IDT, Integrated Device Technology Inc ICS853P022AMLFT

ICS853P022AMLFT Overview
Packaging plays a crucial role in ensuring the safe and efficient delivery of electronic components. One commonly used method is Tape & Reel (TR) packaging, which involves placing the components in a tape and sealing it with a reel. This method not only protects the components from physical damage, but also allows for easy handling and automated assembly processes. The Terminal Finish, in this case, is MATTE TIN, which provides a smooth surface for the components to be soldered onto a circuit board. The Max Operating Temperature of 85°C ensures that the components can withstand high temperatures without malfunctioning. The Terminal Position is DUAL, meaning that the component has two sets of terminals for connection. The Terminal Form, GULL WING, refers to the shape of the terminals, which are bent inwards to resemble a seagull's wings. The Peak Reflow Temperature of 260°C and the absence of a specified Reflow Temperature-Max indicate that these components can withstand high temperatures during the soldering process. With 8 pins and 2 circuits, these components are designed for LVTTL input, making them suitable for a wide range of electronic applications.

ICS853P022AMLFT Features
8 terminations

ICS853P022AMLFT Applications
There are a lot of Integrated Device Technology (IDT) ICS853P022AMLFT Clock Buffers & Drivers applications.

Other PCIe Gen2 networking applications
Tlecom applications
Wireless infrastructure equipment
High speed line receiver
Network attached storage
Aviation
Smartphone
Automatic test equipment
Industrial automation control system
Computing