Advanced Thermal Solutions Inc. ATS-21B-63-C2-R0
- Part Number:
- ATS-21B-63-C2-R0
- Manufacturer:
- Advanced Thermal Solutions Inc.
- Ventron No:
- 2565947-ATS-21B-63-C2-R0
- Description:
- HEATSINK 40X40X20MM L-TAB T766
- Datasheet:
- ATS-21B-63-C2-R0
Advanced Thermal Solutions Inc. ATS-21B-63-C2-R0 technical specifications, attributes, parameters and parts with similar specifications to Advanced Thermal Solutions Inc. ATS-21B-63-C2-R0.
- Factory Lead Time6 Weeks
- MountPush Pin
- MaterialAluminum
- ShapeSquare, Fins
- Package CooledAssorted (BGA, LGA, CPU, ASIC...)
- Material FinishBlue Anodized
- SeriespushPIN™
- Published2013
- Part StatusActive
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Attachment MethodPush Pin
- Height Off Base (Height of Fin)0.790 20.00mm
- Thermal Resistance @ Forced Air Flow12.32°C/W @ 100 LFM
- Length1.575 40.00mm
- Width1.575 40.00mm
- RoHS StatusROHS3 Compliant
The ATS-21B-63-C2-R0 is HEATSINK 40X40X20MM L-TAB T766 , it is part of pushPIN™ series. they are designed to work as obsolete (EOL) components.ATS-21B-63-C2-R0 with pin details manufactured by Advanced Thermal Solutions, Inc.. The ATS-21B-63-C2-R0 is available in Package,it is part of the electronic component Chips.that includes pushPIN™ Series. they are designed to operate as obsolete (EOL) components.it is with Operating Temperature .ATS-21B-63-C2-R0 with original stock manufactured by Advanced Thermal Solutions, Inc.. The ATS-21B-63-C2-R0 is available in Package.Generally IC chips offer Mounting Style features such as SMD/SMT, Package Case of ATS-21B-63-C2-R0is designed to work in , it's Operating Temperature is .The ATS-21B-63-C2-R0 is available in Package, is part of the obsolete (EOL) components and belong to Obsolete Integrated Circuits.ATS-21B-63-C2-R0 with EDA / CAD Models manufactured by Advanced Thermal Solutions, Inc.. The ATS-21B-63-C2-R0 is available in Package, is part of the Obsolete Integrated Circuits.The ATS-21B-63-C2-R0 is obsolete (EOL) components with package manufactured by Advanced Thermal Solutions, Inc.. The ATS-21B-63-C2-R0 is available in Package, is part of the HEATSINK 40X40X20MM L-TAB T766.
ATS-21B-63-C2-R0 More Descriptions
HEATSINK 40X40X20MM L-TAB T766
The three parts on the right have similar specifications to ATS-21B-63-C2-R0.
-
ImagePart NumberManufacturerFactory Lead TimeMountMaterialShapePackage CooledMaterial FinishSeriesPublishedPart StatusMoisture Sensitivity Level (MSL)Attachment MethodHeight Off Base (Height of Fin)Thermal Resistance @ Forced Air FlowLengthWidthRoHS StatusWeightVoltageProduct TypeDimensions - OverallPower - CoolingView Compare
-
ATS-21B-63-C2-R06 WeeksPush PinAluminumSquare, FinsAssorted (BGA, LGA, CPU, ASIC...)Blue AnodizedpushPIN™2013Active1 (Unlimited)Push Pin0.790 20.00mm12.32°C/W @ 100 LFM1.575 40.00mm1.575 40.00mmROHS3 Compliant------
-
6 Weeks-----ATS-HE222017ActiveNot ApplicableBolt On----ROHS3 Compliant6.3lbs 2.9kg48VActive, Heat Exchanger10.06 L x 9.04 W x 2.64 H (255.4mm x 229.5mm x 67.0mm)64W
-
6 Weeks-----ATS-HE242017ActiveNot ApplicableBolt On----ROHS3 Compliant12.8lbs 5.8kg24VActive, Heat Exchanger13.28 L x 12.09 W x 2.64 H (337.3mm x 307.0mm x 67.0mm)97W
-
6 Weeks-----ATS-HE242017ActiveNot ApplicableBolt On----ROHS3 Compliant12.8lbs 5.8kg48VActive, Heat Exchanger13.28 L x 12.09 W x 2.64 H (337.3mm x 307.0mm x 67.0mm)97W
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
26 February 2024
STM32F407VGT6 Microcontroller Replacements, Application Fields and Package
Ⅰ. STM32F407VGT6 overviewⅡ. STM32F407VGT6 parameter conditionsⅢ. STM32F407VGT6 application areasⅣ. Package of STM32F407VGT6Ⅴ. Hardware design and software design of STM32F407VGT6 microcontrollerⅥ. Absolute maximum ratings of STM32F407VGT6Ⅶ. How to evaluate... -
27 February 2024
LD7575PS Manufacturer, Advantages and Disadvantages and Other Details
Ⅰ. What is LD7575PS?Ⅱ. Pins and functions of LD7575PSⅢ. Manufacturer of LD7575PSⅣ. How does LD7575PS achieve stable output voltage?Ⅴ. Block diagram of LD7575PSⅥ. What is the performance of... -
27 February 2024
BQ32000DR Structure, Technical Parameters, Layout Guidelines and Applications
Ⅰ. Overview of BQ32000DRⅡ. Structure of BQ32000DRⅢ. Simplified schematic of BQ32000DRⅣ. Technical parameters of BQ32000DRⅤ. Layout guidelines for BQ32000DRⅥ. Where to use BQ32000DR?Ⅶ. How does the backup power... -
28 February 2024
An In-Depth Look at the TXS0108ERGYR: A Solution for Logic Level Conversion
Ⅰ. TXS0108ERGYR overviewⅡ. Specifications of TXS0108ERGYRⅢ. Recommended operating conditions of TXS0108ERGYRⅣ. Advantages of TXS0108ERGYRⅤ. Functional block diagram of TXSO108ERGYRⅥ. Application areas of TXS0108ERGYRⅦ. Wiring and circuit design of...
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.