Shopping Cart

Intersil CDP68HC68T1M2Z

Part Number:

CDP68HC68T1M2Z

Manufacturer:

Intersil

Ventron No:

3004894-CDP68HC68T1M2Z

Description:

IC RTC CLK/CALENDAR SPI 16-SOIC

ECAD Model:

Datasheet:

CDP68HC68T1M2Z

Payment:

Payment

Delivery:

Delivery

Quick Request Quote

Reference Price ( In US Dollars )

Pricing

Qty

Unit Price

Ext Price

  • 1

    $15.2789

    $15.28

  • 200

    $5.9141

    $1182.82

  • 480

    $5.7052

    $2738.50

  • 960

    $5.6031

    $5378.98

Do you want a lower wholesale price? Please send us an inquiry, and we will respond immediately.
Quantity
Comments
  • One Stop Service

    One Stop Service

  • Competitive Price

    Competitive Price

  • Source Traceability

    Source Traceability

  • Same Day Delivery

    Same Day Delivery

Part Overview

Description
The CDP68HC68T1 Real-Time Clock (RTC) is a versatile device that combines time/calendar functionality, static RAM, and a Serial Peripheral Interface (SPI Bus).

Features
Time/Calendar:
Seconds, minutes, hours (12/24 hour format with AM/PM indicator)
Day of week, date, month, year (0 to 99)
Automatic leap year adjustment
Memory:
32-word x 8-bit static RAM
SPI Bus:
3-wire interface for communication
Clock Input:
Internal oscillator with crystal or 50/60Hz line input
Power Management:
Automatic power loss detection
Low standby voltage for timekeeping
Interrupt Modes:
Alarm
Periodic (15 intervals from sub-second to once per day)
Power-down sense
Output:
Programmable output for various system functions
Reset:
CPUR output for processor reset under power-down conditions
Watchdog:
Requires periodic toggle of CE pin without serial transfer
Environmental:
Pb-Free (RoHS compliant)
2.2V operation

Applications
The CDP68HC68T1 RTC is suitable for a wide range of applications, including:
Timekeeping and calendar functions
Data logging and timestamping
System monitoring and control
Power management and reset

Specifications

Intersil CDP68HC68T1M2Z technical specifications, attributes, parameters and parts with similar specifications to Intersil CDP68HC68T1M2Z.

  • Factory Lead Time
    19 Weeks
  • Contact Plating
    Tin
  • Mount
    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    SOIC
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    16
  • Packaging
    Bulk
  • Published
    2001
  • JESD-609 Code
    e3
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    3
  • Number of Terminations
    16
  • ECCN Code
    EAR99
  • Max Operating Temperature
    85°C
  • Min Operating Temperature
    -40°C
  • Subcategory
    Timers or RTCs
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    260
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    5V
  • Current Rating

    Current Rating is the maximum amount of current that an electronic component can safely handle without overheating or failing. It is typically expressed in amperes (A) or milliamperes (mA). Exceeding the current rating can damage the component and potentially create a safety hazard. The current rating is determined by the physical characteristics of the component, such as its size, material, and construction.

    12A
  • Frequency

    Frequency, in the context of electronic components, refers to the rate at which an alternating current or voltage changes direction per second. It is measured in Hertz (Hz), which represents one cycle per second. Frequency is a crucial parameter for various electronic components, such as capacitors, inductors, and resonators. It determines the component's ability to store or release energy, filter signals, and resonate at specific frequencies. Understanding the frequency characteristics of electronic components is essential for designing and optimizing electronic circuits.

    50Hz
  • Reflow Temperature-Max (s)
    30
  • Number of Outputs

    Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

    2
  • Qualification Status
    Not Qualified
  • Power Supplies
    3.3/5V
  • Temperature Grade
    INDUSTRIAL
  • Interface

    In electronics, an interface refers to the connection point or boundary between two or more electronic systems or devices. It defines the physical, electrical, and logical characteristics that enable communication and data exchange between them. An interface specifies the protocols, pinouts, voltage levels, data formats, and other parameters necessary for the systems to interact seamlessly. It ensures compatibility and interoperability between different components or devices, allowing them to exchange information and perform their intended functions.

    SPI, Serial
  • Max Supply Voltage
    6V
  • Min Supply Voltage
    3V
  • Memory Size
    32B
  • Memory Type

    Memory Type refers to the type of memory technology used in an electronic device. It indicates the specific design and architecture of the memory, such as DRAM (Dynamic Random Access Memory), SRAM (Static Random Access Memory), ROM (Read-Only Memory), EEPROM (Electrically Erasable Programmable Read-Only Memory), or Flash memory. Each memory type has unique characteristics, including speed, capacity, volatility, and cost, which determine its suitability for different applications.

    RAM
  • Frequency (Max)
    4MHz
  • Logic Function
    Clock
  • Number of Timers
    1
  • Time Format

    Time Format is an electronic component parameter that specifies the format of the time data that is output by the component. The most common time formats are 24-hour format and 12-hour format. 24-hour format displays the time in hours and minutes, with the hours ranging from 00 to 23. 12-hour format displays the time in hours, minutes, and seconds, with the hours ranging from 01 to 12 and an AM or PM designation.

    HH:MM:SS
  • Date Format

    Date Format is an electronic component parameter that specifies the format in which the date is displayed on the component. This parameter is typically used for components that have a built-in clock or calendar, such as digital watches, clocks, and computers. The Date Format parameter can be set to a variety of different formats, such as MM/DD/YY, DD/MM/YY, and YYYY/MM/DD.

    YY-MM-DD-dd
  • Time-Min
    SECONDS
  • Interrupt Capability
    Y
  • Volatile
    YES
  • Information Access Method
    SERIAL, 3-WIRE
  • Height

    Height, in the context of electronic components, refers to the vertical dimension of the component. It is typically measured in millimeters (mm) or inches (in). Height is an important parameter to consider when designing and assembling electronic circuits, as it affects the overall size and form factor of the device. Components with a smaller height are often preferred for applications where space is limited, such as in portable devices or embedded systems.

    2.35mm
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    10.5mm
  • Width
    7.6mm
  • REACH SVHC
    No SVHC
  • RoHS Status
    RoHS Compliant
  • Lead Free
    Lead Free

Product Comparison

The three parts on the right have similar specifications to CDP68HC68T1M2Z.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Contact Plating
    Mount
    Package / Case
    Number of Pins
    Packaging
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Max Operating Temperature
    Min Operating Temperature
    Subcategory
    Technology
    Terminal Position
    Peak Reflow Temperature (Cel)
    Supply Voltage
    Current Rating
    Frequency
    Reflow Temperature-Max (s)
    Number of Outputs
    Qualification Status
    Power Supplies
    Temperature Grade
    Interface
    Max Supply Voltage
    Min Supply Voltage
    Memory Size
    Memory Type
    Frequency (Max)
    Logic Function
    Number of Timers
    Time Format
    Date Format
    Time-Min
    Interrupt Capability
    Volatile
    Information Access Method
    Height
    Length
    Width
    REACH SVHC
    RoHS Status
    Lead Free
    Mounting Type
    Operating Temperature
    Feature
    Voltage - Supply
    Base Part Number
    Current - Timekeeping (Max)
    Voltage - Supply, Battery
    View Compare
  • CDP68HC68T1M2Z
    CDP68HC68T1M2Z
    19 Weeks
    Tin
    Surface Mount
    SOIC
    16
    Bulk
    2001
    e3
    Active
    3
    16
    EAR99
    85°C
    -40°C
    Timers or RTCs
    CMOS
    DUAL
    260
    5V
    12A
    50Hz
    30
    2
    Not Qualified
    3.3/5V
    INDUSTRIAL
    SPI, Serial
    6V
    3V
    32B
    RAM
    4MHz
    Clock
    1
    HH:MM:SS
    YY-MM-DD-dd
    SECONDS
    Y
    YES
    SERIAL, 3-WIRE
    2.35mm
    10.5mm
    7.6mm
    No SVHC
    RoHS Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
  • CDP68HC68T1M96
    -
    -
    -
    20-SOIC (0.295, 7.50mm Width)
    -
    Tape & Reel (TR)
    2001
    -
    Obsolete
    1 (Unlimited)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    SPI
    -
    -
    32B
    -
    -
    -
    -
    HH:MM:SS (12/24 hr)
    YY-MM-DD-dd
    -
    -
    -
    -
    -
    -
    -
    -
    Non-RoHS Compliant
    -
    Surface Mount
    -40°C~85°C
    Alarm, Leap Year, Square Wave Output, Watchdog Timer
    3V~6V
    CDP68HC68T1
    20μA~500μA @ 5V
    2.2V~6V
  • CDP68HC68T1M296
    -
    -
    -
    16-SOIC (0.295, 7.50mm Width)
    -
    Tape & Reel (TR)
    -
    -
    Obsolete
    1 (Unlimited)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    SPI
    -
    -
    32B
    -
    -
    -
    -
    HH:MM:SS (12/24 hr)
    YY-MM-DD-dd
    -
    -
    -
    -
    -
    -
    -
    -
    Non-RoHS Compliant
    -
    Surface Mount
    -40°C~85°C
    Alarm, Leap Year, Square Wave Output, Watchdog Timer
    3V~6V
    CDP68HC68T1
    20μA~500μA @ 5V
    2.2V~6V
  • CDP68HC68T1M2
    -
    -
    -
    16-SOIC (0.295, 7.50mm Width)
    -
    Tube
    -
    -
    Obsolete
    1 (Unlimited)
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    SPI
    -
    -
    32B
    -
    -
    -
    -
    HH:MM:SS (12/24 hr)
    YY-MM-DD-dd
    -
    -
    -
    -
    -
    -
    -
    -
    Non-RoHS Compliant
    -
    Surface Mount
    -40°C~85°C
    Alarm, Leap Year, Square Wave Output, Watchdog Timer
    3V~6V
    CDP68HC68T1
    20μA~500μA @ 5V
    2.2V~6V

Certification

  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

Latest News