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Texas Instruments LMV1032URX-15/NOPB

Part Number:

LMV1032URX-15/NOPB

Manufacturer:

Texas Instruments

Ventron No:

6404086-LMV1032URX-15/NOPB

Description:

Analog input microphone preamplifier for 3-wire electret microphones

Datasheet:

LMV1032URX-15/NOPB

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Delivery:

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Specifications

Texas Instruments LMV1032URX-15/NOPB technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments LMV1032URX-15/NOPB.

  • Gain range (dB)
    Fixed Gain
  • Input voltage noise (typ) (nV√Hz)
    56
  • Power supply (typ) (V)
    1.7 to 5
  • Iq (typ) (mA)
    60
  • Interface type

    Interface Type refers to the physical and electrical characteristics of the connection between an electronic component and other devices or systems. It specifies the type of connector, pin configuration, voltage levels, signal protocols, and data transfer rates supported by the component. Common interface types include USB, HDMI, Ethernet, RS-232, and I2C. Understanding the Interface Type is crucial for ensuring compatibility and proper communication between components in electronic systems.

    Analog 3 Wire
  • Operating temperature range (°C)
    -40 to 85
  • Rating
    Catalog

Description

The LMV1032s are an audio amplifier series for small form factor electret microphones. They are designed to replace the JFET preamp currently being used. The LMV1032 series is ideal for extended battery life applications, such as a Bluetooth communication link. The addition of a third pin to an electret microphones that incorporates an LMV1032 allows for a dramatic reduction in supply current as compared to the JFET equipped electret microphone. Microphone supply current is thus reduced to 60 µA, assuring longer battery life. The LMV1032 series is specified for supply voltages from 1.7V to 5V, and has fixed voltage gains of 6 dB, 15 dB and 25 dB.

The LMV1032 series offers low output impedance over the voice bandwidth, excellent power supply rejection (PSRR), and stability over temperature.

The devices are offered in space saving 4-bump ultra thin DSBGA lead free packages and are thus ideally suited for the form factor of miniature electret microphone packages. These extremely miniature packages have the Large Dome Bump (LDB) technology. This DSBGA technology is designed for microphone PCBs requiring 1 kg adhesion criteria.

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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