Maxim Integrated DS3070W-100#
- Part Number:
- DS3070W-100#
- Manufacturer:
- Maxim Integrated
- Ventron No:
- 3239525-DS3070W-100#
- Description:
- IC NVSRAM 16MBIT 100NS 256BGA
- Datasheet:
- DS3070W-100#
Maxim Integrated DS3070W-100# technical specifications, attributes, parameters and parts with similar specifications to Maxim Integrated DS3070W-100#.
- Mounting TypeSurface Mount
- Package / Case256-BGA
- Surface MountYES
- Number of Pins256
- Operating Temperature-40°C~85°C TA
- PackagingTray
- Published2006
- JESD-609 Codee1
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)4 (72 Hours)
- Number of Terminations256
- ECCN Code3A991.B.2.A
- Terminal FinishTIN SILVER COPPER
- HTS Code8542.32.00.41
- TechnologyNVSRAM (Non-Volatile SRAM)
- Voltage - Supply3V~3.6V
- Terminal PositionBOTTOM
- Peak Reflow Temperature (Cel)245
- Number of Functions1
- Supply Voltage3.3V
- Terminal Pitch1.27mm
- Frequency100GHz
- Time@Peak Reflow Temperature-Max (s)30
- Base Part NumberDS3070W
- Pin Count256
- Qualification StatusNot Qualified
- Supply Voltage-Max (Vsup)3.6V
- Supply Voltage-Min (Vsup)3V
- Memory Size16Mb 2M x 8
- Memory TypeNon-Volatile
- Operating ModeSYNCHRONOUS
- Memory FormatNVSRAM
- Memory InterfaceParallel
- Organization2MX8
- Memory Width8
- Write Cycle Time - Word, Page100ns
- Memory Density16777216 bit
- Access Time (Max)100 ns
- Length27mm
- Height Seated (Max)8.72mm
- Width27mm
- RoHS StatusROHS3 Compliant
DS3070W-100# Overview
Non-Volatile is the type of memory it has. There is a Tray case available. The 256-BGA case contains it. The chip has an 16Mb 2M x 8 memory. This device uses a NVSRAM-format memory, which is of mainstream design. A wide operating temperature range makes this device ideal for a variety of demanding applications. A voltage of 3V~3.6V can be supplied to memory ics. Its recommended mounting type is Surface Mount. The chip has 256 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to operate this memory device, it must be supplied with 3.3V of power. Similar parts are frequently selected using DS3070W, the device's base part number. The memory device is enclosed in a package with an 256-pin connector. There are 256 pins on this memory device, which indicates it has 256 memory locations in it. Data is processed by this memory ics at a frequency of 100GHz.
DS3070W-100# Features
Package / Case: 256-BGA
256 Pins
Freguency at 100GHz
100GHz terminals
DS3070W-100# Applications
There are a lot of Maxim Integrated
DS3070W-100# Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
Non-Volatile is the type of memory it has. There is a Tray case available. The 256-BGA case contains it. The chip has an 16Mb 2M x 8 memory. This device uses a NVSRAM-format memory, which is of mainstream design. A wide operating temperature range makes this device ideal for a variety of demanding applications. A voltage of 3V~3.6V can be supplied to memory ics. Its recommended mounting type is Surface Mount. The chip has 256 terminations. For a comprehensive working procedure, this part supports as many as 1 functions. In order to operate this memory device, it must be supplied with 3.3V of power. Similar parts are frequently selected using DS3070W, the device's base part number. The memory device is enclosed in a package with an 256-pin connector. There are 256 pins on this memory device, which indicates it has 256 memory locations in it. Data is processed by this memory ics at a frequency of 100GHz.
DS3070W-100# Features
Package / Case: 256-BGA
256 Pins
Freguency at 100GHz
100GHz terminals
DS3070W-100# Applications
There are a lot of Maxim Integrated
DS3070W-100# Memory applications.
cell phones
eSRAM
mainframes
multimedia computers
networking
personal computers
servers
supercomputers
telecommunications
workstations,
DS3070W-100# More Descriptions
IC NVSRAM 16MBIT PARALLEL 256BGA
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