0 Shopping Cart

STMicroelectronics M24LR64E-RMN6T/2

Part Number:

M24LR64E-RMN6T/2

Manufacturer:

STMicroelectronics

Ventron No:

4410112-M24LR64E-RMN6T/2

Description:

NFC/RFID 64KBIT EEPROM 13.56MHZ

Datasheet:

M24LR64E-RMN6T/2

Payment:

Payment

Delivery:

Delivery

Quick Request Quote

Please send RFQ , We will respond immediately.

Part Number
Quantity
Company
E-mail
Phone
Comments
  • One Stop Service

    One Stop Service

  • Competitive Price

    Competitive Price

  • Source Traceability

    Source Traceability

  • Same Day Delivery

    Same Day Delivery

Specifications

STMicroelectronics M24LR64E-RMN6T/2 technical specifications, attributes, parameters and parts with similar specifications to STMicroelectronics M24LR64E-RMN6T/2.

  • Lifecycle Status
    ACTIVE (Last Updated: 7 months ago)
  • Factory Lead Time
    13 Weeks
  • Mount
    Surface Mount
  • Mounting Type

    Mounting Type refers to the method by which an electronic component is attached to a printed circuit board (PCB) or other surface. Common mounting types include: * Through-hole: Component leads are inserted into holes in the PCB and soldered on the other side. * Surface-mount: Component is placed on the surface of the PCB and soldered in place. * Press-fit: Component is pressed into place on the PCB without soldering. * Socket: Component is inserted into a socket on the PCB, allowing for easy replacement. The mounting type is determined by factors such as the component's size, shape, and power requirements.

    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    8-SOIC (0.154, 3.90mm Width)
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    8
  • Operating Temperature

    Operating Temperature is the range of temperatures at which an electronic component can function properly. It is typically specified in degrees Celsius (°C) and indicates the minimum and maximum temperatures at which the component can operate without experiencing damage or degradation. Operating Temperature is an important parameter to consider when designing electronic circuits, as it ensures that the components will function reliably in the intended operating environment.

    -40°C~85°C
  • Packaging
    Tape & Reel (TR)
  • JESD-609 Code
    e4
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1 (Unlimited)
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • Terminal Finish
    Nickel/Palladium/Gold (Ni/Pd/Au)
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Voltage - Supply
    1.8V~5.5V
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    2.5V
  • Terminal Pitch
    1.27mm
  • Depth
    4mm
  • Frequency

    Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

    13.56MHz
  • Base Part Number
    M24LR64
  • Supply Voltage-Max (Vsup)
    5.5V
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    I2C
  • Memory Size
    8kB
  • Nominal Supply Current
    400μA
  • Access Time

    Access time is the time it takes for a memory device to retrieve data from a specific location. It is typically measured in nanoseconds (ns) and is a critical factor in determining the performance of a computer system. The lower the access time, the faster the memory device can retrieve data and the faster the computer can perform tasks.

    900 ns
  • Organization
    2KX32
  • Density
    64 kb
  • Parallel/Serial
    SERIAL
  • Write Cycle Time-Max (tWC)
    5ms
  • Standards
    ISO 15693, ISO 18000-3, NFC
  • Height

    Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.

    1.5mm
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    5mm
  • Width
    4mm
  • REACH SVHC
    No SVHC
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free

Description

part No. M24LR64E-RMN6T/2 Is this available? : YesShipped from : HK warehouseSame model may have different manufacturers, images only for reference.
M24LR64E-RMN6T/2 More Descriptions
M24LR64E-R Series 64 kb 5.5 V Surface Mount I2C 2 Wire Serial EEPROM - SOIC-8
EEPROM Serial-I2C 64K-bit 8K x 8 2.5V/3.3V/5V 8-Pin SO N T/R
Serial Eeprom, 64Kbit, 400Khz, Soic-8; Memory Configuration:8K X 8Bit; Interfaces:Serial I2C (2-Wire); Clock Frequency Max:400Khz; Ic Case/Package:Soic; No. Of Pins:8Pins; Supply Voltage Min:1.8V; Supply Voltage Max:5.5V Rohs Compliant: Yes |Stmicroelectronics M24LR64E-RMN6T/2

Product Comparison

The three parts on the right have similar specifications to M24LR64E-RMN6T/2.
  • Image
    Part Number
    Manufacturer
    Lifecycle Status
    Factory Lead Time
    Mount
    Mounting Type
    Package / Case
    Number of Pins
    Operating Temperature
    Packaging
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Depth
    Frequency
    Base Part Number
    Supply Voltage-Max (Vsup)
    Interface
    Memory Size
    Nominal Supply Current
    Access Time
    Organization
    Density
    Parallel/Serial
    Write Cycle Time-Max (tWC)
    Standards
    Height
    Length
    Width
    REACH SVHC
    Radiation Hardening
    RoHS Status
    Lead Free
    Memory Width
    Alternate Memory Width
    Height Seated (Max)
    Subcategory
    Peak Reflow Temperature (Cel)
    Pin Count
    Power Supplies
    Standby Current-Max
    Endurance
    Data Retention Time-Min
    Write Protection
    I2C Control Byte
    View Compare
  • M24LR64E-RMN6T/2
    M24LR64E-RMN6T/2
    ACTIVE (Last Updated: 7 months ago)
    13 Weeks
    Surface Mount
    Surface Mount
    8-SOIC (0.154, 3.90mm Width)
    8
    -40°C~85°C
    Tape & Reel (TR)
    e4
    Active
    1 (Unlimited)
    8
    EAR99
    Nickel/Palladium/Gold (Ni/Pd/Au)
    CMOS
    1.8V~5.5V
    DUAL
    GULL WING
    1
    2.5V
    1.27mm
    4mm
    13.56MHz
    M24LR64
    5.5V
    I2C
    8kB
    400μA
    900 ns
    2KX32
    64 kb
    SERIAL
    5ms
    ISO 15693, ISO 18000-3, NFC
    1.5mm
    5mm
    4mm
    No SVHC
    No
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M24LR04E-RMC6T/2
    ACTIVE (Last Updated: 7 months ago)
    8 Weeks
    Surface Mount
    Surface Mount
    8-UFDFN Exposed Pad
    8
    -40°C~85°C
    Tape & Reel (TR)
    -
    Active
    1 (Unlimited)
    8
    EAR99
    -
    CMOS
    1.8V~5.5V
    DUAL
    -
    1
    2.5V
    0.5mm
    3mm
    13.56MHz
    M24LR04
    5.5V
    I2C
    512B
    -
    900 ns
    -
    4 kb
    SERIAL
    5ms
    ISO 15693, ISO 18000-3, NFC
    -
    2mm
    -
    -
    No
    ROHS3 Compliant
    Lead Free
    32
    8
    0.6mm
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • M24LR64-RMB6T/2
    -
    -
    Surface Mount
    Surface Mount
    8-UFDFN Exposed Pad
    8
    -40°C~85°C
    Cut Tape (CT)
    e4
    Obsolete
    1 (Unlimited)
    8
    EAR99
    Nickel/Palladium/Gold (Ni/Pd/Au)
    CMOS
    1.8V~5.5V
    DUAL
    -
    1
    2.5V
    0.5mm
    -
    13.56MHz
    M24LR64
    5.5V
    I2C
    -
    700μA
    900 ns
    2KX32
    64 kb
    SERIAL
    5ms
    ISO 15693, ISO 18000-3, NFC
    -
    3mm
    2mm
    -
    No
    ROHS3 Compliant
    Lead Free
    32
    8
    0.6mm
    EEPROMs
    260
    8
    2/5V
    0.00003A
    1000000 Write/Erase Cycles
    40
    SOFTWARE
    10100DDR
  • M24LR64-RDW6T/2
    -
    -
    Surface Mount
    Surface Mount
    8-TSSOP (0.173, 4.40mm Width)
    8
    -40°C~85°C
    Tape & Reel (TR)
    e4
    Obsolete
    1 (Unlimited)
    8
    EAR99
    Nickel/Palladium/Gold (Ni/Pd/Au)
    CMOS
    1.8V~5.5V
    DUAL
    GULL WING
    1
    2.5V
    0.5mm
    4.4mm
    13.56MHz
    M24LR64
    5.5V
    I2C
    8kB
    700μA
    900 ns
    2KX32
    64 kb
    SERIAL
    5ms
    ISO 15693, ISO 18000-3, NFC
    1.05mm
    3mm
    4.5mm
    No SVHC
    No
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    EEPROMs
    260
    8
    2/5V
    0.00003A
    1000000 Write/Erase Cycles
    40
    SOFTWARE
    1010CDDR

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News