Cypress Semiconductor Corp CYW15G0401DXB-BGXC
- Part Number:
- CYW15G0401DXB-BGXC
- Manufacturer:
- Cypress Semiconductor Corp
- Ventron No:
- 3685589-CYW15G0401DXB-BGXC
- Description:
- IC TXRX HOTLINK II QUAD 256LBGA
- Datasheet:
- CY(P,V,W)15G0401DXB
Cypress Semiconductor Corp CYW15G0401DXB-BGXC technical specifications, attributes, parameters and parts with similar specifications to Cypress Semiconductor Corp CYW15G0401DXB-BGXC.
- Mounting TypeSurface Mount
- Package / Case256-LBGA Exposed Pad
- Surface MountYES
- Operating Temperature0°C~70°C
- PackagingTray
- SeriesHOTlink II™
- JESD-609 Codee1
- Pbfree Codeyes
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations256
- Terminal FinishTIN SILVER COPPER
- TechnologyBICMOS
- Voltage - Supply3.135V~3.465V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)260
- Supply Voltage3.3V
- Terminal Pitch1.27mm
- Reach Compliance Codeunknown
- Reflow Temperature-Max (s)20
- JESD-30 CodeS-PBGA-B256
- FunctionTransceiver
- Qualification StatusCOMMERCIAL
- InterfaceLVTTL
- Number of Circuits4
- Current - Supply830mA
- Telecom IC TypeTELECOM CIRCUIT
- Length27mm
- Width27mm
- RoHS StatusROHS3 Compliant
CYW15G0401DXB-BGXC Overview
The mounting type for this particular component is surface mount, which means that it can be attached directly onto the surface of a circuit board without the need for any additional hardware. This is a convenient and efficient method of installation, especially since the surface mount option is available for this component. The moisture sensitivity level (MSL) is 3 (168 hours), indicating that it can withstand exposure to moderate levels of moisture for up to 168 hours without any adverse effects. The technology used for this component is BICMOS, which stands for Bipolar Complementary Metal-Oxide-Semiconductor, a combination of two different types of transistors. The terminal position is bottom, meaning that the terminals are located on the bottom side of the component. The terminal form is ball, which refers to the shape of the terminals, and the terminal pitch is 1.27mm, indicating the distance between each terminal. This component is classified under the JESD-30 code S-PBGA-B256, which stands for Small Plastic Ball Grid Array with 256 balls. It is specifically designed for use in telecom circuits, making it a reliable and efficient choice for telecommunications applications. With a length of 27mm, this component is compact yet powerful, making it a versatile and highly sought-after option for telecom circuitry.
CYW15G0401DXB-BGXC Features
Available in the 256-LBGA Exposed Pad package
TELECOM CIRCUIT as telecom IC type
CYW15G0401DXB-BGXC Applications
There are a lot of Rochester Electronics, LLC CYW15G0401DXB-BGXC Telecom applications.
Set-Top Box
Digital Cross-Connect Systems
Home Gateway
ATM Switches
Channel Service Units (CSUs): T1/E1/J1
SDH/SONET multiplexers
Intelligent PBX
Digital Modems
Router
Interfaces to DS3
The mounting type for this particular component is surface mount, which means that it can be attached directly onto the surface of a circuit board without the need for any additional hardware. This is a convenient and efficient method of installation, especially since the surface mount option is available for this component. The moisture sensitivity level (MSL) is 3 (168 hours), indicating that it can withstand exposure to moderate levels of moisture for up to 168 hours without any adverse effects. The technology used for this component is BICMOS, which stands for Bipolar Complementary Metal-Oxide-Semiconductor, a combination of two different types of transistors. The terminal position is bottom, meaning that the terminals are located on the bottom side of the component. The terminal form is ball, which refers to the shape of the terminals, and the terminal pitch is 1.27mm, indicating the distance between each terminal. This component is classified under the JESD-30 code S-PBGA-B256, which stands for Small Plastic Ball Grid Array with 256 balls. It is specifically designed for use in telecom circuits, making it a reliable and efficient choice for telecommunications applications. With a length of 27mm, this component is compact yet powerful, making it a versatile and highly sought-after option for telecom circuitry.
CYW15G0401DXB-BGXC Features
Available in the 256-LBGA Exposed Pad package
TELECOM CIRCUIT as telecom IC type
CYW15G0401DXB-BGXC Applications
There are a lot of Rochester Electronics, LLC CYW15G0401DXB-BGXC Telecom applications.
Set-Top Box
Digital Cross-Connect Systems
Home Gateway
ATM Switches
Channel Service Units (CSUs): T1/E1/J1
SDH/SONET multiplexers
Intelligent PBX
Digital Modems
Router
Interfaces to DS3
CYW15G0401DXB-BGXC More Descriptions
ROHS3Compliant BOTTOM BALL Obsolete Telecom IC Transceiver 0C~70C 1500000Mbps 27mm 830mA
IC TXRX HOTLINK II QUAD 256LBGA
5V E1/T1/J1 LINE INTERFACE
PHY 4-CH 256-Pin BGA
OEMs, CMs ONLY (NO BROKERS)
TELECOM CIRCUIT, 4-TRNSVR
IC TXRX HOTLINK II QUAD 256LBGA
5V E1/T1/J1 LINE INTERFACE
PHY 4-CH 256-Pin BGA
OEMs, CMs ONLY (NO BROKERS)
TELECOM CIRCUIT, 4-TRNSVR
The three parts on the right have similar specifications to CYW15G0401DXB-BGXC.
-
ImagePart NumberManufacturerMounting TypePackage / CaseSurface MountOperating TemperaturePackagingSeriesJESD-609 CodePbfree CodePart StatusMoisture Sensitivity Level (MSL)Number of TerminationsTerminal FinishTechnologyVoltage - SupplyTerminal PositionTerminal FormPeak Reflow Temperature (Cel)Supply VoltageTerminal PitchReach Compliance CodeReflow Temperature-Max (s)JESD-30 CodeFunctionQualification StatusInterfaceNumber of CircuitsCurrent - SupplyTelecom IC TypeLengthWidthRoHS StatusMountNumber of PinsPublishedSubcategoryBase Part NumberPower SuppliesNominal Supply CurrentData RateNumber of TransceiversHeight Seated (Max)Radiation HardeningMax Operating TemperatureMin Operating TemperatureNumber of FunctionsPin CountTemperature GradeView Compare
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CYW15G0401DXB-BGXCSurface Mount256-LBGA Exposed PadYES0°C~70°CTrayHOTlink II™e1yesObsolete3 (168 Hours)256TIN SILVER COPPERBICMOS3.135V~3.465VBOTTOMBALL2603.3V1.27mmunknown20S-PBGA-B256TransceiverCOMMERCIALLVTTL4830mATELECOM CIRCUIT27mm27mmROHS3 Compliant-----------------
-
Surface Mount196-LBGA--40°C~85°CTrayHOTlink II™e0-Obsolete3 (168 Hours)196Tin/Lead (Sn/Pb)BICMOS3.135V~3.465VBOTTOMBALL2403.3V1mm-30-Transceiver-LVTTL2570mATELECOM CIRCUIT15mm15mmNon-RoHS CompliantSurface Mount1962005Network InterfacesCY*15G023.3V710mA1500000 Mbps21.5mmNo-----
-
Surface Mount256-LBGA Exposed Pad-0°C~70°CTrayHOTlink II™e0-Obsolete3 (168 Hours)256Tin/Lead (Sn/Pb)BICMOS3.135V~3.465VBOTTOMBALL2253.3V1.27mmnot_compliant30-TransceiverNot QualifiedLVTTL4830mA-27mm27mmNon-RoHS CompliantSurface Mount2562005Network InterfacesCY*15G043.3V1.06A1500000 Mbps4-------
-
Surface Mount256-LBGA Exposed Pad--TrayHOTlink II™e0-Obsolete3 (168 Hours)256Tin/Lead (Sn/Pb)BICMOS3.135V~3.465VBOTTOMBALL2253.3V1.27mmnot_compliant30S-PBGA-B256-Not Qualified-4-TELECOM CIRCUIT27mm27mmNon-RoHS CompliantSurface Mount-2012Network InterfacesCY*15G043.3V1.27A1500000 Mbps4--70°C0°C1256COMMERCIAL
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