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Part Number: |
XCKU035-3FBVA900E |
XCKU115-3FLVB1760E |
Manufacturer: |
Xilinx Inc. |
Xilinx Inc. |
Description: |
IC FPGA 468 I/O 900FCBGA |
IC FPGA 702 I/O 1760FCBGA |
Quantity Available: |
Available |
Available |
Datasheets: |
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Wireless Bluetooth® Low Energy Modules Overview
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Factory Lead Time |
10 Weeks |
10 Weeks |
Mounting Type |
Surface Mount |
Surface Mount |
Package / Case |
900-BBGA, FCBGA |
1760-BBGA, FCBGA |
Surface Mount |
YES |
YES |
Operating Temperature |
0°C~100°C TJ |
0°C~100°C TJ |
Packaging |
Bulk |
Bulk |
Published |
2012 |
2012 |
Series |
Kintex® UltraScale™ |
Kintex® UltraScale™ |
JESD-609 Code |
e1 |
e1 |
Part Status |
Active |
Active |
Moisture Sensitivity Level (MSL) |
4 (72 Hours) |
4 (72 Hours) |
Number of Terminations |
900 |
- |
ECCN Code |
3A991.D |
3A001.A.7.B |
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu) |
Tin/Silver/Copper (Sn/Ag/Cu) |
HTS Code |
8542.39.00.01 |
8542.39.00.01 |
Subcategory |
Field Programmable Gate Arrays |
Field Programmable Gate Arrays |
Packing Method |
TRAY |
TRAY |
Technology |
CMOS |
CMOS |
Voltage - Supply |
0.970V~1.030V |
0.970V~1.030V |
Terminal Position |
BOTTOM |
BOTTOM |
Terminal Form |
BALL |
BALL |
Peak Reflow Temperature (Cel) |
NOT SPECIFIED |
NOT SPECIFIED |
Supply Voltage |
1V |
1V |
Terminal Pitch |
1mm |
1mm |
Reflow Temperature-Max (s) |
NOT SPECIFIED |
- |
JESD-30 Code |
S-PBGA-B900 |
S-PBGA-B1760 |
Number of Outputs |
468 |
702 |
Qualification Status |
Not Qualified |
Not Qualified |
Power Supplies |
1V |
1V |
Number of I/O |
468 |
702 |
Number of Inputs |
468 |
702 |
Organization |
1700 CLBS |
5520 CLBS |
Programmable Logic Type |
FIELD PROGRAMMABLE GATE ARRAY |
FIELD PROGRAMMABLE GATE ARRAY |
Number of Logic Elements/Cells |
444343 |
1451100 |
Total RAM Bits |
19456000 |
77721600 |
Number of LABs/CLBs |
25391 |
82920 |
Number of CLBs |
1700 |
5520 |
Height Seated (Max) |
2.8mm |
3.71mm |
Length |
31mm |
42.5mm |
Width |
31mm |
42.5mm |
RoHS Status |
ROHS3 Compliant |
ROHS3 Compliant |
Time@Peak Reflow Temperature-Max (s) |
- |
NOT SPECIFIED |
Submit RFQ: |
Submit |
Submit |