74FCT3807ASOG8
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IDT, Integrated Device Technology Inc 74FCT3807ASOG8

Part Number:
74FCT3807ASOG8
Manufacturer:
IDT, Integrated Device Technology Inc
Ventron No:
2974701-74FCT3807ASOG8
Description:
IC CLK BUFFER 1:10 100MHZ 20SOIC
ECAD Model:
Datasheet:
74FCT3807ASOG8
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Payment
Delivery:
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Specifications
IDT, Integrated Device Technology Inc 74FCT3807ASOG8 technical specifications, attributes, parameters and parts with similar specifications to IDT, Integrated Device Technology Inc 74FCT3807ASOG8.
  • Factory Lead Time
    7 Weeks
  • Contact Plating
    Tin
  • Mount
    Surface Mount
  • Package / Case

    Package / Case refers to the physical housing or enclosure that encapsulates an electronic component. It provides protection, facilitates handling, and enables electrical connections. The package type determines the component's size, shape, pin configuration, and mounting options. Common package types include DIP (dual in-line package), SOIC (small outline integrated circuit), and BGA (ball grid array). The package also influences the component's thermal and electrical performance.

    SOIC
  • Number of Pins

    Number of Pins: Indicates the number of electrical connections available on the component. These pins are used to connect the component to other components or circuits on a printed circuit board (PCB). The number of pins determines the functionality and connectivity options of the component. It is important to ensure that the component has the correct number of pins for the intended application.

    20
  • Packaging
    Tape & Reel (TR)
  • Published
    2009
  • JESD-609 Code
    e3
  • Pbfree Code
    yes
  • Part Status

    Part Status is an electronic component parameter that indicates the availability and production status of a component. It is typically used to inform customers about the availability of a component, whether it is in production, end-of-life, or obsolete. Part Status can also provide information about any restrictions or limitations on the component's use, such as whether it is only available for certain applications or if it has been discontinued.

    Active
  • Moisture Sensitivity Level (MSL)

    Moisture Sensitivity Level (MSL) is a measure of the susceptibility of a surface mount electronic component to moisture-induced damage during soldering. It is classified into six levels, from 1 (least sensitive) to 6 (most sensitive). MSL is determined by the materials used in the component's construction, including the solderability of its terminals and the presence of moisture-absorbing materials. Components with higher MSL ratings require more stringent handling and storage conditions to prevent moisture absorption and subsequent damage during soldering.

    1
  • Number of Terminations
    20
  • ECCN Code
    EAR99
  • Max Operating Temperature
    70°C
  • Min Operating Temperature
    0°C
  • Subcategory
    Clock Drivers
  • Technology

    Technology, in the context of electronic components, refers to the specific manufacturing process and materials used to create the component. It encompasses the semiconductor fabrication techniques, such as the type of transistor used (e.g., MOSFET, BJT), the gate oxide thickness, and the interconnect materials. Technology also includes the packaging type, such as surface mount or through-hole, and the leadframe or substrate material. The technology used impacts the component's performance characteristics, such as speed, power consumption, and reliability.

    CMOS
  • Terminal Position
    DUAL
  • Terminal Form
    GULL WING
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage

    Supply Voltage is the voltage required to power an electronic component. It is typically measured in volts (V) and is specified in the component's datasheet. The supply voltage must be within the specified range for the component to function properly. If the supply voltage is too low, the component may not function at all. If the supply voltage is too high, the component may be damaged.

    3.3V
  • Reflow Temperature-Max (s)
    30
  • Pin Count
    20
  • Number of Outputs

    Number of Outputs refers to the number of independent output signals or channels that an electronic component can provide. It indicates the capability of the component to drive multiple external devices or circuits simultaneously. A higher number of outputs allows for greater flexibility and connectivity in electronic systems.

    10
  • Qualification Status
    Not Qualified
  • Operating Supply Voltage
    3.3V
  • Temperature Grade
    COMMERCIAL
  • Number of Circuits

    Number of Circuits refers to the number of independent signal paths within an electronic component. It indicates how many separate circuits or channels the component can handle simultaneously. For example, an operational amplifier with a Number of Circuits of 2 can amplify two separate input signals independently. This parameter is crucial for determining the component's functionality and its suitability for specific applications.

    1
  • Max Supply Voltage
    3.6V
  • Min Supply Voltage
    3V
  • Propagation Delay
    4.3 ns
  • Quiescent Current

    Quiescent current is the amount of current drawn by an electronic component when it is not actively performing its intended function. It is typically measured in milliamps (mA) or microamps (µA). Quiescent current is important because it can affect the overall power consumption of a circuit, especially in battery-powered devices. Components with high quiescent current can drain batteries more quickly than those with low quiescent current.

    10μA
  • Frequency (Max)
    100MHz
  • Family
    FCT
  • Input
    LVTTL
  • Logic IC Type
    LOW SKEW CLOCK DRIVER
  • Max I(ol)
    0.024 A
  • Same Edge Skew-Max (tskwd)
    0.35 ns
  • Length

    Length, in the context of electronic components, refers to the physical dimension of a component along its longest axis. It is typically measured in millimeters (mm) or inches (in). Length is a crucial parameter for determining the physical size and space requirements of a component on a printed circuit board (PCB) or other assembly. It also affects the component's electrical characteristics, such as inductance and capacitance, which can be influenced by the length of conductors or traces within the component.

    12.8mm
  • Width
    7.6mm
  • Thickness

    Thickness, in the context of electronic components, refers to the vertical distance between two opposing surfaces of a component. It is typically measured in millimeters (mm) or inches (in). Thickness is a crucial parameter that affects the component's physical dimensions, weight, and performance characteristics. It influences factors such as heat dissipation, electrical insulation, and mechanical stability. Thinner components generally offer better heat dissipation and space efficiency, while thicker components may provide enhanced durability and structural integrity.

    2.34mm
  • RoHS Status
    RoHS Compliant
  • Lead Free
    Lead Free
Description
74FCT3807ASOG8 Overview
The product is a SOIC package, published in 2009. It has a maximum operating temperature of 70°C and a minimum operating temperature of 0°C. The technology used is CMOS and it has a DUAL terminal position with a GULL WING terminal form. It contains 1 circuit and has a maximum I(ol) of 0.024 A. It is also RoHS compliant.

74FCT3807ASOG8 Features
20 terminations
Clock Drivers subcategory
logic IC type of LOW SKEW CLOCK DRIVER

74FCT3807ASOG8 Applications
There are a lot of Integrated Device Technology (IDT) 74FCT3807ASOG8 Clock Buffers & Drivers applications.

Medical instruments
Storage area network
Zero crossing detector
Clock signal format conversion
Base station
Medical imaging
Mass storage system
Navigation equipment
FPGA
Patient diagnosis
74FCT3807ASOG8 More Descriptions
DUAL Tin Not Qualified COMMERCIAL Clock (Type) IC 70C 100MHz 0.35ns 0.024A
Clock Drivers & Distribution 3.3V 1:10 Clock Driver
IC CLK BUFFER 1:10 100MHZ 20SOIC
3.3V CMOS 1-to-10 Clock Driver
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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