NXP USA Inc. XPC8255ZUIFBC
- Part Number:
- XPC8255ZUIFBC
- Manufacturer:
- NXP USA Inc.
- Ventron No:
- 3666551-XPC8255ZUIFBC
- Description:
- IC MPU MPC82XX 200MHZ 408TBGA
- Datasheet:
- XPC8255ZUIFBC
NXP USA Inc. XPC8255ZUIFBC technical specifications, attributes, parameters and parts with similar specifications to NXP USA Inc. XPC8255ZUIFBC.
- Package / Case480-LBGA Exposed Pad
- Surface MountYES
- Operating Temperature0°C~105°C TA
- PackagingTray
- Published2004
- SeriesMPC82xx
- JESD-609 Codee0
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations480
- ECCN Code5A991
- Terminal FinishTIN LEAD
- HTS Code8542.31.00.01
- TechnologyCMOS
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)220
- Supply Voltage1.8V
- Terminal Pitch1.27mm
- Reflow Temperature-Max (s)30
- Base Part NumberPC8255
- JESD-30 CodeS-PBGA-B480
- Supply Voltage-Max (Vsup)1.9V
- Supply Voltage-Min (Vsup)1.7V
- Speed200MHz
- uPs/uCs/Peripheral ICs TypeMICROPROCESSOR, RISC
- Core ProcessorPowerPC G2
- Clock Frequency66.66MHz
- Bit Size32
- Address Bus Width32
- Boundary ScanYES
- Low Power ModeNO
- External Data Bus Width64
- FormatFLOATING POINT
- Integrated CacheYES
- Voltage - I/O3.3V
- Ethernet10/100Mbps (3)
- Number of Cores/Bus Width1 Core 32-Bit
- Graphics AccelerationNo
- RAM ControllersDRAM, SDRAM
- Additional InterfacesI2C, SCC, SMC, SPI, UART, USART
- Co-Processors/DSPCommunications; RISC CPM
- Height Seated (Max)1.65mm
- Length37.5mm
- RoHS StatusNon-RoHS Compliant
XPC8255ZUIFBC Overview
NXP USA Inc. is the brand of this part, which falls under the Embedded - Microprocessors category. This particular chip was published in 2004 and has a Moisture Sensitivity Level (MSL) of 3 (168 Hours). It has 480 terminations and an ECCN Code of 5A991. The technology used is CMOS, with a Peak Reflow Temperature (Cel) of 220. The format of this chip is FLOATING POINT and the Voltage - I/O is 3.3V. It also has an Ethernet speed of 10/100Mbps (3) and a maximum seated height of 1.65mm.
XPC8255ZUIFBC Features
PowerPC G2 Core
32-Bit Structure
XPC8255ZUIFBC Applications
There are a lot of NXP USA Inc. XPC8255ZUIFBC Microprocessor applications.
DDC control
Temperature sensing and controlling devices
Current meter
Measurement and control field
Day to day life field
Digital set-top boxes
Hard drives
Vacuum cleaners
Communication-bluetooth, Wi-Fi, radio
PDAs, game consoles
NXP USA Inc. is the brand of this part, which falls under the Embedded - Microprocessors category. This particular chip was published in 2004 and has a Moisture Sensitivity Level (MSL) of 3 (168 Hours). It has 480 terminations and an ECCN Code of 5A991. The technology used is CMOS, with a Peak Reflow Temperature (Cel) of 220. The format of this chip is FLOATING POINT and the Voltage - I/O is 3.3V. It also has an Ethernet speed of 10/100Mbps (3) and a maximum seated height of 1.65mm.
XPC8255ZUIFBC Features
PowerPC G2 Core
32-Bit Structure
XPC8255ZUIFBC Applications
There are a lot of NXP USA Inc. XPC8255ZUIFBC Microprocessor applications.
DDC control
Temperature sensing and controlling devices
Current meter
Measurement and control field
Day to day life field
Digital set-top boxes
Hard drives
Vacuum cleaners
Communication-bluetooth, Wi-Fi, radio
PDAs, game consoles
XPC8255ZUIFBC More Descriptions
MPU PowerQUICC II MPC82xx Processor RISC 32-Bit 0.29um 200MHz 3.3V 480-Pin TBGA Tray
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 408-TBGA (37.5x37.5)
Microprocessor IC; Series:MPC8260; No. of Bits:32; Frequency Typ:133MHz; Cache Memory On Chip L1/L2:32KB; Interface:I2C,MII,SPI,TDM,UTOPIA; No. of I/O Pins:120; Supply Voltage Min:3.135V; Supply Voltage Max:3.465V ;RoHS Compliant: No
PowerPC G2 Microprocessor IC MPC82xx 1 Core, 32-Bit 200MHz 408-TBGA (37.5x37.5)
Microprocessor IC; Series:MPC8260; No. of Bits:32; Frequency Typ:133MHz; Cache Memory On Chip L1/L2:32KB; Interface:I2C,MII,SPI,TDM,UTOPIA; No. of I/O Pins:120; Supply Voltage Min:3.135V; Supply Voltage Max:3.465V ;RoHS Compliant: No
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