Count48
- Power Supplies3/3.3V
- Voltage2.7V
- Memory Size64Mb 8M x 8 4M x 16
- Nominal Supply Current10mA
- Memory TypeNon-Volatile
- Memory FormatFLASH
- Memory InterfaceParallel
- Organization4MX16
- Memory Width16
- Write Cycle Time - Word, Page70ns
- Density64 Mb
- Standby Current-Max0.0001A
- Access Time (Max)70 ns
- Sync/AsyncAsynchronous
- Alternate Memory Width8
- Data PollingYES
- Toggle BitYES
- Command User InterfaceYES
- Number of Sectors/Size8127
- Sector Size8K64K
- Page Size4/8words
- Ready/BusyYES
- Boot BlockBOTTOM
- Common Flash InterfaceYES
- Length8mm
- Height Seated (Max)1.2mm
- Width6mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
M29W640FB70ZA6E Overview
In terms of its memory type, it can be classified as Non-Volatile. The case comes in Tray size. The case is embedded in 48-TFBGA. Memory size on the chip is 64Mb 8M x 8 4M x 16. This device uses takes advantage of the FLASH format. The device's extended operating temperature range of -40°C~85°C TA makes it ideal for many demanding applications. The device is capable of handling a supply voltage of 2.7V~3.6V. The recommended mounting type for this device is Surface Mount. On the chip, there are 48 terminations. The comprehensive working procedure is supported by 1 functions in this part. A voltage of 3V is required for the operation of this memory device. It is common to select similar parts by referring to the device's base part number, M29W640. An 48-pin package is used to package this memory device. A memory device like this has 48 pins, indicating that there are 48 memory locations on the device. As far as its nominal supply current is concerned, this memory component carries a rating of 10mA. It also features BOTTOM BOOT BLOCK to boost system performance despite all its merits. This memory chip requires only 3/3.3V of power. A total of 8127 specific sizes of divisions are present in this memory. When ic memory chip comes to voltage, the chip works well under an operating voltage of 2.7V volts.
M29W640FB70ZA6E Features
Package / Case: 48-TFBGA
48 Pins
Additional Feature:BOTTOM BOOT BLOCK
M29W640FB70ZA6E Applications
There are a lot of Micron Technology Inc.
M29W640FB70ZA6E Memory applications.
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
In terms of its memory type, it can be classified as Non-Volatile. The case comes in Tray size. The case is embedded in 48-TFBGA. Memory size on the chip is 64Mb 8M x 8 4M x 16. This device uses takes advantage of the FLASH format. The device's extended operating temperature range of -40°C~85°C TA makes it ideal for many demanding applications. The device is capable of handling a supply voltage of 2.7V~3.6V. The recommended mounting type for this device is Surface Mount. On the chip, there are 48 terminations. The comprehensive working procedure is supported by 1 functions in this part. A voltage of 3V is required for the operation of this memory device. It is common to select similar parts by referring to the device's base part number, M29W640. An 48-pin package is used to package this memory device. A memory device like this has 48 pins, indicating that there are 48 memory locations on the device. As far as its nominal supply current is concerned, this memory component carries a rating of 10mA. It also features BOTTOM BOOT BLOCK to boost system performance despite all its merits. This memory chip requires only 3/3.3V of power. A total of 8127 specific sizes of divisions are present in this memory. When ic memory chip comes to voltage, the chip works well under an operating voltage of 2.7V volts.
M29W640FB70ZA6E Features
Package / Case: 48-TFBGA
48 Pins
Additional Feature:BOTTOM BOOT BLOCK
M29W640FB70ZA6E Applications
There are a lot of Micron Technology Inc.
M29W640FB70ZA6E Memory applications.
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DVD disk buffer
M29W640FB70ZA6E More Descriptions
NOR Flash Parallel 3V/3.3V 64Mbit 8M/4M x 8bit/16bit 70ns 48-Pin TFBGA Tray
Flash, 4MX16, 70ns, PBGA48
64 MBIT (8MB X8 OR 4MB X16, BOT BOOT BLOCK) 3VNOR Flash STD FLASH
Flash, 4MX16, 70ns, PBGA48
64 MBIT (8MB X8 OR 4MB X16, BOT BOOT BLOCK) 3V
The three parts on the right have similar specifications to M29W640FB70ZA6E.
-
ImagePart NumberManufacturerContact PlatingMounting TypePackage / CaseSurface MountNumber of PinsOperating TemperaturePackagingPublishedJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishAdditional FeatureHTS CodeTechnologyVoltage - SupplyTerminal PositionPeak Reflow Temperature (Cel)Number of FunctionsSupply VoltageTerminal PitchTime@Peak Reflow Temperature-Max (s)Base Part NumberPin CountPower SuppliesVoltageMemory SizeNominal Supply CurrentMemory TypeMemory FormatMemory InterfaceOrganizationMemory WidthWrite Cycle Time - Word, PageDensityStandby Current-MaxAccess Time (Max)Sync/AsyncAlternate Memory WidthData PollingToggle BitCommand User InterfaceNumber of Sectors/SizeSector SizePage SizeReady/BusyBoot BlockCommon Flash InterfaceLengthHeight Seated (Max)WidthRadiation HardeningRoHS StatusLead FreeSupply Current-MaxView Compare
-
M29W640FB70ZA6ECopper, Silver, TinSurface Mount48-TFBGAYES48-40°C~85°C TATray2008e1yesObsolete3 (168 Hours)483A991.B.1.ATin/Silver/Copper (Sn/Ag/Cu)BOTTOM BOOT BLOCK8542.32.00.51FLASH - NOR2.7V~3.6VBOTTOM26013V0.8mm30M29W640483/3.3V2.7V64Mb 8M x 8 4M x 1610mANon-VolatileFLASHParallel4MX161670ns64 Mb0.0001A70 nsAsynchronous8YESYESYES81278K64K4/8wordsYESBOTTOMYES8mm1.2mm6mmNoROHS3 CompliantLead Free--
-
-Surface Mount56-TFSOP (0.724, 18.40mm Width)---40°C~125°C TATape & Reel (TR)2015--Obsolete3 (168 Hours)-----FLASH - NOR2.7V~3.6V------M29W128---128Mb 16M x 8 8M x 16-Non-VolatileFLASHParallel--70ns------------------ROHS3 Compliant--
-
-Surface Mount64-LBGA---40°C~85°C TATape & Reel (TR)2015--Obsolete3 (168 Hours)-----FLASH - NOR2.7V~3.6V------M29W128---128Mb 16M x 8 8M x 16-Non-VolatileFLASHParallel--70ns------------------ROHS3 Compliant--
-
-Surface Mount64-TBGAYES64-40°C~85°C TATray2013e1yesObsolete3 (168 Hours)643A991.B.1.ATIN SILVER COPPER-8542.32.00.51FLASH - NOR2.7V~3.6VBOTTOM26013V1mm30M29W128643/3.3V2.7V128Mb 16M x 8 8M x 16-Non-VolatileFLASHParallel8KX161660ns128 Mb0.0001A60 ns-8YESYESYES128128K8/16wordsYES-YES13mm1.2mm10mmNoROHS3 Compliant-0.02mA
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