Altera 10AX090S4F45E3LG

10AX090S4F45E3LG Overview
The package or case of this electronic component is 1932-BBGA or FCBGA, which stands for Ball Grid Array and Flip Chip Ball Grid Array respectively. This package type allows for a high number of input/output connections, making it suitable for complex integrated circuits. The component is also surface mountable, meaning it can be directly mounted onto a printed circuit board. It is packaged in a tray, which provides protection during transportation and storage. The Moisture Sensitivity Level (MSL) of this component is 3, indicating that it can withstand a maximum of 168 hours in a high humidity environment. The voltage supply range is 0.87V to 0.93V, and the terminal form is BALL, indicating that it has spherical terminals for connection. The component operates at a supply voltage of 0.9V and has a high number of I/O connections, 624 to be precise. With a staggering 900000 logic elements/cells, this component is suitable for high-performance applications. The peak reflow temperature for this component is not specified, but it is designed to operate within a specific temperature range to ensure optimal performance.

10AX090S4F45E3LG Features
624 I/Os
Up to 59234304 RAM bits

10AX090S4F45E3LG Applications
There are a lot of Intel 10AX090S4F45E3LG FPGAs applications.

Random logic
Scientific Instruments
Enterprise networking
Medical Electronics
Industrial IoT
Software-defined radios
Voice recognition
Camera time adjustments
Telecommunication
Military Temperature