Altera EP3C80F780I7N

EP3C80F780I7N Overview
The package or case for this particular product is the 780-BGA, which indicates that it is a ball grid array with 780 balls. This package is surface mountable, meaning it can be mounted directly onto a circuit board. The series of this product is the Cyclone® III, which is known for its high-performance and low-power consumption. Its part status is active, indicating that it is currently in production. The peak reflow temperature for this product is 245 degrees Celsius, meaning it can withstand high temperatures during the manufacturing process. It is classified under the JESD-30 Code R-PBGA-B780, which is a standard for ball grid array packages. This product has 81264 logic elements or cells, providing a high level of functionality. It also has a total of 2810880 RAM bits, allowing for efficient storage and processing of data. There are 5079 LABs or CLBs (logic array blocks/cells) in this product, providing a large number of configurable logic blocks. The maximum seated height for this product is 3.5mm, making it suitable for compact and space-constrained designs. Overall, this product offers a powerful and versatile solution for various applications.

EP3C80F780I7N Features
429 I/Os
Up to 2810880 RAM bits

EP3C80F780I7N Applications
There are a lot of Intel EP3C80F780I7N FPGAs applications.

Filtering and communication encoding
Automotive
Server Applications
Military DSP
Device controllers
Scientific Instruments
Consumer Electronics
High Performance Computing
Bioinformatics
Solar Energy