Part Number: MK53DX256CMD10 vs MK53DN512ZCMD10
| Product CompareMain parameters of the product comparison, the results for reference only, so that you choose a more suitable product! |  |
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| Part Number: | MK53DX256CMD10 | MK53DN512ZCMD10 |
| Manufacturer: | NXP USA Inc. | NXP USA Inc. |
| Description: | IC MCU 32BIT 256KB FLASH 144BGA | IC MCU 32BIT 512KB FLASH 144BGA |
| Quantity Available: | Available | Available |
| Datasheets: | - | - |
| Factory Lead Time | 13 Weeks | - |
| Mounting Type | Surface Mount | Surface Mount |
| Package / Case | 144-LBGA | 144-LBGA |
| Surface Mount | YES | YES |
| Operating Temperature | -40°C~85°C TA | -40°C~85°C TA |
| Packaging | Tray | Tray |
| Published | 2002 | 2013 |
| Series | Kinetis K50 | Kinetis K50 |
| JESD-609 Code | e1 | e1 |
| Part Status | Active | Not For New Designs |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | 3 (168 Hours) |
| Number of Terminations | 144 | 144 |
| ECCN Code | 3A991.A.2 | 3A991.A.2 |
| Terminal Finish | TIN SILVER COPPER | TIN SILVER COPPER |
| HTS Code | 8542.31.00.01 | 8542.31.00.01 |
| Subcategory | Microcontrollers | - |
| Technology | CMOS | CMOS |
| Terminal Position | BOTTOM | BOTTOM |
| Terminal Form | BALL | BALL |
| Peak Reflow Temperature (Cel) | 260 | 260 |
| Supply Voltage | 3.3V | 3.3V |
| Terminal Pitch | 1mm | 0.5mm |
| Reflow Temperature-Max (s) | 40 | - |
| Base Part Number | MK53DX256 | MK53DN512 |
| JESD-30 Code | S-PBGA-B144 | S-PBGA-B144 |
| Qualification Status | Not Qualified | Not Qualified |
| Supply Voltage-Max (Vsup) | 3.6V | 3.6V |
| Power Supplies | 1.8/3.3V | - |
| Supply Voltage-Min (Vsup) | 1.71V | 1.71V |
| Oscillator Type | Internal | Internal |
| Number of I/O | 94 | 94 |
| Speed | 100MHz | 100MHz |
| RAM Size | 128K x 8 | 128K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.71V~3.6V | 1.71V~3.6V |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC | MICROCONTROLLER, RISC |
| Core Processor | ARM® Cortex®-M4 | ARM® Cortex®-M4 |
| Peripherals | DMA, I2S, LCD, LVD, POR, PWM, WDT | DMA, I2S, LCD, LVD, POR, PWM, WDT |
| Clock Frequency | 50MHz | 32MHz |
| Program Memory Type | FLASH | FLASH |
| Core Size | 32-Bit | 32-Bit |
| Program Memory Size | 256KB 256K x 8 | 512KB 512K x 8 |
| Connectivity | EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG | EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG |
| Supply Current-Max | 77mA | - |
| Bit Size | 32 | 32 |
| Data Converter | A/D 41x16b; D/A 2x12b | A/D 41x16b; D/A 2x12b |
| Has ADC | YES | YES |
| DMA Channels | YES | YES |
| PWM Channels | YES | YES |
| DAC Channels | YES | YES |
| ROM (words) | 262144 | - |
| EEPROM Size | 4K x 8 | - |
| CPU Family | CORTEX-M4 | - |
| Length | 13mm | 13mm |
| Width | 13mm | 13mm |
| RoHS Status | ROHS3 Compliant | ROHS3 Compliant |
| Time@Peak Reflow Temperature-Max (s) | - | 40 |
| Height Seated (Max) | - | 1.7mm |
| Submit RFQ: | Submit | Submit |
| Image | Part Number | Manufacturer | Description | Compare |
|---|---|---|---|---|
 |
MK53DN512CLQ10 | NXP USA Inc. | IC MCU 32BIT 512KB FLASH 144LQFP | Compare |
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MK53DN512CMD10 | NXP USA Inc. | IC MCU 32BIT 512KB FLASH 144BGA | Compare |
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MK53DN512ZCLQ10 | NXP USA Inc. | IC MCU 32BIT 512KB FLASH 144LQFP | Compare |
