Exar Corporation XRT86VX38IB329-F

XRT86VX38IB329-F Overview
The Mount surface mount technology has become increasingly popular in electronic packaging, making it a preferred choice for many manufacturers. One such example is the FBGA package or case, which stands for Fine-pitch Ball Grid Array. This type of package offers a compact and efficient solution for housing electronic components, with the FBGA in particular having a total of 329 pins. These components can operate within a wide range of temperatures, with a minimum operating temperature of -40°C and a maximum of 85°C. The operating supply voltage for this package is 3.3V, with a minimum supply voltage of 3.135V. With a data rate of 2.048 Mbps and 8 transceivers, this package is capable of handling high-speed data transmission. Furthermore, it is also RoHS compliant, ensuring that it meets the strict environmental standards set by the European Union.

XRT86VX38IB329-F Features
Available in the FBGA package
Operating supply voltage of 3.3V
8 transceivers

XRT86VX38IB329-F Applications
There are a lot of Exar Corporation XRT86VX38IB329-F Telecom applications.

Switches
Router
Cross Connects
PCM channel bank
DECT (Digital European Cordless Telephone) Base
ISDN Primary Rate Interfaces (PRA)
E1 Multiplexer
ATM Switches
Cable Telephony
Routers