Part Number: PA0170 vs PA0106
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Part Number: | PA0170 | PA0106 |
Manufacturer: | Chip Quik Inc. | Chip Quik Inc. |
Description: | MINI SOIC-8 EXP PAD TO DIP-8 SMT | PLCC-28/LCC-28/JLCC-28 TO DIP-28 |
Quantity Available: | Available | Available |
Datasheets: | - | - |
Material | FR4 Epoxy Glass | FR4 Epoxy Glass |
Package Accepted | MiniSOIC EP | LCC, JLCC, PLCC |
Series | Proto-Advantage | Proto-Advantage |
Published | 2009 | 2009 |
Size / Dimension | 0.700 x 0.400 17.78mmx10.16mm | 1.000 x 1.400 25.40mmx35.56mm |
Part Status | Active | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | 1 (Unlimited) |
Number of Positions | 8 | 28 |
Pitch | 0.026 0.65mm | 0.050 1.27mm |
Proto Board Type | SMD to DIP | SMD to DIP |
Board Thickness | 0.062 1.57mm 1/16 | 0.062 1.57mm 1/16 |
RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
Factory Lead Time | - | 2 Weeks |
Submit RFQ: | Submit | Submit |