Infineon Technologies BGA735N16E6327XTSA1
- Part Number:
- BGA735N16E6327XTSA1
- Manufacturer:
- Infineon Technologies
- Ventron No:
- 7532977-BGA735N16E6327XTSA1
- Description:
- 16dB UMTS Tape & Reel (TR) 800MHz 900MHz 1.8GHz 1.9GHz 2.1GHz 3.6V P1dB:-6dBm 1.1dB Surface Mount
- Datasheet:
- BGA735N16E6327XTSA1
Infineon Technologies BGA735N16E6327XTSA1 technical specifications, attributes, parameters and parts with similar specifications to Infineon Technologies BGA735N16E6327XTSA1.
- Factory Lead Time6 Weeks
- Contact PlatingTin
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case16-XFQFN Exposed Pad
- Number of Pins16
- PackagingTape & Reel (TR)
- Published2010
- JESD-609 Codee3
- Part StatusNot For New Designs
- Moisture Sensitivity Level (MSL)1 (Unlimited)
- Number of Terminations16
- Max Operating Temperature85°C
- Min Operating Temperature-30°C
- Voltage - Supply3.6V
- Terminal PositionQUAD
- Number of Functions1
- Supply Voltage2.8V
- Terminal Pitch0.5mm
- Frequency800MHz 900MHz 1.8GHz 1.9GHz 2.1GHz
- Operating Supply Voltage2.8V
- Temperature GradeOTHER
- Number of Channels3
- Nominal Supply Current10mA
- Halogen FreeHalogen Free
- Gain16dB
- Telecom IC TypeTELECOM CIRCUIT
- RF TypeUMTS
- Noise Figure1.1dB
- P1dB-6dBm
- Height Seated (Max)0.4mm
- Radiation HardeningNo
- RoHS StatusROHS3 Compliant
- Lead FreeLead Free
BGA735N16E6327XTSA1 Overview
Input RF type UMTS of the RF amplifier.High reliability is achieved using advanced RF Amp' packaging Tape & Reel (TR).Shipping overseas is convenient thanks to the RF power Amplifier's packaging in 16-XFQFN Exposed Pad.The mount Amplifiers RF should be done in the direction of Surface Mount.It is possible to supply 3.6V volts to the Amplifiers RF.16 pins are on the high power RF Amplifier.Overall, the RF Amplifier contains 1 function(s).16 terminations with various functions.At a temperature around 85°C degrees Celsius, RF power Amplifier shouldbe running.
BGA735N16E6327XTSA1 Features
RF Type UMTS
3.6V voltage
16 pins
BGA735N16E6327XTSA1 Applications
There are a lot of Infineon Technologies
BGA735N16E6327XTSA1 RF Amplifiers applications.
Avionics
GPS
GLONASS
BeiDou
Galileo
Wireless communications
ISM applications
Wireless infrastructure
Automated test equipment
RF/IF gain control
Input RF type UMTS of the RF amplifier.High reliability is achieved using advanced RF Amp' packaging Tape & Reel (TR).Shipping overseas is convenient thanks to the RF power Amplifier's packaging in 16-XFQFN Exposed Pad.The mount Amplifiers RF should be done in the direction of Surface Mount.It is possible to supply 3.6V volts to the Amplifiers RF.16 pins are on the high power RF Amplifier.Overall, the RF Amplifier contains 1 function(s).16 terminations with various functions.At a temperature around 85°C degrees Celsius, RF power Amplifier shouldbe running.
BGA735N16E6327XTSA1 Features
RF Type UMTS
3.6V voltage
16 pins
BGA735N16E6327XTSA1 Applications
There are a lot of Infineon Technologies
BGA735N16E6327XTSA1 RF Amplifiers applications.
Avionics
GPS
GLONASS
BeiDou
Galileo
Wireless communications
ISM applications
Wireless infrastructure
Automated test equipment
RF/IF gain control
BGA735N16E6327XTSA1 More Descriptions
RF Amp Chip Triple General Purpose Amplifier 2.62GHz 3V 16-Pin TSNP EP T/R
The BGA735N16 is a highly flexible, high linearity tri-band (2600/2300/2100, 1900/1800, 900/800/700MHz) low noise amplifier MMIC for worldwide use, TSNP-16-1, RoHSInfineon SCT
The BGA735N16 is a highly flexible, high linearity tri-band (2600/2300/2100, 1900/1800, 900/800/700 MHz) low noise amplifier MMIC for worldwide use. Based on Infineons proprietary and cost-effective SiGe:C technology, the BGA735N16 uses an advanced biasing concept in order to achieve high linearity. The device features dynamic gain control, temperature stabilization, standby mode, and 2 kV ESD protection onchip as well as matching off chip. Because the matching is off chip, different LTE/UMTS bands can be easily applied. For example, the 1900 MHz path can be converted into a 2100 MHz path and vice versa by optimizing the input and output matching network. | Summary of Features: Gain: 16 (17) / -7.5 dB in high / low gain mode (all bands); Noise figure: 1.1 / 1.1 / 1.1 dB in high gain mode(800 MHz / 1900 MHz / 2100 MHz); Supply current: 3.4 (4.0) / 0.65 mA in high / low gain mode (all bands); Standby mode (< 2 A typ.); Output internally matched to 50 ; Inputs pre-matched to 50 ; 2kV HBM ESD protection; Low external component count; Small leadless TSNP-16-1 package (2.3 x 2.3 x 0.39 mm); Pb-free (RoHS compliant) package | Target Applications: LNA for LTE and 3G systems
The BGA735N16 is a highly flexible, high linearity tri-band (2600/2300/2100, 1900/1800, 900/800/700MHz) low noise amplifier MMIC for worldwide use, TSNP-16-1, RoHSInfineon SCT
The BGA735N16 is a highly flexible, high linearity tri-band (2600/2300/2100, 1900/1800, 900/800/700 MHz) low noise amplifier MMIC for worldwide use. Based on Infineons proprietary and cost-effective SiGe:C technology, the BGA735N16 uses an advanced biasing concept in order to achieve high linearity. The device features dynamic gain control, temperature stabilization, standby mode, and 2 kV ESD protection onchip as well as matching off chip. Because the matching is off chip, different LTE/UMTS bands can be easily applied. For example, the 1900 MHz path can be converted into a 2100 MHz path and vice versa by optimizing the input and output matching network. | Summary of Features: Gain: 16 (17) / -7.5 dB in high / low gain mode (all bands); Noise figure: 1.1 / 1.1 / 1.1 dB in high gain mode(800 MHz / 1900 MHz / 2100 MHz); Supply current: 3.4 (4.0) / 0.65 mA in high / low gain mode (all bands); Standby mode (< 2 A typ.); Output internally matched to 50 ; Inputs pre-matched to 50 ; 2kV HBM ESD protection; Low external component count; Small leadless TSNP-16-1 package (2.3 x 2.3 x 0.39 mm); Pb-free (RoHS compliant) package | Target Applications: LNA for LTE and 3G systems
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