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23LC512T-I/ST

Microchip Technology 23LC512T-I/ST

Part Number:
23LC512T-I/ST
Manufacturer:
Microchip Technology
Ventron No:
3232478-23LC512T-I/ST
Description:
IC SRAM 512KBIT 20MHZ 8TSSOP
ECAD Model:
Datasheet:
23LC512T-I/ST

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Specifications
Microchip Technology 23LC512T-I/ST technical specifications, attributes, parameters and parts with similar specifications to Microchip Technology 23LC512T-I/ST.
  • Factory Lead Time
    5 Weeks
  • Mounting Type
    Surface Mount
  • Package / Case
    8-TSSOP (0.173, 4.40mm Width)
  • Surface Mount
    YES
  • Operating Temperature
    -40°C~85°C TA
  • Packaging
    Tape & Reel (TR)
  • Published
    2010
  • JESD-609 Code
    e3
  • Part Status
    Active
  • Moisture Sensitivity Level (MSL)
    1 (Unlimited)
  • Number of Terminations
    8
  • Terminal Finish
    Matte Tin (Sn) - annealed
  • Technology
    CMOS
  • Voltage - Supply
    2.5V~5.5V
  • Terminal Position
    DUAL
  • Peak Reflow Temperature (Cel)
    260
  • Number of Functions
    1
  • Supply Voltage
    5V
  • Terminal Pitch
    0.65mm
  • Reflow Temperature-Max (s)
    40
  • Base Part Number
    23LC512
  • JESD-30 Code
    R-PDSO-G8
  • Qualification Status
    Not Qualified
  • Supply Voltage-Max (Vsup)
    5.5V
  • Power Supplies
    3/5V
  • Supply Voltage-Min (Vsup)
    2.5V
  • Interface
    SPI, Serial
  • Memory Size
    512Kb 64K x 8
  • Number of Ports
    1, (3 LINE)
  • Memory Type
    Volatile
  • Operating Mode
    SYNCHRONOUS
  • Clock Frequency
    20MHz
  • Supply Current-Max
    0.01mA
  • Memory Format
    SRAM
  • Memory Interface
    SPI - Quad I/O
  • Organization
    64KX8
  • Memory Width
    8
  • Standby Current-Max
    0.000004A
  • Memory Density
    524288 bit
  • Screening Level
    TS 16949
  • I/O Type
    SEPARATE
  • Standby Voltage-Min
    2.5V
  • Height Seated (Max)
    1.2mm
  • Length
    4.4mm
  • Width
    3mm
  • RoHS Status
    ROHS3 Compliant
Description
23LC512T-I/ST Overview
The package or case for this particular component is an 8-TSSOP, with dimensions of 0.173 and 4.40mm in width. It has 8 terminations and a terminal finish of matte tin, specifically annealed. The technology used for this component is CMOS. The peak reflow temperature is 260 degrees Celsius. It has a single function and an interface of SPI, Serial. In terms of memory, it has a size of 512Kb, with 64K x 8 storage capacity. It also has one port, with 3 lines. The maximum supply current for this component is 0.01mA, making it energy efficient. Overall, this component is compact, efficient, and suitable for a variety of applications.

23LC512T-I/ST Features
Package / Case: 8-TSSOP (0.173, 4.40mm Width)
I/O Type: SEPARATE

23LC512T-I/ST Applications
There are a lot of Microchip Technology 23LC512T-I/ST Memory applications.

Cache memory
Camcorders
networking
networks
servers
personal digital assistants
nonvolatile BIOS memory
personal computers
eSRAM
hard disk drive (HDD)
23LC512T-I/ST More Descriptions
512K, 2.5V Spi Serial Sram, Sqi 8 Tssop 4.4Mm T/R Rohs Compliant: Yes |Microchip 23LC512T-I/ST
2.5-5.5V 512Kb SPI Serial SRAM, 20 MHz, -40°C to 125°C, TSSOP-8, RoHSMicrochip SCT
SRAM Chip Sync Single 3.3V/5V 512K-Bit 512K x 8 25ns 8-Pin TSSOP T/R
512Kbit SPI Serial SRAM with SDI and SQI Interface
I-temp 512kb SPI SRAM, 2.5-5.5V
IC SRAM 512KBIT SPI/QUAD 8TSSOP
SRAM 512K 2.5V SPI SERIAL SRAM SQI
Product Comparison
The three parts on the right have similar specifications to 23LC512T-I/ST.
  • Image
    Part Number
    Manufacturer
    Factory Lead Time
    Mounting Type
    Package / Case
    Surface Mount
    Operating Temperature
    Packaging
    Published
    JESD-609 Code
    Part Status
    Moisture Sensitivity Level (MSL)
    Number of Terminations
    Terminal Finish
    Technology
    Voltage - Supply
    Terminal Position
    Peak Reflow Temperature (Cel)
    Number of Functions
    Supply Voltage
    Terminal Pitch
    Reflow Temperature-Max (s)
    Base Part Number
    JESD-30 Code
    Qualification Status
    Supply Voltage-Max (Vsup)
    Power Supplies
    Supply Voltage-Min (Vsup)
    Interface
    Memory Size
    Number of Ports
    Memory Type
    Operating Mode
    Clock Frequency
    Supply Current-Max
    Memory Format
    Memory Interface
    Organization
    Memory Width
    Standby Current-Max
    Memory Density
    Screening Level
    I/O Type
    Standby Voltage-Min
    Height Seated (Max)
    Length
    Width
    RoHS Status
    Mount
    Number of Pins
    Nominal Supply Current
    Access Time
    Address Bus Width
    Density
    Parallel/Serial
    Sync/Async
    Word Size
    ECCN Code
    Output Characteristics
    Output Enable
    Reverse Pinout
    Height
    Radiation Hardening
    REACH SVHC
    Supplier Device Package
    Max Operating Temperature
    Min Operating Temperature
    Frequency
    Max Supply Voltage
    Min Supply Voltage
    Max Frequency
    View Compare
  • 23LC512T-I/ST
    23LC512T-I/ST
    Microchip Technology
    5 Weeks
    Surface Mount
    8-TSSOP (0.173, 4.40mm Width)
    YES
    -40°C~85°C TA
    Tape & Reel (TR)
    2010
    e3
    Active
    1 (Unlimited)
    8
    Matte Tin (Sn) - annealed
    CMOS
    2.5V~5.5V
    DUAL
    260
    1
    5V
    0.65mm
    40
    23LC512
    R-PDSO-G8
    Not Qualified
    5.5V
    3/5V
    2.5V
    SPI, Serial
    512Kb 64K x 8
    1, (3 LINE)
    Volatile
    SYNCHRONOUS
    20MHz
    0.01mA
    SRAM
    SPI - Quad I/O
    64KX8
    8
    0.000004A
    524288 bit
    TS 16949
    SEPARATE
    2.5V
    1.2mm
    4.4mm
    3mm
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
  • 23LC512-E/P
    23LC512-E/P
    Microchip Technology
    20 Weeks
    Through Hole
    8-DIP (0.300, 7.62mm)
    -
    -40°C~125°C TA
    Tube
    2008
    e3
    Active
    1 (Unlimited)
    8
    Matte Tin (Sn) - annealed
    CMOS
    2.5V~5.5V
    DUAL
    NOT APPLICABLE
    1
    5V
    2.54mm
    NOT APPLICABLE
    23LC512
    -
    -
    5.5V
    -
    2.5V
    -
    512Kb 64K x 8
    1
    Volatile
    -
    16MHz
    -
    SRAM
    SPI - Quad I/O
    -
    8
    -
    -
    -
    -
    -
    5.334mm
    -
    -
    ROHS3 Compliant
    Through Hole
    8
    10mA
    32 ns
    16b
    512 kb
    SERIAL
    Synchronous
    8b
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    23LC512T-I/ST vs 23LC512-E/P
  • 23LC1024-I/ST
    23LC1024-I/ST
    Microchip Technology
    5 Weeks
    Surface Mount
    8-TSSOP (0.173, 4.40mm Width)
    YES
    -40°C~85°C TA
    Tube
    2008
    e3
    Active
    1 (Unlimited)
    8
    Matte Tin (Sn) - annealed
    CMOS
    2.5V~5.5V
    DUAL
    260
    1
    -
    0.65mm
    40
    23LC1024
    -
    -
    5.5V
    3/5V
    -
    SPI
    1Mb 128K x 8
    2
    Volatile
    -
    20MHz
    -
    SRAM
    SPI - Quad I/O
    -
    -
    -
    -
    -
    COMMON/SEPARATE
    -
    -
    3.1mm
    4.5mm
    ROHS3 Compliant
    -
    8
    10mA
    25 ns
    24b
    1 Mb
    SERIAL
    Synchronous
    8b
    EAR99
    3-STATE
    NO
    NO
    1.05mm
    No
    No SVHC
    -
    -
    -
    -
    -
    -
    -
    23LC512T-I/ST vs 23LC1024-I/ST
  • 23LCV512-E/ST
    23LCV512-E/ST
    Microchip Technology
    -
    Surface Mount
    8-TSSOP (0.173, 4.40mm Width)
    -
    -40°C~125°C TA
    Tube
    2012
    -
    Obsolete
    1 (Unlimited)
    -
    -
    NVSRAM (Non-Volatile SRAM)
    2.5V~5.5V
    -
    -
    -
    -
    -
    -
    23LCV512
    -
    -
    -
    -
    -
    SPI, Serial
    512Kb 64K x 8
    -
    Non-Volatile
    -
    20MHz
    -
    NVSRAM
    SPI - Dual I/O
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    ROHS3 Compliant
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    -
    8-TSSOP
    125°C
    -40°C
    20MHz
    5.5V
    2.5V
    20MHz
    23LC512T-I/ST vs 23LCV512-E/ST
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS
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