APA600-BGG456I

Microsemi Corporation APA600-BGG456I

Part Number:
APA600-BGG456I
Manufacturer:
Microsemi Corporation
Ventron No:
3635049-APA600-BGG456I
Description:
IC FPGA 356 I/O 456BGA
ECAD Model:
Datasheet:
APA600-BGG456I

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Specifications
Microsemi Corporation APA600-BGG456I technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation APA600-BGG456I.
  • Factory Lead Time
    10 Weeks
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    456-BBGA
  • Number of Pins
    456
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tray
  • Published
    2007
  • Series
    ProASICPLUS
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    456
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    2.3V~2.7V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    2.5V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    APA600
  • Number of Outputs
    356
  • Operating Supply Voltage
    2.5V
  • Power Supplies
    2.52.5/3.3V
  • Number of I/O
    356
  • RAM Size
    15.8kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Total RAM Bits
    129024
  • Number of Gates
    600000
  • Max Frequency
    180MHz
  • Number of Registers
    21504
  • Height
    1.73mm
  • Length
    35mm
  • Width
    35mm
  • Radiation Hardening
    No
  • RoHS Status
    RoHS Compliant
Description
APA600-BGG456I Overview
The device in question has a total of 456 pins, making it suitable for a wide range of applications. It has an operating temperature range of -40°C to 85°C, ensuring its functionality in extreme environments. The terminal finish is made of Tin, Silver, and Copper (Sn/Ag/Cu), providing a reliable and durable connection. The technology used is CMOS, which is known for its low power consumption and high performance. With a RAM size of 15.8kB, this device is capable of handling complex tasks efficiently. It is a FIELD PROGRAMMABLE GATE ARRAY, meaning it can be programmed to perform specific functions as needed. Additionally, it has 21504 registers and a length of 35mm. While it is not radiation hardened, it is still a reliable and safe option as it is RoHS compliant.

APA600-BGG456I Features
356 I/Os
Up to 129024 RAM bits
456 LABs/CLBs
21504 registers

APA600-BGG456I Applications
There are a lot of Microsemi Corporation APA600-BGG456I FPGAs applications.

Artificial intelligence (AI)
Ecosystem
Filtering and communication encoding
Wired Communications
Defense Applications
Scientific Instruments
Consumer Electronics
Data center search engines
Bioinformatics
ASIC prototyping
APA600-BGG456I More Descriptions
FPGA ProASICPLUS Family 600K Gates 180MHz 0.22um (CMOS) Technology 2.5V 456-Pin BGA
APA Series 690000 System Gates 356 I/O 126 kb ProASICPLUS® FPGA -PBGA-456
Apa600-Bgg456I Lead Free 456 Pbga 35X35X2.60Mm Tray Rohs Compliant: Yes |Microchip APA600-BGG456I
ProASICPlus FPGA, 600K System Gates
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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