APA600-BGG456

Microsemi Corporation APA600-BGG456

Part Number:
APA600-BGG456
Manufacturer:
Microsemi Corporation
Ventron No:
3128531-APA600-BGG456
Description:
IC FPGA 356 I/O 456BGA
ECAD Model:
Datasheet:
APA600-BGG456

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Specifications
Microsemi Corporation APA600-BGG456 technical specifications, attributes, parameters and parts with similar specifications to Microsemi Corporation APA600-BGG456.
  • Factory Lead Time
    18 Weeks
  • Contact Plating
    Copper, Silver, Tin
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    456-BBGA
  • Number of Pins
    456
  • Operating Temperature
    0°C~70°C TA
  • Packaging
    Tray
  • Published
    2007
  • Series
    ProASICPLUS
  • JESD-609 Code
    e1
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    456
  • Terminal Finish
    Tin/Silver/Copper (Sn/Ag/Cu)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    2.3V~2.7V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    245
  • Supply Voltage
    2.5V
  • Terminal Pitch
    1.27mm
  • Frequency
    180MHz
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    APA600
  • Number of Outputs
    356
  • Operating Supply Voltage
    2.5V
  • Power Supplies
    2.52.5/3.3V
  • Number of I/O
    356
  • RAM Size
    15.8kB
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Total RAM Bits
    129024
  • Number of Gates
    600000
  • Number of Registers
    21504
  • Height
    1.73mm
  • Length
    35mm
  • Width
    35mm
  • Radiation Hardening
    No
  • RoHS Status
    RoHS Compliant
Description
APA600-BGG456 Overview
The APA600 is a powerful microcontroller that was first published in 2007. It comes in a 456-BBGA package, making it suitable for surface mount applications. The terminal position is located at the bottom of the package, allowing for easy placement on a circuit board. The maximum reflow temperature for this device is 40 seconds, ensuring that it can withstand high-temperature soldering processes. With a RAM size of 15.8kB and 600,000 gates, the APA600 is capable of handling complex tasks and data storage. It also has 21,504 registers, providing ample space for storing and manipulating data. This microcontroller requires 2.5/3.3V power supplies, making it energy efficient and versatile for various electronic projects.

APA600-BGG456 Features
356 I/Os
Up to 129024 RAM bits
456 LABs/CLBs
21504 registers
Operating from a frequency of 180MHz

APA600-BGG456 Applications
There are a lot of Microsemi Corporation APA600-BGG456 FPGAs applications.

Secure Communication
Digital signal processing
Defense Applications
High Performance Computing
Automotive
Device controllers
Security systems
Artificial intelligence (AI)
Distributed Monetary Systems
Data Mining
APA600-BGG456 More Descriptions
FPGA ProASICPLUS Family 600K Gates 180MHz 0.22um Technology 2.5V 456-Pin BGA Tray
Apa600-Bgg456 Lead Free 456 Pbga 35X35X2.60Mm Tray Rohs Compliant: Yes |Microchip APA600-BGG456
FPGA - Field Programmable Gate Array APA600-BGG456 LEAD FREE
ProASICPlus FPGA, 600K System Gates
IC FPGA PROASIC 600K 456-PBGA
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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