Cypress Semiconductor Corp CY7C1312KV18-250BZXI

CY7C1312KV18-250BZXI Overview
The package or case of this electronic component is a 165-LBGA, which stands for Land Grid Array Ball Grid Array. It is a type of surface-mount packaging for integrated circuits that is commonly used in high-density applications. The ECCN code for this package is 3A991, which is a classification used for items that have a specific purpose or function. The terminal finish of this package is Tin/Silver/Copper, which is a combination of metals that provides a durable and reliable connection. One of the additional features of this component is its pipelined architecture, which allows for efficient data processing. The voltage supply for this component ranges from 1.7V to 1.9V, making it suitable for low-power applications. The terminal position is at the bottom of the package, and it has one function, which is to store memory. The maximum supply voltage for this component is 1.9V, and it has a memory size of 18Mb 1M x 18. This component is not radiation hardened, which means it is not designed to withstand high levels of radiation.

CY7C1312KV18-250BZXI Features
Package / Case: 165-LBGA
165 Pins
Operating Supply Voltage:1.8V
Additional Feature:PIPELINED ARCHITECTURE
I/O Type: SEPARATE

CY7C1312KV18-250BZXI Applications
There are a lot of Cypress Semiconductor Corp CY7C1312KV18-250BZXI Memory applications.

eDRAM
main computer memory
printers
mainframes
servers
graphics card
eSRAM
nonvolatile BIOS memory
data buffer
networking