Texas Instruments DM355SZCE135

Name: DM355SZCE135
Brand: Texas Instruments
SKU: 3632156-DM355SZCE135
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: DM355SZCE135

Manufacturer:: Texas Instruments

Ventron No:: 3632156-DM355SZCE135

Description:: IC DGTL MEDIA PROCESSOR 337NFBGA

ECAD Model:

Datasheet:: TMS320DM355, DM355ZCE216

Specifications

Texas Instruments DM355SZCE135 technical specifications, attributes, parameters and parts with similar specifications to Texas Instruments DM355SZCE135.

Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
337-LFBGA
Number of Pins
337
Operating Temperature
0°C~85°C TC
Packaging
Tray
Series
TMS320DM3x, DaVinci™
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Obsolete
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
337
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Subcategory
Digital Signal Processors
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
260
Supply Voltage
1.3V
Terminal Pitch
0.65mm
Frequency
135MHz
Base Part Number
DM355
Pin Count
337
Operating Supply Voltage
1.3V
Interface
ASP, I2C, SPI, UART, USB
Number of I/O
104
RAM Size
32kB
Bit Size
32
Data Bus Width
16b
Core Architecture
ARM
Format
FIXED-POINT
Voltage - I/O
1.8V 3.3V
Number of UART Channels
3
Number of Cores
1
Non-Volatile Memory
ROM (8kB)
Voltage - Core
1.30V
On Chip Data RAM
56kB
Height
900μm
Length
13mm
Width
13mm
Radiation Hardening
No
RoHS Status
ROHS3 Compliant
Lead Free
Lead Free

Description

DM355SZCE135 Overview
This product is a surface mount device that is packaged in a tray. It is also Pbfree, meaning it does not contain lead. The peak reflow temperature for this product is 260 degrees Celsius. It operates at a supply voltage of 1.3V and has 104 input/output connections. The core architecture is ARM and the format is fixed-point. The voltage for the input/output is 1.8V or 3.3V. This product is not radiation hardened.

DM355SZCE135 Features
Supplied in the 337-LFBGA package
Operating supply voltage of 1.3V
104 I/Os
1 cores

DM355SZCE135 Applications
There are a lot of Texas Instruments DM355SZCE135 DSP applications.

Streaming videos
House construction
Infrared
Other sensor array processing
Fourier transform
Tomography technology
Medical imaging
3D tomography and imaging processing
Image compression
Processing system

DM355SZCE135 More Descriptions

Digital Media System-on-Chip (DMSoC) 337-NFBGA 0 to 85
IC DGTL MEDIA PROCESSOR 337NFBGA
IC VREF SHUNT 4.096V SOT23

Product Comparison

The three parts on the right have similar specifications to DM355SZCE135.

Image

Part Number

Manufacturer

Mount

Mounting Type

Package / Case

Number of Pins

Operating Temperature

Packaging

Series

JESD-609 Code

Pbfree Code

Part Status

Moisture Sensitivity Level (MSL)

Number of Terminations

Terminal Finish

Subcategory

Technology

Terminal Position

Terminal Form

Peak Reflow Temperature (Cel)

Supply Voltage

Terminal Pitch

Frequency

Base Part Number

Pin Count

Operating Supply Voltage

Interface

Number of I/O

RAM Size

Bit Size

Data Bus Width

Core Architecture

Format

Voltage - I/O

Number of UART Channels

Number of Cores

Non-Volatile Memory

Voltage - Core

On Chip Data RAM

Height

Length

Width

Radiation Hardening

RoHS Status

Lead Free

Max Supply Voltage

Min Supply Voltage

Additional Feature

HTS Code

Supply Voltage-Max (Vsup)

Power Supplies

Supply Voltage-Min (Vsup)

RAM (words)

Height Seated (Max)

View Compare
DM355SZCE135

Texas Instruments

Surface Mount

Surface Mount

337-LFBGA

337

0°C~85°C TC

Tray

TMS320DM3x, DaVinci™

e1

yes

Obsolete

3 (168 Hours)

337

Tin/Silver/Copper (Sn/Ag/Cu)

Digital Signal Processors

CMOS

BOTTOM

BALL

260

1.3V

0.65mm

135MHz

DM355

337

1.3V

ASP, I2C, SPI, UART, USB

104

32kB

32

16b

ARM

FIXED-POINT

1.8V 3.3V

3

1

ROM (8kB)

1.30V

56kB

900μm

13mm

13mm

No

ROHS3 Compliant

Lead Free

-

-

-

-

-

-

-

-

-

-
DM355SZCE270

Texas Instruments

Surface Mount

Surface Mount

337-LFBGA

337

0°C~85°C TC

Tray

TMS320DM3x, DaVinci™

e1

yes

Obsolete

3 (168 Hours)

337

Tin/Silver/Copper (Sn/Ag/Cu)

Digital Signal Processors

CMOS

BOTTOM

BALL

260

1.3V

0.65mm

270MHz

DM355

337

1.3V

ASP, I2C, SPI, UART, USB

104

32kB

32

16b

ARM

FIXED-POINT

1.8V 3.3V

3

1

ROM (8kB)

1.30V

56kB

-

-

-

No

ROHS3 Compliant

Lead Free

1.365V

1.235V

-

-

-

-

-

-

-

DM355SZCE135 vs DM355SZCE270
DM355SCZCE216

Texas Instruments

Surface Mount

Surface Mount

337-LFBGA

337

0°C~85°C TC

Tray

TMS320DM3x, DaVinci™

-

-

Obsolete

3 (168 Hours)

-

-

-

-

-

-

-

-

-

216MHz

DM355

-

1.3V

ASP, I2C, SPI, UART, USB

-

-

-

-

-

-

1.8V 3.3V

-

-

ROM (8kB)

1.30V

56kB

-

-

-

No

ROHS3 Compliant

-

1.365V

1.235V

-

-

-

-

-

-

-

DM355SZCE135 vs DM355SCZCE216
DM355SDZCEA135

Texas Instruments

Surface Mount

Surface Mount

337-LFBGA

337

-40°C~100°C TC

Tray

TMS320DM3x, DaVinci™

e1

no

Discontinued

3 (168 Hours)

337

Tin/Silver/Copper (Sn/Ag/Cu)

Digital Signal Processors

CMOS

BOTTOM

BALL

260

1.3V

0.65mm

135MHz

DM355

337

-

ASP, I2C, SPI, UART, USB

-

32kB

32

-

RISC

FIXED-POINT

1.8V 3.3V

-

-

ROM (8kB)

1.30V

56kB

-

13mm

13mm

No

ROHS3 Compliant

Contains Lead

-

-

IT ALSO OPERATES AT 1.8V AND 3.3V SUPPLY FOR I/O

8542.31.00.01

1.365V

1.31.83.3V

1.235V

8192

1.3mm

DM355SZCE135 vs DM355SDZCEA135