Xilinx Inc. XCR3512XL-10FGG324I

Name: XCR3512XL-10FGG324I
Brand: Xilinx Inc.
SKU: 3631609-XCR3512XL-10FGG324I
Availability: InStock
Rating: 5 (1 reviews)

Part Number:: XCR3512XL-10FGG324I

Manufacturer:: Xilinx Inc.

Ventron No:: 3631609-XCR3512XL-10FGG324I

Description:: IC CPLD 512MC 9NS 324BGA

ECAD Model:

Datasheet:: XCR3512XL-10FGG324I

Specifications

Xilinx Inc. XCR3512XL-10FGG324I technical specifications, attributes, parameters and parts with similar specifications to Xilinx Inc. XCR3512XL-10FGG324I.

Factory Lead Time
11 Weeks
Mount
Surface Mount
Mounting Type
Surface Mount
Package / Case
324-BBGA
Number of Pins
324
Operating Temperature
-40°C~85°C TA
Packaging
Tray
Published
1996
Series
CoolRunner XPLA3
JESD-609 Code
e1
Pbfree Code
yes
Part Status
Active
Moisture Sensitivity Level (MSL)
3 (168 Hours)
Number of Terminations
324
ECCN Code
3A991.D
Terminal Finish
Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
Additional Feature
YES
HTS Code
8542.39.00.01
Subcategory
Programmable Logic Devices
Technology
CMOS
Terminal Position
BOTTOM
Terminal Form
BALL
Peak Reflow Temperature (Cel)
250
Supply Voltage
3.3V
Terminal Pitch
1mm
Reflow Temperature-Max (s)
30
Pin Count
324
Qualification Status
Not Qualified
Operating Supply Voltage
3.3V
Supply Voltage-Max (Vsup)
3.6V
Programmable Type
In System Programmable (min 1K program/erase cycles)
Number of I/O
260
Memory Type
EEPROM
Propagation Delay
10 ns
Number of Logic Elements/Cells
32
Number of Gates
12000
Max Frequency
97MHz
Speed Grade
10
Output Function
MACROCELL
Number of Macro Cells
512
JTAG BST
YES
Voltage Supply - Internal
2.7V~3.6V
Delay Time tpd(1) Max
9ns
Height Seated (Max)
2.5mm
Length
23mm
Width
23mm
RoHS Status
ROHS3 Compliant

Description

XCR3512XL-10FGG324I Overview
The 324-BBGA package/case is used for the component. It is packaged in a tray. The component has 324 terminations. The maximum reflow temperature for soldering the component is 30 seconds. The maximum supply voltage for the component is 3.6V. The propagation delay of the component is 10 ns. The maximum frequency at which the component can operate is 97 MHz. The component supports JTAG Boundary Scan Testing. The internal voltage supply for the component ranges from 2.7V to 3.6V. The maximum delay time for the component is 9 ns.

XCR3512XL-10FGG324I Features
324-BBGA package
260 I/Os
The operating temperature of -40°C~85°C TA
324 pin count
324 pins

XCR3512XL-10FGG324I Applications
There are a lot of Xilinx Inc. XCR3512XL-10FGG324I CPLDs applications.

Field programmable gate
Address decoders
Storage Cards and Storage Racks
TIMERS/COUNTERS
Configurable Addressing of I/O Boards
ON-CHIP OSCILLATOR CIRCUIT
Custom state machines
Network Interface Card (NIC) and Host Bus Adapter (HBA)
DDC INTERFACE
Digital designs

XCR3512XL-10FGG324I More Descriptions

CPLD CoolRunner XPLA3 Family 12K Gates 512 Macro Cells 97MHz 0.35um (CMOS) Technology 3.3V 324-Pin F-BGA
BGA-324 Programmable Logic Device (CPLDs/FPGAs) ROHS
EE PLD, 10ns, 512-Cell, CMOS, PQFP208
CPLD - Complex Programmable Logic Devices

Certification