LFE2-20E-6FN484C

Lattice Semiconductor Corporation LFE2-20E-6FN484C

Part Number:
LFE2-20E-6FN484C
Manufacturer:
Lattice Semiconductor Corporation
Ventron No:
3126729-LFE2-20E-6FN484C
Description:
IC FPGA 331 I/O 484FBGA
ECAD Model:
Datasheet:
LFE2-20E-6FN484C

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Specifications
Lattice Semiconductor Corporation LFE2-20E-6FN484C technical specifications, attributes, parameters and parts with similar specifications to Lattice Semiconductor Corporation LFE2-20E-6FN484C.
  • Factory Lead Time
    8 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    484-BBGA
  • Number of Pins
    484
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2002
  • Series
    ECP2
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    484
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Voltage - Supply
    1.14V~1.26V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    250
  • Supply Voltage
    1.2V
  • Terminal Pitch
    1mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    LFE2-20
  • Pin Count
    484
  • Number of Outputs
    331
  • Operating Supply Voltage
    1.2V
  • Memory Size
    39.8kB
  • Number of I/O
    331
  • RAM Size
    34.5kB
  • Clock Frequency
    357MHz
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    21000
  • Total RAM Bits
    282624
  • Number of LABs/CLBs
    2625
  • Number of Logic Cells
    20000
  • Height Seated (Max)
    2.6mm
  • Length
    23mm
  • Width
    23mm
  • Radiation Hardening
    No
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Description
LFE2-20E-6FN484C Overview
Lattice Semiconductor Corporation is a well-known brand in the technology industry, particularly in the field of Embedded - FPGAs (Field Programmable Gate Array) chips. These chips are highly versatile and can be programmed to perform a wide range of functions, making them a popular choice in various applications. The specific chip in question belongs to the Embedded - FPGAs (Field Programmable Gate Array) category, indicating its capabilities and potential uses. One important aspect to consider when using this chip is its mounting type, which is surface mount. This means that it can be easily attached to a circuit board, making it suitable for use in compact electronic devices. Additionally, its package/case is 484-BBGA, which refers to the type of packaging used to protect and house the chip. This ensures its durability and protection from external factors. Another important parameter to take into account is the Moisture Sensitivity Level (MSL), which is rated as 3 (168 Hours). This indicates that the chip can withstand exposure to moisture for up to 168 hours without being damaged. This is crucial in ensuring the chip's reliability and longevity. The HTS Code for this chip is 8542.39.00.01, which is a harmonized code used for international trade. This code specifically refers to "electronic integrated circuits" and helps in accurately classifying and identifying the chip for import/export purposes. The terminal pitch of this chip is 1mm, which is the distance between each terminal on the chip. This parameter is important in determining the chip's compatibility with other components in a circuit. Additionally, the reflow temperature-max (s) is 30, indicating the maximum temperature the chip can withstand during the reflow process without being damaged. As for its programmable logic type, this chip falls under the category of FIELD PROGRAMMABLE GATE ARRAY (FPGA). This means that it can be programmed and reprogrammed to perform different logic functions, making it a highly versatile and adaptable component. In terms of its technical specifications, this chip has a total of 20000 logic cells, which refers to the number of basic logic elements that can be programmed within the chip. This high number of logic cells allows for complex and advanced functionalities to be implemented. The chip's length is 23mm, which is an important dimension to consider when designing a circuit. This parameter, along with its other dimensions, must be taken into account to ensure proper placement and functionality within the circuit. Lastly, it is worth noting that this chip does not have radiation hardening. This means that it is not specifically designed to withstand exposure to radiation, and caution must be taken when using it in environments with high levels of radiation. Overall, the Lattice Semiconductor Corporation's Embedded - FPGAs chip offers a wide range of capabilities and features, making it a valuable component in various electronic applications. Its parameters and specifications make it a reliable and versatile choice for engineers and designers.

LFE2-20E-6FN484C Features
331 I/Os
Up to 282624 RAM bits
484 LABs/CLBs

LFE2-20E-6FN484C Applications
There are a lot of Lattice Semiconductor Corporation LFE2-20E-6FN484C FPGAs applications.

Electronic Warfare
Medical Applications
Device controllers
Integrating multiple SPLDs
Enterprise networking
Voice recognition
Video & Image Processing
Military DSP
Medical Electronics
Computer hardware emulation
LFE2-20E-6FN484C More Descriptions
Field Programmable Gate Arrays - FPGAs 21K LUTs 331 I/O DSP 1.2V -6
FPGA LatticeECP2 Family 21000 Cells 90nm Technology 1.2V 484-Pin FBGA
Latticeecp2 ; 20K Luts; 1.2V Rohs Compliant: Yes |Lattice Semiconductor LFE2-20E-6FN484C
21K LUTs 331 I/O DSP 1.2V -6 Speed
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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