CYW15G0401DXB-BGXC

Cypress Semiconductor Corp CYW15G0401DXB-BGXC

Part Number:
CYW15G0401DXB-BGXC
Manufacturer:
Cypress Semiconductor Corp
Ventron No:
3685589-CYW15G0401DXB-BGXC
Description:
IC TXRX HOTLINK II QUAD 256LBGA
ECAD Model:
Datasheet:
CY(P,V,W)15G0401DXB

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Specifications
Cypress Semiconductor Corp CYW15G0401DXB-BGXC technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp CYW15G0401DXB-BGXC.
  • Mounting Type
    Surface Mount
  • Package / Case
    256-LBGA Exposed Pad
  • Surface Mount
    YES
  • Operating Temperature
    0°C~70°C
  • Packaging
    Tray
  • Series
    HOTlink II™
  • JESD-609 Code
    e1
  • Pbfree Code
    yes
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    256
  • Terminal Finish
    TIN SILVER COPPER
  • Technology
    BICMOS
  • Voltage - Supply
    3.135V~3.465V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage
    3.3V
  • Terminal Pitch
    1.27mm
  • Reach Compliance Code
    unknown
  • Reflow Temperature-Max (s)
    20
  • JESD-30 Code
    S-PBGA-B256
  • Function
    Transceiver
  • Qualification Status
    COMMERCIAL
  • Interface
    LVTTL
  • Number of Circuits
    4
  • Current - Supply
    830mA
  • Telecom IC Type
    TELECOM CIRCUIT
  • Length
    27mm
  • Width
    27mm
  • RoHS Status
    ROHS3 Compliant
Description
CYW15G0401DXB-BGXC Overview
The mounting type for this particular component is surface mount, which means that it can be attached directly onto the surface of a circuit board without the need for any additional hardware. This is a convenient and efficient method of installation, especially since the surface mount option is available for this component. The moisture sensitivity level (MSL) is 3 (168 hours), indicating that it can withstand exposure to moderate levels of moisture for up to 168 hours without any adverse effects. The technology used for this component is BICMOS, which stands for Bipolar Complementary Metal-Oxide-Semiconductor, a combination of two different types of transistors. The terminal position is bottom, meaning that the terminals are located on the bottom side of the component. The terminal form is ball, which refers to the shape of the terminals, and the terminal pitch is 1.27mm, indicating the distance between each terminal. This component is classified under the JESD-30 code S-PBGA-B256, which stands for Small Plastic Ball Grid Array with 256 balls. It is specifically designed for use in telecom circuits, making it a reliable and efficient choice for telecommunications applications. With a length of 27mm, this component is compact yet powerful, making it a versatile and highly sought-after option for telecom circuitry.

CYW15G0401DXB-BGXC Features
Available in the 256-LBGA Exposed Pad package
TELECOM CIRCUIT as telecom IC type

CYW15G0401DXB-BGXC Applications
There are a lot of Rochester Electronics, LLC CYW15G0401DXB-BGXC Telecom applications.

Set-Top Box
Digital Cross-Connect Systems
Home Gateway
ATM Switches
Channel Service Units (CSUs): T1/E1/J1
SDH/SONET multiplexers
Intelligent PBX
Digital Modems
Router
Interfaces to DS3
CYW15G0401DXB-BGXC More Descriptions
ROHS3Compliant BOTTOM BALL Obsolete Telecom IC Transceiver 0C~70C 1500000Mbps 27mm 830mA
IC TXRX HOTLINK II QUAD 256LBGA
5V E1/T1/J1 LINE INTERFACE
PHY 4-CH 256-Pin BGA
OEMs, CMs ONLY (NO BROKERS)
TELECOM CIRCUIT, 4-TRNSVR
Product Comparison
The three parts on the right have similar specifications to CYW15G0401DXB-BGXC.
  • Image
    Part Number
    Manufacturer
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Series
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Technology
    Voltage - Supply
    Terminal Position
    Terminal Form
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Terminal Pitch
    Reach Compliance Code
    Reflow Temperature-Max (s)
    JESD-30 Code
    Function
    Qualification Status
    Interface
    Number of Circuits
    Current - Supply
    Telecom IC Type
    Length
    Width
    RoHS Status
    Mount
    Number of Pins
    Published
    Subcategory
    Base Part Number
    Power Supplies
    Nominal Supply Current
    Data Rate
    Number of Transceivers
    Height Seated (Max)
    Radiation Hardening
    Max Operating Temperature
    Min Operating Temperature
    Number of Functions
    Pin Count
    Temperature Grade
    View Compare
  • CYW15G0401DXB-BGXC
    CYW15G0401DXB-BGXC
    Surface Mount
    256-LBGA Exposed Pad
    YES
    0°C~70°C
    Tray
    HOTlink II™
    e1
    yes
    Obsolete
    3 (168 Hours)
    256
    TIN SILVER COPPER
    BICMOS
    3.135V~3.465V
    BOTTOM
    BALL
    260
    3.3V
    1.27mm
    unknown
    20
    S-PBGA-B256
    Transceiver
    COMMERCIAL
    LVTTL
    4
    830mA
    TELECOM CIRCUIT
    27mm
    27mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • CYW15G0201DXB-BBI
    Surface Mount
    196-LBGA
    -
    -40°C~85°C
    Tray
    HOTlink II™
    e0
    -
    Obsolete
    3 (168 Hours)
    196
    Tin/Lead (Sn/Pb)
    BICMOS
    3.135V~3.465V
    BOTTOM
    BALL
    240
    3.3V
    1mm
    -
    30
    -
    Transceiver
    -
    LVTTL
    2
    570mA
    TELECOM CIRCUIT
    15mm
    15mm
    Non-RoHS Compliant
    Surface Mount
    196
    2005
    Network Interfaces
    CY*15G02
    3.3V
    710mA
    1500000 Mbps
    2
    1.5mm
    No
    -
    -
    -
    -
    -
  • CYW15G0401DXB-BGC
    Surface Mount
    256-LBGA Exposed Pad
    -
    0°C~70°C
    Tray
    HOTlink II™
    e0
    -
    Obsolete
    3 (168 Hours)
    256
    Tin/Lead (Sn/Pb)
    BICMOS
    3.135V~3.465V
    BOTTOM
    BALL
    225
    3.3V
    1.27mm
    not_compliant
    30
    -
    Transceiver
    Not Qualified
    LVTTL
    4
    830mA
    -
    27mm
    27mm
    Non-RoHS Compliant
    Surface Mount
    256
    2005
    Network Interfaces
    CY*15G04
    3.3V
    1.06A
    1500000 Mbps
    4
    -
    -
    -
    -
    -
    -
    -
  • CYW15G0403DXB-BGC
    Surface Mount
    256-LBGA Exposed Pad
    -
    -
    Tray
    HOTlink II™
    e0
    -
    Obsolete
    3 (168 Hours)
    256
    Tin/Lead (Sn/Pb)
    BICMOS
    3.135V~3.465V
    BOTTOM
    BALL
    225
    3.3V
    1.27mm
    not_compliant
    30
    S-PBGA-B256
    -
    Not Qualified
    -
    4
    -
    TELECOM CIRCUIT
    27mm
    27mm
    Non-RoHS Compliant
    Surface Mount
    -
    2012
    Network Interfaces
    CY*15G04
    3.3V
    1.27A
    1500000 Mbps
    4
    -
    -
    70°C
    0°C
    1
    256
    COMMERCIAL
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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