Part Number: MT53B256M32D1GZ-062 WT ES:B TR vs MT53B256M64D2PX-062 XT:C
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| Part Number: | MT53B256M32D1GZ-062 WT ES:B TR | MT53B256M64D2PX-062 XT:C |
| Manufacturer: | Micron Technology Inc. | Micron Technology Inc. |
| Description: | IC SDRAM 8GBIT 1.6GHZ 200FBGA | Memory IC |
| Quantity Available: | Available | Available |
| Datasheets: | - | - |
| Factory Lead Time | 10 Weeks | 9 Weeks |
| Mounting Type | Surface Mount | - |
| Package / Case | 200-WFBGA | - |
| Operating Temperature | -30°C~85°C TC | -30°C~105°C TC |
| Packaging | Tape & Reel (TR) | Tray |
| Part Status | Obsolete | Active |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | - |
| Technology | SDRAM - Mobile LPDDR4 | SDRAM - Mobile LPDDR4 |
| Voltage - Supply | 1.1V | 1.1V |
| Memory Size | 8Gb 256M x 32 | 16Gb 256M x 64 |
| Memory Type | Volatile | Volatile |
| Clock Frequency | 1600MHz | 1600MHz |
| Memory Format | DRAM | DRAM |
| RoHS Status | ROHS3 Compliant | - |
| Submit RFQ: | Submit | Submit |
| Image | Part Number | Manufacturer | Description | Compare |
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MT53B256M32D1NP-062 AAT:C | Micron Technology Inc. | Memory IC | Compare |
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MT53B256M32D1DS-062 AAT:C | Micron Technology Inc. | Memory IC | Compare |
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MT53B256M32D1DS-062 AAT:C TR | Micron Technology Inc. | Memory IC | Compare |
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MT53B256M32D1NP-062 AUT:C TR | Micron Technology Inc. | Memory IC | Compare |
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MT53B256M32D1DS-062 AIT:C TR | Micron Technology Inc. | Memory IC | Compare |
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MT53B256M32D1NP-062 AIT:C | Micron Technology Inc. | Memory IC | Compare |
