Cypress Semiconductor Corp CY7C25422KV18-333BZXC

CY7C25422KV18-333BZXC Overview
The package or case of this electronic component is 165-LBGA, which stands for Land Grid Array. This type of package is commonly used for integrated circuits and offers a higher number of pins for connections. It is surface mountable, meaning it can be mounted directly onto a circuit board without the need for through-hole soldering. This particular component was first published in 2003, making it a well-established and reliable choice for electronic designs. It falls under the ECCN code 3A991.B.2.A, which indicates that it is a high-performance microprocessor. The voltage supply for this component ranges from 1.7V to 1.9V, with a supply voltage of 1.8V. The terminal pitch, or distance between pins, is 1mm, allowing for precise connections. With a clock frequency of 333MHz, this component offers high-speed performance. Its width is 13mm, making it compact and suitable for various applications. Additionally, it is ROHS3 compliant, meaning it meets the latest environmental standards for electronic components.

CY7C25422KV18-333BZXC Features
Package / Case: 165-LBGA
165 Pins
Additional Feature:PIPELINED ARCHITECTURE

CY7C25422KV18-333BZXC Applications
There are a lot of Cypress Semiconductor Corp CY7C25422KV18-333BZXC Memory applications.

personal computers
graphics card
telecommunications
supercomputers
main computer memory
Cache memory
printers
mainframes
data buffer
cell phones