Altera EP2AGX125DF25I3N
- Part Number:
- EP2AGX125DF25I3N
- Manufacturer:
- Altera
- Ventron No:
- 3130813-EP2AGX125DF25I3N
- Description:
- IC FPGA 260 I/O 572FBGA
- Datasheet:
- Arria II Device Handbook Vol 3
Altera EP2AGX125DF25I3N technical specifications, attributes, parameters and parts with similar specifications to Altera EP2AGX125DF25I3N.
- Mounting TypeSurface Mount
- Package / Case572-BGA, FCBGA
- Surface MountYES
- Operating Temperature-40°C~100°C TJ
- PackagingTray
- Published2008
- SeriesArria II GX
- JESD-609 Codee1
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations572
- ECCN Code3A991
- Terminal FinishTin/Silver/Copper (Sn/Ag/Cu)
- HTS Code8542.39.00.01
- Voltage - Supply0.87V~0.93V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)NOT SPECIFIED
- Supply Voltage0.9V
- Terminal Pitch1mm
- Reflow Temperature-Max (s)NOT SPECIFIED
- Base Part NumberEP2AGX125
- JESD-30 CodeS-PBGA-B572
- Number of I/O260
- Clock Frequency500MHz
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells118143
- Total RAM Bits8315904
- Number of LABs/CLBs4964
- Height Seated (Max)2.2mm
- Length25mm
- Width25mm
- RoHS StatusRoHS Compliant
EP2AGX125DF25I3N Overview
The packaging for the Arria II GX series, known as Tray, is designed to protect the delicate components of the EP2AGX125 base part. This packaging is compliant with the JESD-609 code, specifically the e1 version, which ensures that the product meets industry standards for quality and reliability. The Moisture Sensitivity Level (MSL) for this packaging is 3, meaning that it can withstand exposure to moisture for up to 168 hours without compromising its performance. With a total of 572 terminations in the form of BALL terminals, this packaging is able to accommodate the 8315904 RAM bits of the Arria II GX series. The compact dimensions of 25mm in length and width make it a convenient and efficient choice for electronic products.
EP2AGX125DF25I3N Features
260 I/Os
Up to 8315904 RAM bits
EP2AGX125DF25I3N Applications
There are a lot of Intel EP2AGX125DF25I3N FPGAs applications.
Server Applications
Aircraft navigation
Software-defined radios
Consumer Electronics
Ecosystem
OpenCL
Cryptography
Data Mining
Solar Energy
Radar and Sensors
The packaging for the Arria II GX series, known as Tray, is designed to protect the delicate components of the EP2AGX125 base part. This packaging is compliant with the JESD-609 code, specifically the e1 version, which ensures that the product meets industry standards for quality and reliability. The Moisture Sensitivity Level (MSL) for this packaging is 3, meaning that it can withstand exposure to moisture for up to 168 hours without compromising its performance. With a total of 572 terminations in the form of BALL terminals, this packaging is able to accommodate the 8315904 RAM bits of the Arria II GX series. The compact dimensions of 25mm in length and width make it a convenient and efficient choice for electronic products.
EP2AGX125DF25I3N Features
260 I/Os
Up to 8315904 RAM bits
EP2AGX125DF25I3N Applications
There are a lot of Intel EP2AGX125DF25I3N FPGAs applications.
Server Applications
Aircraft navigation
Software-defined radios
Consumer Electronics
Ecosystem
OpenCL
Cryptography
Data Mining
Solar Energy
Radar and Sensors
EP2AGX125DF25I3N More Descriptions
FPGA Arria® II GX Family 118143 Cells 500MHz 40nm Technology 0.9V 572-Pin FC-FBGA
Field Programmable Gate Array, 500MHz, PBGA572
IC FPGA 260 I/O 572FBGA Arria II GX
Arria II GX EP2AGX125 572-BGA FCBGA Tin/Silver/Copper (Sn/Ag/Cu) field programmable gate array 2.2mm 0.9V 500MHz -40C~100C TJ
Field Programmable Gate Array, 500MHz, PBGA572
IC FPGA 260 I/O 572FBGA Arria II GX
Arria II GX EP2AGX125 572-BGA FCBGA Tin/Silver/Copper (Sn/Ag/Cu) field programmable gate array 2.2mm 0.9V 500MHz -40C~100C TJ
The three parts on the right have similar specifications to EP2AGX125DF25I3N.
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ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountOperating TemperaturePackagingPublishedSeriesJESD-609 CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsECCN CodeTerminal FinishHTS CodeVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReflow Temperature-Max (s)Base Part NumberJESD-30 CodeNumber of I/OClock FrequencyProgrammable Logic TypeNumber of Logic Elements/CellsTotal RAM BitsNumber of LABs/CLBsHeight Seated (Max)LengthWidthRoHS StatusSupplier Device PackageNumber of GatesPbfree CodeTechnologyTime@Peak Reflow Temperature-Max (s)Pin CountQualification StatusPropagation DelayOrganizationOutput FunctionNumber of TerminalsOperating Temperature (Max)Supply Voltage-Max (Vsup)Temperature GradeSupply Voltage-Min (Vsup)Seated Height-MaxView Compare
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EP2AGX125DF25I3NSurface Mount572-BGA, FCBGAYES-40°C~100°C TJTray2008Arria II GXe1Obsolete3 (168 Hours)5723A991Tin/Silver/Copper (Sn/Ag/Cu)8542.39.00.010.87V~0.93VBOTTOMBALLNOT SPECIFIED0.9V1mmNOT SPECIFIEDEP2AGX125S-PBGA-B572260500MHzFIELD PROGRAMMABLE GATE ARRAY118143831590449642.2mm25mm25mmRoHS Compliant-----------------
-
Surface Mount1020-BBGA-0°C~85°C TJTray-APEX II-Obsolete3 (168 Hours)----1.425V~1.575V--------735--6720011468806720----1020-FBGA (33x33)5250000--------------
-
Surface Mount724-BBGA, FCBGAYES0°C~85°C TJTray-APEX IIe0Obsolete3 (168 Hours)724-TIN LEAD-1.425V~1.575VBOTTOMBALLNOT SPECIFIED1.5V1.27mm--S-PBGA-B724540-LOADABLE PLD67200114688067203.5mm35mm35mmNon-RoHS Compliant-5250000noCMOSNOT SPECIFIED724COMMERCIAL2.49 ns536 I/OMACROCELL------
-
--YES----e0-NOT SPECIFIED--TIN LEAD--BOTTOMBALL2201.5V1.27mm--S-PBGA-B724536-LOADABLE PLD----35mm35mmNon-RoHS Compliant--noCMOS30724COMMERCIAL1.69 ns536 I/OMACROCELL72485°C1.575VOTHER1.425V3.5mm
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