Microsemi Corporation A3PN125-Z1VQG100I

A3PN125-Z1VQG100I Overview
In the package 100-TQFP, this product is provided. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. A total of 71 I/Os are programmed to ensure a more coherent data transfer. Supply voltage is 1.5V volts. There is a Field Programmable Gate Arrays family component in this FPGA part. By attaching the Surface Mount connector, you can use this FPGA module with your development board. With a supply voltage of 1.425V~1.575V, this device operates with ease. This is a type of FPGA that is part of the ProASIC3 nano series of FPGAs. Fpga chips is necessary to keep the operating temperature wFpga chipshin -40°C~100°C TJ when the device is operating. In this device, 71 outputs are incorporated in order to provide you with maximum flexibility. As a result of space limitations, this FPGA model has been included in Tray. In total, the terminations of this piece are 100. Fpga electronics is worth mentioning that this device provides 36864 bfpga electronics s of RAM. A3PN125 is the base part number that can be used to identify related parts. The RAM si4.5kBe of this FPGA module reaches 4.5kB so as to guarantee the normal operation of the program during operation. The device has 100 pins which are included in the design. I think, as long as this FPGA is mounted in Surface Mount, it could perform excellently according to its specifications as long as you mount it in Surface Mount. In operation with 1.5V, designers can take advantage of its flexibility to the fullest extent. A basic building block for this type of building block consists of 125000 gates. The structure of the registers used to store and transfer data consists of 3072 registers.

A3PN125-Z1VQG100I Features
71 I/Os
Up to 36864 RAM bits
100 LABs/CLBs
3072 registers


A3PN125-Z1VQG100I Applications
There are a lot of Microsemi Corporation
A3PN125-Z1VQG100I FPGAs applications.


Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
Automotive
Consumer Electronics
Distributed Monetary Systems
Data Center