Infineon Technologies BGF110E6327XT

BGF110E6327XT Overview
The surface mount BGF110 is a compact and versatile component that was first published in 2005. Its mounting type is surface mount, making it easy to install on a variety of surfaces. The packaging for this component is tape and reel, providing convenience and protection during transportation. However, it is important to note that this part is now discontinued, but it still offers a minimum operating temperature of -40°C, making it suitable for a range of applications. One such application is HSMMC (High Speed Multi Media Card), where the BGF110's depth of 2mm and length of 2mm make it a perfect fit. Despite being discontinued, the BGF110 remains a reliable and efficient choice for various electronic projects.

BGF110E6327XT Features
Applications : HSMMC (High Speed Multi Media Card)
Supplier Device Package : WLP-24-2

BGF110E6327XT Applications
There are a lot of Infineon Technologies BGF110E6327XT Specialized ICs applications.

All converters requiring very low standby power
DeviceNet Applications
Reference Design License Management
Message Security
Ecosystem Control
Portable Instruments
Isolated CAN Bus Interface
Peripheral Authentication
IoT Node Authentication
Secure Management of Limited Use Consumables