Xilinx Inc. XCV200E-6BG352C
- Part Number:
- XCV200E-6BG352C
- Manufacturer:
- Xilinx Inc.
- Ventron No:
- 3132448-XCV200E-6BG352C
- Description:
- IC FPGA 260 I/O 352MBGA
- Datasheet:
- Virtex-E 1.8V
Xilinx Inc. XCV200E-6BG352C technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCV200E-6BG352C.
- MountSurface Mount
- Mounting TypeSurface Mount
- Package / Case352-LBGA Exposed Pad, Metal
- Operating Temperature0°C~85°C TJ
- PackagingTray
- SeriesVirtex®-E
- Published2006
- JESD-609 Codee0
- Pbfree Codeno
- Part StatusObsolete
- Moisture Sensitivity Level (MSL)3 (168 Hours)
- Number of Terminations352
- ECCN Code3A991.D
- HTS Code8542.39.00.01
- SubcategoryField Programmable Gate Arrays
- TechnologyCMOS
- Voltage - Supply1.71V~1.89V
- Terminal PositionBOTTOM
- Terminal FormBALL
- Peak Reflow Temperature (Cel)225
- Supply Voltage1.8V
- Terminal Pitch1.27mm
- Time@Peak Reflow Temperature-Max (s)30
- Base Part NumberXCV200E
- Pin Count352
- JESD-30 CodeS-PBGA-B352
- Number of Outputs260
- Operating Supply Voltage1.8V
- Number of I/O260
- RAM Size14kB
- Clock Frequency357MHz
- Number of Inputs260
- Programmable Logic TypeFIELD PROGRAMMABLE GATE ARRAY
- Number of Logic Elements/Cells5292
- Total RAM Bits114688
- Number of Gates306393
- Number of LABs/CLBs1176
- Speed Grade6
- Combinatorial Delay of a CLB-Max0.47 ns
- Length35mm
- Height Seated (Max)1.7mm
- Width35mm
- Radiation HardeningNo
- RoHS StatusNon-RoHS Compliant
- Lead FreeContains Lead
XCV200E-6BG352C Overview
This package is included in the 352-LBGA Exposed Pad, Metal package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. 1.8V volts power it. The Field Programmable Gate Arrays family of FPGAs includes this part. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 1.71V~1.89V . An FPGA belonging to the Virtex®-E series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. With this device, you will be able to make use of 260 outputs. Using the Tray layout, this FPGA model can be contained in a very small amount of space. The total number of terminations is 352. This device is equipped with 114688 RAM bits in terms of its RAM si114688e. Parts related to this part can be found using its base part number XCV200E. During the configuration of this FPGA module, the RAM si14kBe reaches 14kB to ensure that the program runs normally. An array of 1176 LABs/CLBs is built into the FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.8V supply voltage, designers can take full advantage of its flexibility. Fpga semiconductor is made up of 306393 gates as fpga semiconductors basic building block. The device has a total of 352 pins on fpga semiconductor. A crystal oscillating at 357MHz is one of the most common components of this device.
XCV200E-6BG352C Features
260 I/Os
Up to 114688 RAM bits
XCV200E-6BG352C Applications
There are a lot of Xilinx Inc.
XCV200E-6BG352C FPGAs applications.
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
This package is included in the 352-LBGA Exposed Pad, Metal package and is available for purchase. In this kind of FPGA, FIELD PROGRAMMABLE GATE ARRAY is used. The I/Os are designed to facilitate a more coherent transfer of data. Logic elements/cells form the fundamental building block of a computer. 1.8V volts power it. The Field Programmable Gate Arrays family of FPGAs includes this part. Using a Surface Mount connector, you can mount this FPGA module on the development board. In order for it to operate, the supply voltage must be 1.71V~1.89V . An FPGA belonging to the Virtex®-E series is referred to as an FPGA. In order to ensure a safe and efficient operation, it is important to maintain a temperature within 0°C~85°C TJ at all times. With this device, you will be able to make use of 260 outputs. Using the Tray layout, this FPGA model can be contained in a very small amount of space. The total number of terminations is 352. This device is equipped with 114688 RAM bits in terms of its RAM si114688e. Parts related to this part can be found using its base part number XCV200E. During the configuration of this FPGA module, the RAM si14kBe reaches 14kB to ensure that the program runs normally. An array of 1176 LABs/CLBs is built into the FPGA. Fpga electronics is possible for this FPGA to perform as per fpga electronics s specifications as long as fpga electronics is mounted in Surface Mount direction. In the case of 1.8V supply voltage, designers can take full advantage of its flexibility. Fpga semiconductor is made up of 306393 gates as fpga semiconductors basic building block. The device has a total of 352 pins on fpga semiconductor. A crystal oscillating at 357MHz is one of the most common components of this device.
XCV200E-6BG352C Features
260 I/Os
Up to 114688 RAM bits
XCV200E-6BG352C Applications
There are a lot of Xilinx Inc.
XCV200E-6BG352C FPGAs applications.
ASIC prototyping
Medical imaging
Computer hardware emulation
Integrating multiple SPLDs
Voice recognition
Cryptography
Filtering and communication encoding
Aerospace and Defense
Medical Electronics
Audio
XCV200E-6BG352C More Descriptions
FPGA Virtex-E Family 63.504K Gates 5292 Cells 357MHz 0.18um (CMOS) Technology 1.8V 352-Pin BGA
Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 357MHz, 5292-Cell, CMOS, PBGA144
IC FPGA 260 I/O 352MBGA
IC FPGA 660 I/O 860FBGA
OEMs, CMs ONLY (NO BROKERS)
Contact for details
Field Programmable Gate Array, 1176 CLBs, 63504 Gates, 357MHz, 5292-Cell, CMOS, PBGA144
IC FPGA 260 I/O 352MBGA
IC FPGA 660 I/O 860FBGA
OEMs, CMs ONLY (NO BROKERS)
Contact for details
Popular Search Part Number
Related Keywords
Search Tags
Latest News
-
21 November 2023
AD9361 RF Transceiver Manufacturer, Features, Structure and Working Principle
Ⅰ. Overview of AD9361 RF transceiverⅡ. Manufacturer of AD9361 RF transceiverⅢ. Block diagram of AD9361 RF transceiverⅣ. Structure and working principle of AD9361 RF transceiverⅤ. Features of AD9361... -
22 November 2023
ULN2804A Transistor Array Equivalents, Symbol, Working Principle and More
Ⅰ. Overview of ULN2804AⅡ. Symbol, footprint and pin configuration of ULN2804AⅢ. Manufacturer of ULN2804AⅣ. Features of ULN2804AⅤ. Technical parameters of ULN2804AⅥ. Working principle of ULN2804AⅦ. Applications of ULN2804AⅧ.... -
22 November 2023
An Overview of 74HC373 Octal Transparent D Type Latch
Ⅰ. Overview of 74HC373Ⅱ. Manufacturer of 74HC373Ⅲ. Pin configuration and functions of 74HC373Ⅳ. What are the features of 74HC373?Ⅴ. Technical parameters of 74HC373Ⅵ. What are the applications of... -
23 November 2023
OP07 Operational Amplifier Features, Pin Configuration and Application Scenarios
Ⅰ. Overview of OP07 operational amplifierⅡ. Features of OP07 operational amplifierⅢ. OP07 symbol, footprint and pin configurationⅣ. Working principle of OP07 operational amplifierⅤ. Differential amplifier circuit of OP07Ⅵ....
Help you to save your cost and time.
Reliable package for your goods.
Fast Reliable Delivery to save time.
Quality premium after-sale service.