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BR25L010FVJ-WE2

Rohm Semiconductor BR25L010FVJ-WE2

Part Number:
BR25L010FVJ-WE2
Manufacturer:
Rohm Semiconductor
Ventron No:
3230752-BR25L010FVJ-WE2
Description:
IC EEPROM 1KBIT 5MHZ 8TSSOP-J
ECAD Model:
Datasheet:
BR25Lzzz-W Series

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Specifications
Rohm Semiconductor BR25L010FVJ-WE2 technical specifications, attributes, parameters and parts with similar specifications to Rohm Semiconductor BR25L010FVJ-WE2.
  • Contact Plating
    Copper, Tin
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tape & Reel (TR)
  • Published
    2010
  • JESD-609 Code
    e2
  • Pbfree Code
    yes
  • Part Status
    Not For New Designs
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    8
  • ECCN Code
    EAR99
  • Terminal Finish
    TIN COPPER
  • HTS Code
    8542.32.00.51
  • Technology
    CMOS
  • Voltage - Supply
    1.8V~5.5V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    2.5V
  • Terminal Pitch
    0.65mm
  • Reflow Temperature-Max (s)
    10
  • Base Part Number
    BR25L010
  • Pin Count
    8
  • JESD-30 Code
    S-PDSO-G8
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    5V
  • Supply Voltage-Min (Vsup)
    1.8V
  • Interface
    SPI, Serial
  • Memory Size
    1Kb 128 x 8
  • Memory Type
    Non-Volatile
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    5MHz
  • Supply Current-Max
    0.003mA
  • Access Time
    5 μs
  • Memory Format
    EEPROM
  • Memory Interface
    SPI
  • Organization
    128X8
  • Memory Width
    8
  • Write Cycle Time - Word, Page
    5ms
  • Density
    1 kb
  • Standby Current-Max
    0.000002A
  • Serial Bus Type
    SPI
  • Endurance
    1000000 Write/Erase Cycles
  • Write Cycle Time-Max (tWC)
    5ms
  • Data Retention Time-Min
    40
  • Write Protection
    HARDWARE
  • Height Seated (Max)
    1.05mm
  • Length
    3mm
  • Width
    3mm
  • RoHS Status
    ROHS3 Compliant
  • Lead Free
    Lead Free
Description
BR25L010FVJ-WE2 Overview
The surface mount type of mount is commonly used for electronic components, and this particular one has a mounting type of surface mount. Its package or case is 8-TSSOP, 8-MSOP with a width of 0.118 inches or 3.00 millimeters. It has an operating temperature range of -40°C to 85°C, making it suitable for use in various environments. Additionally, it is labeled as Pbfree, indicating that it is free of lead. Its HTS code is 8542.32.00.51, which is used for classifying imported goods. The terminal position is dual, meaning that it has two terminals for connection. The maximum supply current for this component is 0.003mA, and it has a write cycle time of 5ms for both word and page. It also has a high endurance, with a capacity for 1000000 write/erase cycles.

BR25L010FVJ-WE2 Features
Package / Case: 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
Operating Supply Voltage:5V

BR25L010FVJ-WE2 Applications
There are a lot of ROHM Semiconductor BR25L010FVJ-WE2 Memory applications.

servers
hard disk drive (HDD)
nonvolatile BIOS memory
mainframes
eSRAM
eDRAM
telecommunications
multimedia computers
main computer memory
workstations,
BR25L010FVJ-WE2 More Descriptions
EEPROM Serial-SPI 1K-bit 128 x 8 2.5V/3.3V/5V 8-Pin TSSOP-BJ T/R
IC EEPROM 1KBIT SPI 5MHZ 8TSSOP
OEMs, CMs ONLY (NO BROKERS)
EEPROM SPI 128X8 BIT
Product Comparison
The three parts on the right have similar specifications to BR25L010FVJ-WE2.
  • Image
    Part Number
    Manufacturer
    Contact Plating
    Mount
    Mounting Type
    Package / Case
    Operating Temperature
    Packaging
    Published
    JESD-609 Code
    Pbfree Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    ECCN Code
    Terminal Finish
    HTS Code
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    Pin Count
    JESD-30 Code
    Qualification Status
    Operating Supply Voltage
    Supply Voltage-Min (Vsup)
    Interface
    Memory Size
    Memory Type
    Operating Mode
    Clock Frequency
    Supply Current-Max
    Access Time
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Write Cycle Time - Word, Page
    Density
    Standby Current-Max
    Serial Bus Type
    Endurance
    Write Cycle Time-Max (tWC)
    Data Retention Time-Min
    Write Protection
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Lead Free
    Factory Lead Time
    Surface Mount
    Number of Pins
    Series
    Additional Feature
    Time@Peak Reflow Temperature-Max (s)
    Supply Voltage-Max (Vsup)
    Power Supplies
    Parallel/Serial
    REACH SVHC
    View Compare
  • BR25L010FVJ-WE2
    BR25L010FVJ-WE2
    Rohm Semiconductor
    Copper, Tin
    Surface Mount
    Surface Mount
    8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
    -40°C~85°C TA
    Tape & Reel (TR)
    2010
    e2
    yes
    Not For New Designs
    1 (Unlimited)
    8
    EAR99
    TIN COPPER
    8542.32.00.51
    CMOS
    1.8V~5.5V
    DUAL
    260
    1
    2.5V
    0.65mm
    10
    BR25L010
    8
    S-PDSO-G8
    Not Qualified
    5V
    1.8V
    SPI, Serial
    1Kb 128 x 8
    Non-Volatile
    SYNCHRONOUS
    5MHz
    0.003mA
    5 μs
    EEPROM
    SPI
    128X8
    8
    5ms
    1 kb
    0.000002A
    SPI
    1000000 Write/Erase Cycles
    5ms
    40
    HARDWARE
    1.05mm
    3mm
    3mm
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • BR25H080F-2CE2
    BR25H080F-2CE2
    Rohm Semiconductor
    -
    -
    Surface Mount
    8-SOIC (0.173, 4.40mm Width)
    -40°C~125°C TA
    Cut Tape (CT)
    2013
    -
    -
    Active
    1 (Unlimited)
    8
    -
    -
    -
    CMOS
    2.5V~5.5V
    DUAL
    NOT SPECIFIED
    1
    5V
    1.27mm
    -
    -
    -
    -
    Not Qualified
    -
    4.5V
    -
    8Kb 1K x 8
    Non-Volatile
    SYNCHRONOUS
    10MHz
    0.004mA
    -
    EEPROM
    SPI
    -
    8
    4ms
    -
    -
    SPI
    1000000 Write/Erase Cycles
    4ms
    100
    HARDWARE/SOFTWARE
    1.71mm
    5mm
    4.4mm
    ROHS3 Compliant
    -
    16 Weeks
    YES
    8
    Automotive, AEC-Q100
    ALSO OPERATES AT 2.5V WITH 5MHZ AND SEATED HT-CALCULATED
    NOT SPECIFIED
    5.5V
    3/5V
    SERIAL
    Unknown
    BR25L010FVJ-WE2 vs BR25H080F-2CE2
  • BR25L020FVJ-WE2
    BR25L020FVJ-WE2
    Rohm Semiconductor
    Copper, Tin
    Surface Mount
    Surface Mount
    8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
    -40°C~85°C TA
    Tape & Reel (TR)
    2005
    e2
    yes
    Not For New Designs
    1 (Unlimited)
    8
    EAR99
    TIN COPPER
    8542.32.00.51
    CMOS
    1.8V~5.5V
    DUAL
    260
    1
    2.5V
    0.65mm
    10
    BR25L020
    8
    S-PDSO-G8
    Not Qualified
    5V
    1.8V
    SPI, Serial
    2Kb 256 x 8
    Non-Volatile
    SYNCHRONOUS
    5MHz
    0.003mA
    5 μs
    EEPROM
    SPI
    256X8
    8
    5ms
    2 kb
    0.000002A
    SPI
    1000000 Write/Erase Cycles
    5ms
    40
    HARDWARE
    1.05mm
    3mm
    3mm
    ROHS3 Compliant
    Lead Free
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    BR25L010FVJ-WE2 vs BR25L020FVJ-WE2
  • BR25010N-10SU-2.7
    BR25010N-10SU-2.7
    Rohm Semiconductor
    Copper, Tin
    Surface Mount
    Surface Mount
    8-SOIC (0.154, 3.90mm Width)
    -40°C~85°C TA
    Tape & Reel (TR)
    -
    -
    -
    Not For New Designs
    1 (Unlimited)
    8
    -
    -
    -
    CMOS
    2.7V~5.5V
    DUAL
    -
    -
    -
    1.27mm
    -
    BR25010
    -
    -
    Not Qualified
    5V
    -
    SPI, Serial
    1Kb 128 x 8
    Non-Volatile
    -
    3MHz
    0.006mA
    800 ns
    EEPROM
    SPI
    -
    8
    5ms
    1 kb
    0.000005A
    SPI
    1000000 Write/Erase Cycles
    -
    100
    HARDWARE/SOFTWARE
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    8
    -
    -
    -
    -
    -
    -
    -
    BR25L010FVJ-WE2 vs BR25010N-10SU-2.7
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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