XPC8255ZUIFBC

NXP USA Inc. XPC8255ZUIFBC

Part Number:
XPC8255ZUIFBC
Manufacturer:
NXP USA Inc.
Ventron No:
3666551-XPC8255ZUIFBC
Description:
IC MPU MPC82XX 200MHZ 408TBGA
ECAD Model:
Datasheet:
XPC8255ZUIFBC

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Specifications
NXP USA Inc. XPC8255ZUIFBC technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. XPC8255ZUIFBC.
  • Package / Case
    480-LBGA Exposed Pad
  • Surface Mount
    YES
  • Operating Temperature
    0°C~105°C TA
  • Packaging
    Tray
  • Published
    2004
  • Series
    MPC82xx
  • JESD-609 Code
    e0
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    480
  • ECCN Code
    5A991
  • Terminal Finish
    TIN LEAD
  • HTS Code
    8542.31.00.01
  • Technology
    CMOS
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    220
  • Supply Voltage
    1.8V
  • Terminal Pitch
    1.27mm
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    PC8255
  • JESD-30 Code
    S-PBGA-B480
  • Supply Voltage-Max (Vsup)
    1.9V
  • Supply Voltage-Min (Vsup)
    1.7V
  • Speed
    200MHz
  • uPs/uCs/Peripheral ICs Type
    MICROPROCESSOR, RISC
  • Core Processor
    PowerPC G2
  • Clock Frequency
    66.66MHz
  • Bit Size
    32
  • Address Bus Width
    32
  • Boundary Scan
    YES
  • Low Power Mode
    NO
  • External Data Bus Width
    64
  • Format
    FLOATING POINT
  • Integrated Cache
    YES
  • Voltage - I/O
    3.3V
  • Ethernet
    10/100Mbps (3)
  • Number of Cores/Bus Width
    1 Core 32-Bit
  • Graphics Acceleration
    No
  • RAM Controllers
    DRAM, SDRAM
  • Additional Interfaces
    I2C, SCC, SMC, SPI, UART, USART
  • Co-Processors/DSP
    Communications; RISC CPM
  • Height Seated (Max)
    1.65mm
  • Length
    37.5mm
  • RoHS Status
    Non-RoHS Compliant
Description
XPC8255ZUIFBC Overview
NXP USA Inc. is the brand of this part, which falls under the Embedded - Microprocessors category. This particular chip was published in 2004 and has a Moisture Sensitivity Level (MSL) of 3 (168 Hours). It has 480 terminations and an ECCN Code of 5A991. The technology used is CMOS, with a Peak Reflow Temperature (Cel) of 220. The format of this chip is FLOATING POINT and the Voltage - I/O is 3.3V. It also has an Ethernet speed of 10/100Mbps (3) and a maximum seated height of 1.65mm.

XPC8255ZUIFBC Features
PowerPC G2 Core
32-Bit Structure

XPC8255ZUIFBC Applications
There are a lot of NXP USA Inc. XPC8255ZUIFBC Microprocessor applications.

DDC control
Temperature sensing and controlling devices
Current meter
Measurement and control field
Day to day life field
Digital set-top boxes
Hard drives
Vacuum cleaners
Communication-bluetooth, Wi-Fi, radio
PDAs, game consoles
XPC8255ZUIFBC More Descriptions
MPU PowerQUICC II MPC82xx Processor RISC 32-Bit 0.29um 200MHz 3.3V 480-Pin TBGA Tray
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 408-TBGA (37.5x37.5)
Microprocessor IC; Series:MPC8260; No. of Bits:32; Frequency Typ:133MHz; Cache Memory On Chip L1/L2:32KB; Interface:I2C,MII,SPI,TDM,UTOPIA; No. of I/O Pins:120; Supply Voltage Min:3.135V; Supply Voltage Max:3.465V ;RoHS Compliant: No
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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