Lattice Semiconductor Corporation LFXP10E-3FN388I
- Part Number:
- LFXP10E-3FN388I
- Manufacturer:
- Lattice Semiconductor Corporation
- Ventron No:
- 3822332-LFXP10E-3FN388I
- Description:
- IC FPGA 244 I/O 388FBGA
- ECAD Model:
-
- Datasheet:
- LFXPxx(C,E) Family
Lattice Semiconductor Corporation LFXP10E-3FN388I technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation LFXP10E-3FN388I.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case388-BBGA
- Number of Pins388
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2007
- SeriesXP
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations388
- ECCN CodeEAR99
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.14V~1.26V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)250
- Supply Voltage1.2V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)40
- Base Part NumberLFXP10
- Pin Count388
- Number of Outputs244
- Qualification StatusNot Qualified
- Operating Supply Voltage1.2V
- Memory Size31.9kB
- Number of I/O244
- RAM Size27kB
- Organization1216 CLBS
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells10000
- Total RAM Bits221184
- Number of Gates4
- Max Frequency320MHz
- Number of Logic Blocks (LABs)1250
- Combinatorial Delay of a CLB-Max0.63 ns
- Number of CLBs1216
- Number of Logic Cells1216
- Height Seated (Max)2.6mm
- Length23mm
- Width23mm
- RoHS StatusRoHS Compliant
- Lead FreeLead Free
LFXP10E-3FN388I Overview
The packaging for this particular product is a tray, and it belongs to the XP series. However, it is important to note that its part status is now considered obsolete. Its ECCN code is EAR99, indicating that it is not subject to any specific export controls. In terms of technology, it uses CMOS technology, which is known for its low power consumption and high speed. The maximum reflow temperature for this product is 40 degrees Celsius. It has a memory size of 31.9kB and a total of 244 I/Os. Additionally, it has 221184 RAM bits and 1216 CLBs. This combination of features makes it a powerful and efficient device for various applications.
LFXP10E-3FN388I Features
244 I/Os
Up to 221184 RAM bits
388 LABs/CLBs
1250 logic blocks (LABs)
LFXP10E-3FN388I Applications
There are a lot of Lattice Semiconductor Corporation LFXP10E-3FN388I FPGAs applications.
Aerospace and Defense
Random logic
Wired Communications
ASIC prototyping
Medical Applications
Bioinformatics
High Performance Computing
OpenCL
Voice recognition
Enterprise networking
The packaging for this particular product is a tray, and it belongs to the XP series. However, it is important to note that its part status is now considered obsolete. Its ECCN code is EAR99, indicating that it is not subject to any specific export controls. In terms of technology, it uses CMOS technology, which is known for its low power consumption and high speed. The maximum reflow temperature for this product is 40 degrees Celsius. It has a memory size of 31.9kB and a total of 244 I/Os. Additionally, it has 221184 RAM bits and 1216 CLBs. This combination of features makes it a powerful and efficient device for various applications.
LFXP10E-3FN388I Features
244 I/Os
Up to 221184 RAM bits
388 LABs/CLBs
1250 logic blocks (LABs)
LFXP10E-3FN388I Applications
There are a lot of Lattice Semiconductor Corporation LFXP10E-3FN388I FPGAs applications.
Aerospace and Defense
Random logic
Wired Communications
ASIC prototyping
Medical Applications
Bioinformatics
High Performance Computing
OpenCL
Voice recognition
Enterprise networking
LFXP10E-3FN388I More Descriptions
Complex Programmable Logic Devices - CPLDs 9.7K LUTs 244 IO 1.2 V -3 Spd I
FPGA 1216 CLBS 375 MHz PBGA388
CoC and 2-years warranty / RFQ for pricing
FPGA 1216 CLBS 375 MHz PBGA388
CoC and 2-years warranty / RFQ for pricing
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