VISHAY K473K15X7RF5TH5
- Part Number:
- K473K15X7RF5TH5
- Manufacturer:
- VISHAY
- Ventron No:
- 5546218-K473K15X7RF5TH5
- Description:
- passive components in stock
- Datasheet:
- K10 Series Mono-Kap® Prod Sheet
part No. K473K15X7RF5TH5 Is this available? : YesShipped from : HK warehouseSame model may have different manufacturers, images only for reference.
K473K15X7RF5TH5 More Descriptions
Multilayer Ceramic Capacitor, 0.047 uF, 50 V, ± 10%, X7R, Radial Leaded
K Series 47 nF 50 V ±10 % Tolerance X7R Radial Multilayer Ceramic Capacitor
Cap Ceramic 0.047uF 50V X7R 10% Radial 5mm 125°C T/R
CAPACITOR CERAMIC 0.047UF, 50V, X7R, RAD; Dielectric Characteristic:X7R; Capacitance:0.047µF; Capacitance Tolerance:± 10%; Voltage Rating:50V; Capacitor Mounting:Through Hole; Capacitor Terminals:Radial Leaded; Lead Spacing:5mm
The basic capacitor construction consists of ceramic dielectric materials processed into a tape with a typical thickness range from 0.025 to 0.076 mm. Metal electrode patterns are applied using a thick film screening process. Multiple layers are stacked and laminated in such a manner that electrodes are alternately exposed when the pattern is cut into individual chip capacitors. The capacitors are fired through a high temperature profile to mature the ceramic and metal into a homogeneous unit. Metal end terminations are applied and fired to provide electrical connection between the individual layers. Tinned leads are attached using a solder. Encapsulation consists of a moisture-resistant gold colour conformal epoxy coating that meets the flame requirements of "UL94V-0".
K Series 47 nF 50 V ±10 % Tolerance X7R Radial Multilayer Ceramic Capacitor
Cap Ceramic 0.047uF 50V X7R 10% Radial 5mm 125°C T/R
CAPACITOR CERAMIC 0.047UF, 50V, X7R, RAD; Dielectric Characteristic:X7R; Capacitance:0.047µF; Capacitance Tolerance:± 10%; Voltage Rating:50V; Capacitor Mounting:Through Hole; Capacitor Terminals:Radial Leaded; Lead Spacing:5mm
The basic capacitor construction consists of ceramic dielectric materials processed into a tape with a typical thickness range from 0.025 to 0.076 mm. Metal electrode patterns are applied using a thick film screening process. Multiple layers are stacked and laminated in such a manner that electrodes are alternately exposed when the pattern is cut into individual chip capacitors. The capacitors are fired through a high temperature profile to mature the ceramic and metal into a homogeneous unit. Metal end terminations are applied and fired to provide electrical connection between the individual layers. Tinned leads are attached using a solder. Encapsulation consists of a moisture-resistant gold colour conformal epoxy coating that meets the flame requirements of "UL94V-0".
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