Xilinx Inc. XCV600-4BG560C
- Part Number:
- XCV600-4BG560C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3638612-XCV600-4BG560C
- Description:
- IC FPGA 404 I/O 560MBGA
- Datasheet:
- Virtex 2.5 V
Xilinx Inc. XCV600-4BG560C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCV600-4BG560C.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case560-LBGA Exposed Pad, Metal
- Operating Temperature0°C~85°C TJ
- PackagingTray
- Published2000
- SeriesVirtex®
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations560
- ECCN CodeEAR99
- Terminal FinishTin/Lead (Sn63Pb37)
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply2.375V~2.625V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)225
- Supply Voltage2.5V
- Terminal Pitch1.27mm
- Reach Compliance Codenot_compliant
- Reflow Temperature-Max (s)30
- Base Part NumberXCV600
- Pin Count560
- JESD-30 CodeS-PBGA-B560
- Number of Outputs404
- Qualification StatusNot Qualified
- Power Supplies1.2/3.62.5V
- Number of I/O404
- RAM Size12kB
- Clock Frequency250MHz
- Number of Inputs404
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells15552
- Total RAM Bits98304
- Number of Gates661111
- Number of LABs/CLBs3456
- Combinatorial Delay of a CLB-Max0.8 ns
- Height Seated (Max)1.7mm
- Length42.5mm
- Width42.5mm
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XCV600-4BG560C Overview
The mount for this product is a surface mount, meaning it can be easily attached to a surface for use. The operating temperature range for this product is 0°C to 85°C, ensuring that it can function properly in a variety of environments. The peak reflow temperature, which is the maximum temperature the product can withstand during the manufacturing process, is 225°C. The terminal pitch, or the distance between the terminals, is 1.27mm. This product is not compliant with Reach regulations. It has a RAM size of 12kB, allowing for efficient data storage and retrieval. The maximum seated height of this product is 1.7mm, and it has a length and width of 42.5mm. Finally, this product is not RoHS compliant.
XCV600-4BG560C Features
404 I/Os
Up to 98304 RAM bits
XCV600-4BG560C Applications
There are a lot of Xilinx Inc. XCV600-4BG560C FPGAs applications.
Embedded Vision
Automotive advanced driver assistance systems (ADAS)
Medical imaging
Wired Communications
Server Applications
Artificial intelligence (AI)
Secure Communication
Computer hardware emulation
Automotive
Cryptography
The mount for this product is a surface mount, meaning it can be easily attached to a surface for use. The operating temperature range for this product is 0°C to 85°C, ensuring that it can function properly in a variety of environments. The peak reflow temperature, which is the maximum temperature the product can withstand during the manufacturing process, is 225°C. The terminal pitch, or the distance between the terminals, is 1.27mm. This product is not compliant with Reach regulations. It has a RAM size of 12kB, allowing for efficient data storage and retrieval. The maximum seated height of this product is 1.7mm, and it has a length and width of 42.5mm. Finally, this product is not RoHS compliant.
XCV600-4BG560C Features
404 I/Os
Up to 98304 RAM bits
XCV600-4BG560C Applications
There are a lot of Xilinx Inc. XCV600-4BG560C FPGAs applications.
Embedded Vision
Automotive advanced driver assistance systems (ADAS)
Medical imaging
Wired Communications
Server Applications
Artificial intelligence (AI)
Secure Communication
Computer hardware emulation
Automotive
Cryptography
XCV600-4BG560C More Descriptions
Field Programmable Gate Array, 3456 CLBs, 661111 Gates, 250MHz, CMOS, PBGA560
IC FPGA 404 I/O 560MBGA
IC FPGA 316 I/O 432MBGA
CAP CER 2200PF 100V X7R 0603
OEMs, CMs ONLY (NO BROKERS)
Contact for details
IC FPGA 404 I/O 560MBGA
IC FPGA 316 I/O 432MBGA
CAP CER 2200PF 100V X7R 0603
OEMs, CMs ONLY (NO BROKERS)
Contact for details
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