XCV600-4BG560C

Xilinx Inc. XCV600-4BG560C

Part Number:
XCV600-4BG560C
Manufacturer:
Xilinx Inc.
Ventron No:
3638612-XCV600-4BG560C
Description:
IC FPGA 404 I/O 560MBGA
ECAD Model:
Datasheet:
Virtex 2.5 V

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Specifications
Xilinx Inc. XCV600-4BG560C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCV600-4BG560C.
  • Mount
    Surface Mount
  • Mounting Type
    Surface Mount
  • Package / Case
    560-LBGA Exposed Pad, Metal
  • Operating Temperature
    0°C~85°C TJ
  • Packaging
    Tray
  • Published
    2000
  • Series
    Virtex®
  • JESD-609 Code
    e0
  • Pbfree Code
    no
  • Part Status
    Obsolete
  • Moisture Sensitivity Level (MSL)
    3 (168 Hours)
  • Number of Terminations
    560
  • ECCN Code
    EAR99
  • Terminal Finish
    Tin/Lead (Sn63Pb37)
  • HTS Code
    8542.39.00.01
  • Subcategory
    Field Programmable Gate Arrays
  • Technology
    CMOS
  • Voltage - Supply
    2.375V~2.625V
  • Terminal Position
    BOTTOM
  • Terminal Form
    BALL
  • Peak Reflow Temperature (Cel)
    225
  • Supply Voltage
    2.5V
  • Terminal Pitch
    1.27mm
  • Reach Compliance Code
    not_compliant
  • Reflow Temperature-Max (s)
    30
  • Base Part Number
    XCV600
  • Pin Count
    560
  • JESD-30 Code
    S-PBGA-B560
  • Number of Outputs
    404
  • Qualification Status
    Not Qualified
  • Power Supplies
    1.2/3.62.5V
  • Number of I/O
    404
  • RAM Size
    12kB
  • Clock Frequency
    250MHz
  • Number of Inputs
    404
  • Programmable Logic Type
    FIELD PROGRAMMABLE GATE ARRAY
  • Number of Logic Elements/Cells
    15552
  • Total RAM Bits
    98304
  • Number of Gates
    661111
  • Number of LABs/CLBs
    3456
  • Combinatorial Delay of a CLB-Max
    0.8 ns
  • Height Seated (Max)
    1.7mm
  • Length
    42.5mm
  • Width
    42.5mm
  • RoHS Status
    Non-RoHS Compliant
  • Lead Free
    Contains Lead
Description
XCV600-4BG560C Overview
The mount for this product is a surface mount, meaning it can be easily attached to a surface for use. The operating temperature range for this product is 0°C to 85°C, ensuring that it can function properly in a variety of environments. The peak reflow temperature, which is the maximum temperature the product can withstand during the manufacturing process, is 225°C. The terminal pitch, or the distance between the terminals, is 1.27mm. This product is not compliant with Reach regulations. It has a RAM size of 12kB, allowing for efficient data storage and retrieval. The maximum seated height of this product is 1.7mm, and it has a length and width of 42.5mm. Finally, this product is not RoHS compliant.

XCV600-4BG560C Features
404 I/Os
Up to 98304 RAM bits

XCV600-4BG560C Applications
There are a lot of Xilinx Inc. XCV600-4BG560C FPGAs applications.

Embedded Vision
Automotive advanced driver assistance systems (ADAS)
Medical imaging
Wired Communications
Server Applications
Artificial intelligence (AI)
Secure Communication
Computer hardware emulation
Automotive
Cryptography
XCV600-4BG560C More Descriptions
Field Programmable Gate Array, 3456 CLBs, 661111 Gates, 250MHz, CMOS, PBGA560
IC FPGA 404 I/O 560MBGA
IC FPGA 316 I/O 432MBGA
CAP CER 2200PF 100V X7R 0603
OEMs, CMs ONLY (NO BROKERS)
Contact for details
Certification
  • ISO 9001
  • ISO 13485
  • ISO 45001
  • ASA
  • ESD
  • DUNS
  • SMTA
  • ROHS

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